摘要
CSP技术是最近几年才发展起来的新型集成电路封装技术。应用CSP技术封装的产品封装密度高,性能好,体积小,重量轻,与表面安装技术兼容,因此它的发展速度相当快,现已成为集成电路重要的封装技术之一。目前已开发出多种类型CSP,品种多达100多种;另外,CSP产品的市场也是很大的,并且还在不断扩大。但是CSP技术、CSP产品市场是国外的或国外公司的。我们需要开发我们的CSP技术,当然,开发CSP技术难度比较大,需要的资金多,因此需要国内多个部门协作,以及国家投入较多的资金。
CSP is a new technology developed in the past few years. Because of its high packaging density, good electrical and / or mechanical properties, small volume, as well as its good compatibility with surface mount technology, CSP has now become one of the most important packaging technology at present time. Various kinds of CSP products have been developed, the types of them are estimated to be at least 100. In addition, the market of CSP product is very large and there is and will continue to be a strong demand for them. However, CSP is developed all by foreign corporation, we need develop our own intellectual property on CSP technology. It is quite evident that sufficient funds are needed and close corporation among different department is also indispensable.
出处
《电子与封装》
2003年第4期14-19,共6页
Electronics & Packaging
