In this paper,the need for functional safety in automotive Ethernet is investigated.For this the ISO26262 standard is used but also a comparison with legacy IVN(in-vehicle-networking)is made.In addition,an outlook of ...In this paper,the need for functional safety in automotive Ethernet is investigated.For this the ISO26262 standard is used but also a comparison with legacy IVN(in-vehicle-networking)is made.In addition,an outlook of future automotive networks is considered and investigated if this brings a further need for safety in automotive Ethernet.From these efforts,it was found that there are several drivers for safety in automotive Ethernet that especially hold for switches.展开更多
One of the biggest challenges in microscale additive manufacturing is the production of three-dimensional,microscale metal parts with a high enough throughput to be relevant for commercial applications.This paper pres...One of the biggest challenges in microscale additive manufacturing is the production of three-dimensional,microscale metal parts with a high enough throughput to be relevant for commercial applications.This paper presents a new microscale additive manufacturing process called microscale selective laser sintering(μ-SLS)that can produce true 3D metal parts with sub-5μm resolution and a throughput of greater than 60mm^(3)/hour.Inμ-SLS,a layer of metal nanoparticle ink is first coated onto a substrate using a slot die coating system.The ink is then dried to produce a uniform nanoparticle layer.Next,the substrate is precisely positioned under an optical subsystem using a set of coarse and fine nanopositioning stages.In the optical subsystem,laser light that has been patterned using a digital micromirror array is used to heat and sinter the nanoparticles into the desired patterns.This set of steps is then repeated to build up each layer of the 3D part in theμ-SLS system.Overall,this new technology offers the potential to overcome many of the current limitations in microscale additive manufacturing of metals and become an important process in microelectronics packaging applications.展开更多
文摘城市噪声在不同程度上影响人们的日常生活。为了全面监测城市中的噪声,分析其时空分布特征及其类别,以便针对性实施治理,研发了一种基于公共移动载体上低成本综合监测终端与监测系统。城市噪声监测终端采用低成本开发板Sed Board为处理单元,采用i436噪声传感器,该开发板上有板载的主控芯片Zynq-7000 ALL Programmable SoC集成ARMCortex-A9双核以及最多可达500万多个逻辑门的可编程逻辑单元能够灵活地用于各种目标应用,采用其ALSA音频架构实现噪声数据采集,利用ZedBoard自带网口将音频数据传输到pc端,在pc端通过基于PyTorch框架的声谱分析算法,将采集的噪声识别为载体噪声、交通噪声、商业噪声、生活噪声3类主要噪声,测试集上分类准确率为98.2700%。
文摘In this paper,the need for functional safety in automotive Ethernet is investigated.For this the ISO26262 standard is used but also a comparison with legacy IVN(in-vehicle-networking)is made.In addition,an outlook of future automotive networks is considered and investigated if this brings a further need for safety in automotive Ethernet.From these efforts,it was found that there are several drivers for safety in automotive Ethernet that especially hold for switches.
基金This material is based upon work supported by the National Science Foundation under Grant No.1728313.
文摘One of the biggest challenges in microscale additive manufacturing is the production of three-dimensional,microscale metal parts with a high enough throughput to be relevant for commercial applications.This paper presents a new microscale additive manufacturing process called microscale selective laser sintering(μ-SLS)that can produce true 3D metal parts with sub-5μm resolution and a throughput of greater than 60mm^(3)/hour.Inμ-SLS,a layer of metal nanoparticle ink is first coated onto a substrate using a slot die coating system.The ink is then dried to produce a uniform nanoparticle layer.Next,the substrate is precisely positioned under an optical subsystem using a set of coarse and fine nanopositioning stages.In the optical subsystem,laser light that has been patterned using a digital micromirror array is used to heat and sinter the nanoparticles into the desired patterns.This set of steps is then repeated to build up each layer of the 3D part in theμ-SLS system.Overall,this new technology offers the potential to overcome many of the current limitations in microscale additive manufacturing of metals and become an important process in microelectronics packaging applications.
