摘要
应用电化学反应原理和配位场理论,对以硫代硫酸钠和碳酸氢铵组成的蚀刻溶液的铜表面化学蚀刻原理进行了分析,认为:铜被硫代硫酸钠氧化为铜离子,铜离子与碳酸氢铵提供的氨分子迅速形成稳定的铜氨络离子。研究了各组分浓度、温度对蚀刻速率的影响作用,并进行了蚀刻溶液对钢设备的腐蚀性能研究。结果表明:随着溶液中硫代硫酸钠和碳酸氢铵浓度的增加,蚀刻速率增大,而碳酸氢铵的浓度受硫代硫酸钠浓度的限制,蚀刻溶液对钢设备没有腐蚀作用。
According to electrochemical reaction theory and ligand field theory, it is analyzed that the principle of brass chemistry etching which the etching solution is composed of sodium thiosulfate and sodium bicarbonate. The result shows copper is oxidized to copper ion by sodium thiosulfate, copper ion reacts with ammonia, which is produced by sodium bicarbonate, to complex ion. By means of chemical reaction tests,meanwhile studied the effect factors of composition concentration and temperature of the etching solution on etching rate. The corrosion of steel equipment by the etching solution is also studied. The experimental results indicate that the etching rate increases with the concentration of sodium thiosulfate and sodium bicarbonate, and the concentration of sodium bicarbonate depends on the concentration of sodium thiosulfate, the solution doesn't corrode steel equipment.
出处
《应用化工》
CAS
CSCD
2005年第5期277-279,共3页
Applied Chemical Industry
关键词
铜
硫代硫酸钠
化学蚀刻
brass
sodium thiosulfate
chemistry etching
