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Fiber-reinforced origami electronics with high rigidity and flexibility for display applications
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作者 Dohyeon Gong Minji Kang +4 位作者 Suhyeon Hwang Junggwang Jo Insic Hong Yeonwook Roh Seungyong Han 《npj Flexible Electronics》 2025年第1期614-623,共10页
Origami structures provide functional advantages to rigid electronics through geometric transformations.However,the transformations involved in folding and deployment cause stress concentration on flexure hinges of or... Origami structures provide functional advantages to rigid electronics through geometric transformations.However,the transformations involved in folding and deployment cause stress concentration on flexure hinges of origami structure,triggering electronic malfunction.Here,we report origami electronics based on a fiber-reinforced electronic composite.A thin PEDOT:PSS-based electronic composite minimizes stress during folding without electrode damage.Nylon is embedded in this foldable composite and,despite being thin and flexible for folding,provides high tensile resistance to prevent plastic deformation and tearing under tension.This strategy enables the creation of flexure hinges for origami electronics that maintain mechanical and electrical stability under repeated transformations.Origami electronics that integrate the high-durability composite can be used in display applications supporting 25-fold compression with the Flasher origami structure and 2D-to-3D deployment with the Kresling origami structure.The ability of origami electronics to withstand bending and tensile stress enables shape-reconfigurable displays requiring repeated reconfiguration across multiple hinges. 展开更多
关键词 origami structuretriggering flexure hinges rigid electronics origami structures electronic malfunctionherewe fiber reinforced electronics high rigidity origami electronics
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Transient shuttle for a widespread neural probe with minimal perturbation
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作者 Yeonwook Roh Hyeongseok Kim +13 位作者 Eun-A Kim Kyungbin Ji Minji Kang Dohyeon Gong Sunghoon Im Insic Hong Jieun Park Soo Jung Park YiseulBae Jae-Il Park Je-Sung Koh Seungyong Han Eun Jeong Lee Daeshik Kang 《npj Flexible Electronics》 2024年第1期498-508,共11页
Bioelectronic implants in the deep brain provide the opportunity to monitor deep brain activity with potential applications in disease diagnostics and treatment.However,mechanical mismatch between a probe and brain ti... Bioelectronic implants in the deep brain provide the opportunity to monitor deep brain activity with potential applications in disease diagnostics and treatment.However,mechanical mismatch between a probe and brain tissue can cause surgical trauma in the brain and limit chronic probe-based monitoring,leading to performance degradation.Here,we report a transient shuttle-based probe consisting of a PVA and a mesh-type probe.A rigid shuttle based on PVA implants an ultrathin mesh probe in the target deep brain without a tangle,while creating both a sharp edge for facile penetration into the brain and an anti-friction layer between the probe and brain tissue through dissolving its surface.The capability to shuttle dissolved materials can exclude the retracted process of the shuttle in the brain.Complete dissolution of the shuttle provides a dramatic decrease(~1078-fold)in the stiffness of the probe,which can therefore chronically monitor a wide area of the brain.These results indicate the ability to use a simplistic design for implantation of wide and deep brain probes while preventing unnecessary damage to the brain and probe degradation during long-term use. 展开更多
关键词 SHUTTLE NEURAL IMPLANTATION
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