摘要
应用红外热成像技术对粘贴式电阻应变片的温度分布场进行测量,得到不同状况下应变片温度分布的实际值,增强了对应变片固有温度特性的认识,为其使用和改进提供了依据。
Measurements of the temperature distribution of strain gauges under different conditions were made with thermal imaging technique. A better understanding of its intrinsic temperature properties provides a basis for the future application and improvement of this material.
出处
《红外技术》
CSCD
1993年第6期34-36,共3页
Infrared Technology
关键词
应变片
红外热成像
温度分布
测量
Strain gauges
Thermal imaging
Temperature distribution measurement
