摘要
介绍ＣＣＤ测量微小位移的一种新方法。这种方法测位移不受待测物体表面状况的影响，分辨率和测量范围可调，适宜测量象金属丝的受力伸长及受热膨胀之类的微小位移，比ＣＣＤ测位移的传统方法优越。
The article introduces a new method for measuring microdisplacement with CCD. It is not affected by the body surface,the resolution and measuring range. It is suitable to measure the microdisplacement such as expensions of metal wires when they are heated and forced, and the method is better than the traditional method for measuring microdisplacement with CCD.
出处
《光电工程》
CAS
CSCD
1994年第4期37-41,共5页
Opto-Electronic Engineering
关键词
位移测量
金属丝
热膨胀测量
电荷耦合器件
Displacement measurement, wire, Thermal expansion measurement, CCD.
