摘要
采用二次曝光和实时全息干涉技术对某-PCB进行了实验测试,获得了不同功率和不同夹持条件下PCB表面的离面位移分布以及离面位移随时间的动态变化图象。对两种不同的条纹图像进行处理,结果表明,随功率的增大,器件的离面翘曲量增大;在不同夹持条件下,由于器件局部受力约束和热传导条件的差异,呈现不同的位移分布,电阻区(热源区)附近的离面翘曲量变化较快而且较大。
In this paper,double exposure holograms and real-time holographic Interferometry are applied to test a aviation apparatus.The results show that the out-of-plane displacement distributing and the full-motion video-images of the out-of-plane displacement under different power and fixing conditions,through deposing the two different pattern stripe,The results show that the out-of-plane displacement of PCB increase with the power increasing and the out-of-plane displacement distributing is different under the different fixing conditions and the conduction and restriction,the out-of-plane displacement if district of resistance vary quickly and larely.
出处
《电子与封装》
2003年第4期41-44,31,共5页
Electronics & Packaging
关键词
PCB
可靠性
全息干涉
PCB
Reliability
Holographic interferometry
