摘要
通过实验定性、定量地分析了温度变化时对晶片换能效率、仪器性能、耦合效果的影响,以及它们对低温下超声探伤定位、定量和探伤可靠性的影响。进而提出了用补偿法、环境校正法和局部加热法来加以解决和改善,并比较了各种方法的优缺点和适用范围。
The influence of temperature variation on the energy transfer efficiency of the wafer, (apparatus) performance and coupling effect were studied qualitatively and quantitatively by (experiments). Then the effect of these influences on the reliability of the results obtained by ultrasonic inspection, including the location and size of the defects, are analysed. According to the results (obtained) above, methods of conpensation adjustment, (environmental) rectification and localized heating are proposed to improve the inspection. Also the (advantage) and disadvantage of these methods and their applicability are compared.
出处
《长春工业大学学报》
CAS
2004年第4期76-78,共3页
Journal of Changchun University of Technology
关键词
超声波探伤
修正方法
低温环境
ultrasonic inspection
rectification methods
low temperature environments.
