摘要
软木砖导热系数与容重间存在着一定的关系。20℃时,软木砖导热系数与容重间的关系,可用以下方程预测:K=0.1039ρ+0.02148式中,K——20℃时,软木砖导热系数(kcal/m·h·℃)ρ——软木砖绝干时容重(g/c·c)本方程适于0.096<ρ<0.22(g/c·c),当颗粒大小合理均匀一致时,平均和最大预测误差分别不超过6%和15%。
There is a certain relationship between thermal conductivity and density of corkboard.At 20℃,relationship between thermal conductivity and density of corkboard may be accurately predicted with following equat- ion: K=0.1039ρ+0.02148 where: K-At 20℃,thermal conductivity of eorkboard(kcal/m.h.℃). p-Density of corkboard at absolute dry(g/c.c.). The equation is applicable for 0.096<ρ<0.22(g/c.c).when particle size is reasonablely uniform,average and maximum prediction errors are not more than 6 % and 15% respectively.
出处
《陕西林业科技》
北大核心
1989年第2期48-52,共5页
Shaanxi Forest Science and Technology
