摘要
传统单张挠性芯板刚挠板的制作方法受PP片溢胶影响,采用低流动PP片一次压合工艺板面会存在凹凸不平树脂塞孔打磨困难;先采用低流动PP片压合后用流动PP片二次压合工艺可以有效解决板面不平整树脂打磨困难问题,但二次压合工艺层间对准度差、低流动PP材料成本高、工艺复杂不适批量生产。相比传统工艺,采用流动PP片进行一次压合工艺制作的方法,通过特制的PI垫片技术进行阻胶,不仅可以阻挠性芯板内层铜厚18、35μm条件下的PP溢胶,甚至可以阻挠性芯板内层铜厚是70、105μm条件下的PP溢胶。该方法可靠性能稳定,良率高,效率快,是一种具有竞争力的批产制作工艺。
The traditional manufacturing method of rigid-flex board with single flexible core is affected by the overflow of prepreg,and it is difficult to polish the uneven resin plug hole when using the one-time pressing process of low flowing prepreg.The secondary pressing process of low flowing prepreg followed by flowing prepreg can effectively solve the problem of uneven resin grinding,but the secondary pressing process has poor inter layer alignment,high cost of low flowing prepreg material,and complex process,which is unsuitable for batch production.Compared with the traditional process,the flow prepreg is made by one-time pressing process,and the special PI gasket technology is used to resist the adhesive,which can not only prevent the adhesive overflow of prepreg when the copper thickness of the inner layer of the resistant core plate is 18 and 35 mm,but also prevent the adhesive overflow of prepreg when the copper thickness of the inner layer of the resistant core plate is 70 and 105 mm.This method is not only reliable and stable,but also has high yield and high efficiency.It is a competitive batch production process.
作者
李冲
黎钦源
彭镜辉
何栋
靳文凯
Li Chong;LI Qinyuan;Peng Jinghui;He Dong;Jin Wenkai
出处
《印制电路信息》
2023年第S01期306-310,共5页
Printed Circuit Information
关键词
单张挠性
阻胶
刚挠板
PI垫片
流动半固化片
Single Sheet Flexible
Adhesive Resistant
Rigid-Flex Board
PI Gasket
Flow Prepreg
