摘要
分析了倒装芯片技术在光电子器件封装中应用时对基板和焊料的性能要求,在硅基板上设计和制作了用于激光芯片和光电探测器贴片的焊料凸点结构,并应用全自动贴片设备进行了贴片工艺试验.试验结果表明,倒装芯片技术可实现芯片与基板的高精度、高可靠性的互连,这种技术用于光收发器件的封装,可实现光电子器件的小型化和批量化生产,并能大大提高光收发模块的传输速率.
The requirements for the substrate and the solder are analyzed in the flip_chip technology used in photoelectronics device packaging. The solder pump structure for the flip chip bonding of the laser diode and the photoelectric detector are designed and fabricated in the silicon substrate, and the die bonding tests are implemented by using the automatic die bonder. The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The technology used in the photoelectric device can realize miniaturization and batch production of optical devices, and can highly improve the transmitting speed of the optical transceiver modules.
出处
《河南理工大学学报（自然科学版）》
CAS
2005年第1期50-54,共5页
Journal of Henan Polytechnic University（Natural Science）
基金
国家863计划项目(2002AA312280).
