摘要
本文介绍用光弹性贴片法测试正交各向异性单向板混合型应力强度因子K_Ⅰ、K_Ⅱ值.光弹薄片可直接粘贴于工程构件,试验表明:此法可作为对复合材料进行光弹性断裂分析的工程应用近似方法.
A method of determination of mixed mode stress intensity factors KⅠ and KⅡ for orthotropic single direction plate by photoelastic coating is introduced. The coating can be bonded to components of engineering structures directly. It is proved by experiments that this method can be proposed as an approach to analyze cracks for composite materials in engineering practice.
出处
《太原重型机械学院学报》
1989年第1期37-44,共8页
Journal of Taiyuan Heavy Machinery Institute
关键词
光弹贴片
复合材料
应力测定
mixed mode
stress intensity factors
orthotropic photoelastic coating
