摘要
在高速PCB产品的加工过程中,整体对位控制非常重要,其中基板层间对位是整个对位系统的基础.现行基板层间对位能力为≤30 μm,随着高速产品信号传输要求的提升,其整体对位要求逐渐从127 μm提升到100 μm,现有层间对位能力已不能满足产品整体对位需求,亟待提升.经过对位系统的分解与梳理,基板层间对位能力要求从≤30 μm提升到≤15 μm.文章针对基板层间对位过程控制进行研究,找出关键因子,从而提升基板层间对位能力.
In the process of high speed PCB products processing,the overall alignment control is very important,and the core board counterpoint between layers is the basis for the rest of the registration system.The current para ability is less than 30 Um.As the growing requirement of high speed signal transmission products,the whole registration requirements gradually develop from 5 mil to 4 mil.Existing inter-layer para ability cannot meet the demand of product overall matchups and is to be promoted.After registration system decomposition and comb,the core board counterpoint ability between layers requests from 30μm to 1 5μm.Based on the core board counterpoint process control studied,the paper finds out the key factors,thus to improve the core board counterpoint ability between the layers.
作者
唐昌胜
刘齐锐
TANG Chang-sheng;LIU Qi-rui
出处
《印制电路信息》
2017年第A02期52-61,共10页
Printed Circuit Information
关键词
高速
对位
能力
过程控制
提升
High Speed
Counterpoint
Ability
Process
Control
Improving
