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立体有序的耐高温全苯基有机硅树脂 被引量:8

High- temperature Resistant Stereo-regular Homo-phenyl Organosilicone Resin
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摘要 三氯硅烷的水解物经催化重排,制得了立体有序的全苯基有机硅树脂.以红外和核磁井振表征了其化学组成,以x射线衍射初步分析了其立体有序性,以热重分析法等测定了其耐温世,发现该树脂550℃时失重为2.379%。600℃时失重为5.105%,在有机硅树脂中尚未见耐温更高的报道。 Stereo-regular homo-phenyl organosilicone resin was prepared by means of catalytic rearrangementof hydrolysis product of phenyltrichlorosliane(PhSiCl_3).The chemical composition of the resin was charac-terized by means of IR and 1 ̄H-NMR. The stereo- regularity was analyzed by means of X- rdy,and theheat- resistant property was determined by means of TGA.It was found the weight loss was 2.379%at550℃and 5.105% at 600℃
出处 《有机硅材料及应用》 1994年第5期8-11,共4页
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