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电场对带电颗粒在电连接器表面沉积过程的影响

The Effect of Electric Field on the Deposition of Charged Particles on the Electric Contact Surfaces
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摘要 基于尘土颗粒周围电场与其在电接触表面沉积的密切联系导致电接触可靠性下降甚至接触故障,分析了电连接器自身及外加电场对尘土颗粒运动产生影响的过程和机理,提出了衡量电连接器对颗粒吸引能力的判据和计算方法。仿真实验表明,该吸引能力与电连接器两端电压和距离有关,颗粒运动趋势与其进入电场时间有关,而与其所带电荷极性无关。 Based on close relation between electric field around dust particles and their deposition on electric contact surface,which results in contact reliability decline and contact fault,the process and principle,which electric connector itself and external electric fields influence the motion of particles,were analyzed.The criterion and calculation method to evaluate connector attracting particles were proposed.Simulation test shows that the attracting ability is relative to two terminals voltage and distance of...
作者 殷晔 许良军
机构地区 北京邮电大学
出处 《低压电器》 北大核心 2008年第13期8-12,共5页 Low Voltage Apparatus
关键词 电接触 颗粒 沉积 电场 electric contact particle deposition electric field
分类号 TM503.5 [电气工程—电器]
  • 相关文献

参考文献6

  • 1[1]REAGOR BT,RUSSELL C A.A Survey of Manufacturing Problems in Telecommunications equipment[C]//Proc IC-CEMCA Nagoya,Japan,1986:843-850.
  • 2[2]WHITE L.Development of a New Connector Dust Test[C]//Proc of 33rd IEEE Holm Conference on Electrical Contact,USA,CPMT Society of IEEE Inc,1987,87-92.
  • 3[3]ZHANG J G.Characteristics of Dust Deposition and the Efiect of Dust on Electric contacts[C]//Proc ICCEM-CA Nagoya,Japan,1986.878-881.
  • 4[4]ZHANG J G,WEN X M.The Effect of Dust Contamination on Electric Contacts[J].IEEE Trans on Compon Hybrids Manuf Technol,1986,9(1):53-58.
  • 5高锦春,孟青山,冯萃峰,贺占平,章继高.尘土颗粒带电对电接触故障的影响[J].低压电器,2004(1):8-12. 被引量：6
  • 6李庆扬 王能超 等.数值分析[M].武汉:华中理工大学出版社,1999.4.

二级参考文献10

  • 1许德玄,李祥生,马祝阳,倪晓明,肖青.密立根油滴仪测量粉尘荷电量的探讨[J].物理实验,1993,13(3):134-135. 被引量：6
  • 2Reagor B T, Russell C A. A survey of manufacturing problems in telecommunications equipment [ A ]. Proc IC-CEMCA [ C ]. Nagoya, Japan, 1986. 843-850.
  • 3White L. Development of a new connector dust test[ A ]. Proc of 33 rd IEEE Holm Conference on Electrical Contact [ C ]. USA: CPMT Society of IEEE Inc,1987.87-92.
  • 4Zhang J G, Characteristics of dust deposition and the effect of dust on electric contacts [ A ]. Proc IC-CEMCA[ C ]. Nagoya,Japan, 1986. 878-881.
  • 5Zhang J G, Wen X M. The effect of dust contamination on electric contacts [ J ]. IEEE Trans on Compon Hybrids Manuf Technol, 1986,9( 1 ) :53-58.
  • 6Zhang J G. Internal report[ R]. Beijing:Beijing Univ of Posts and Telecom, 1990.
  • 7Zhang J G, Zhuo K D, Du C X. The porosity of gold plating by dust contamination [ A ]. Proc of 34 rd IEEE Holm Conference on Electrical Contact [ C ].USA : CPMT Society of IEEE Inc, 1988.310-319.
  • 8Gao J C, Zhang J G. Measurement of electrical charges carried by dust particles [ A ]. Proc of 48 rd IEEE Holm Conference on Electrical Contact [ C ]. USA:CPMT Society of IEEE Inc,2002. 191-196.
  • 9Liang Y N, Zhang J G, Liu J J. Identification of inorganic compounds in dust collected in Beijing and their effects on electric contacts [ A ]. Proc of 43 rd IEEE Holm Conference on Electrical Contact [ C ].USA : CPMT Society of IEEE Inc, 1997. 315-327.
  • 10Zhang J G, Liang Y N, Wan J W, et al. Analysis of organic compounds in airborne dust collected in Beijing[ A]. Proc of 44rd IEEE Holm Conference on Electrical Contact [ C ]. USA : CPMT Society of IEEE Inc, 1998. 166-177.

共引文献10

低压电器
2008年 第13期

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