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Integrating Hard Silicon for High‑Performance Soft Electronics via Geometry Engineering
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作者 Lei Yan Zongguang Liu +1 位作者 Junzhuan Wang Linwei Yu 《Nano-Micro Letters》 2025年第9期290-336,共47页
Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine in... Soft electronics,which are designed to function under mechanical deformation(such as bending,stretching,and folding),have become essential in applications like wearable electronics,artificial skin,and brain-machine interfaces.Crystalline silicon is one of the most mature and reliable materials for high-performance electronics;however,its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics.Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials,such as transforming them into thin nanomembranes or nanowires.This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics,from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates,and ultimately to shaping silicon nanowires using vapor-liquid-solid or in-plane solid-liquid-solid techniques.We explore the latest developments in Si-based soft electronic devices,with applications in sensors,nanoprobes,robotics,and brain-machine interfaces.Finally,the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics. 展开更多
关键词 Soft electronics SILICON Geometry engineering Silicon nanowires
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Parallelization of intra prediction algorithm based on array processor 被引量:6
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作者 Zhu Yun Jiang Lin +2 位作者 Shi Pengfei Xie Xiaoyan Shen Xubang 《High Technology Letters》 EI CAS 2019年第1期74-80,共7页
For the characteristics of intra prediction algorithms, the data dependence and parallelism between intra prediction models are first analyzed. This paper proposes a parallelization method based on dynamic reconfigura... For the characteristics of intra prediction algorithms, the data dependence and parallelism between intra prediction models are first analyzed. This paper proposes a parallelization method based on dynamic reconfigurable array processors provided by the project team, and uses data level parallel(DLP) algorithms in multi-core units. The experimental results show that Y-component of peak signal to noise ratio(Y-PSNR) is improved about 10 dB and the time is saved 63% compared with high-efficiency video coding(HEVC) test model HM10.0. This method can effectively reduce codec time of the video and reduce computational complexity. 展开更多
关键词 high-efficiency video coding(HEVC) intra prediction parallelization mapping
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Reconfigurable implementation ARP based on depth threshold in 3D-HEVC 被引量:1
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作者 Zhu Yun Zhou Jinna +3 位作者 Xie Xiaoyan Jiang Lin Wang Shuxin Shen Xubang 《High Technology Letters》 EI CAS 2021年第4期365-372,共8页
Aiming at the high computational complexity and low efficiency of the advanced residual prediction(ARP)algorithm in 3 dimension high-efficiency video coding(3D-HEVC),the relationship between the depth value and ARP is... Aiming at the high computational complexity and low efficiency of the advanced residual prediction(ARP)algorithm in 3 dimension high-efficiency video coding(3D-HEVC),the relationship between the depth value and ARP is analyzed.A fast ARP algorithm based on the depth value is proposed,which is implemented on the reconfigurable array processor developed by the project team.It uses a reconfigurable method to realize flexible switching between interview-ARP and tem-poral ARP.Experimental results show that while keeping the coding rate and the peak signal-to-noise ratio(PSNR)basically unchanged,the coding time of the six test sequences is reduced by 16.21%on average compared with HTM16.1.In contrast with non-reconfiguration,the average coding time is reduced by 52%,so the computational efficiency is improved. 展开更多
关键词 3 dimension high-efficiency video coding(3D-HEVC) advanced residual prediction(ARP) reconfigurable method
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Study of New Way about Si/Si Bonding
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作者 刘玉岭 王新 +3 位作者 张文智 徐晓辉 张德臣 张志花 《Rare Metals》 SCIE EI CAS CSCD 2000年第4期290-296,共7页
A new set of technique was adopted in bonding Si-Si by using Ge (Ⅳ element),which is used as the substitute for the common hydrophilic method. The bond layer has no holes, and the edge bond-rate amounts to above 98%,... A new set of technique was adopted in bonding Si-Si by using Ge (Ⅳ element),which is used as the substitute for the common hydrophilic method. The bond layer has no holes, and the edge bond-rate amounts to above 98%, and the bond strength is above 2156 Pa. By doping the same kind of dopant with low-resistance in Ge, the stress compensation was realized. 展开更多
关键词 SI Ge Bonding mechanism
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Research on the influence of total dose on the short-circuit and avalanche characteristics of SiC MOSFET power devices
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作者 Miao Chen Lipei Zhang +2 位作者 Xinyu Sun Zan Li Chenglong Sui 《Advances in Engineering Innovation》 2024年第6期24-30,共7页
When SiC MOSFET power devices operate under radiation environment conditions,radiation induces trap charges in their gate oxide,which affects the device's short-circuit and avalanche characteristics.The short-circ... When SiC MOSFET power devices operate under radiation environment conditions,radiation induces trap charges in their gate oxide,which affects the device's short-circuit and avalanche characteristics.The short-circuit and avalanche characteristics are crucial for the reliable operation of devices under radiation environments.To ensure the efficient and stable operation of SiC MOSFET power devices under radiation environments,this paper focuses on studying the degradation patterns of the short-circuit and avalanche characteristics of SiC MOSFET power devices after being subjected to radiation,and analyzes the degradation mechanisms through theory and simulation. 展开更多
关键词 SiC MOSFET total dose effect short-circuit characteristics avalanche characteristics
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Evolution of MPP SoC architecture techniques 被引量:7
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作者 SHEN XuBang 《Science in China(Series F)》 2008年第6期756-764,共9页
The evolution of chip architecture is discussed in this paper. Then MPP SoC architectures according to three kinds of computing paradigms are analyzed. Based on these discussions and analyses, array processor architec... The evolution of chip architecture is discussed in this paper. Then MPP SoC architectures according to three kinds of computing paradigms are analyzed. Based on these discussions and analyses, array processor architecture for unified change is presented, which could implement the simplification, effectiveness and versatility of both data level and non-data level parallel algorithm's programming. 展开更多
关键词 MPP SOC array processor ARCHITECTURE
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A transmission line-type electrical model for tapered TSV considering MOS effect and frequency-dependent behavior 被引量:3
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作者 刘松 单光宝 +1 位作者 谢成民 杜欣荣 《Journal of Semiconductors》 EI CAS CSCD 2015年第2期92-98,共7页
The analytical model of voltage-controlled MOS capacitance of tapered through silicon via (TSV) is derived. To capture the frequency-dependent behavior of tapered TSV, the conventional analytical equations of RLCG f... The analytical model of voltage-controlled MOS capacitance of tapered through silicon via (TSV) is derived. To capture the frequency-dependent behavior of tapered TSV, the conventional analytical equations of RLCG for two-wire transmission lines are revised. With the adoption of MOS capacitance model and the revised RLCG analytical equations, a transmission line-type electrical model for tapered TSV is proposed finally. All the proposed models are validated by simulation tools, and a good correlation is obtained between the proposed models and simulations up to 100 GHz. With the proposed model, both the semiconductor phenomenon and frequency- dependent behavior of tapered TSV can be fully captured at high frequency, and the performance of tapered TSV can be evaluated accurately and conveniently prior to 3D IC design. 展开更多
关键词 3D IC TSV TSV electrical model MOS effect transmission line
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An AP SoC for a unified architecture 被引量:1
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作者 SHEN XuBang ZHAO CuiHua 《Chinese Science Bulletin》 SCIE EI CAS 2010年第35期4089-4093,共5页
An instruction level parallel computing paradigm and a unified architecture for an array processor(AP) on a chip(SoC) are presented in this paper.Here "APU SoC" is short for "an AP SoC for the unified a... An instruction level parallel computing paradigm and a unified architecture for an array processor(AP) on a chip(SoC) are presented in this paper.Here "APU SoC" is short for "an AP SoC for the unified architecture".The MISD/MIMD architecture for instruction level parallel computing is unified with the SIMD architecture for data level parallel computing.As a result,all the computing can be implemented on an APU SoC.The APU SoC offers the rationale of an array structure for development in current technology,yet simplicity for the hardware(chip) and software(program) parallel designs.Just as a single processor chip can replace many function module chips,the APU SoC can replace the single-core/multi-core/many-core CPU chip for TLP computing and the ASIC/ASSP/FPGA/RC device array chip for Operation Level Parallel computing. 展开更多
关键词 SOC 架构 处理器芯片 指令级并行 并行计算 阵列芯片 多功能模块 CPU芯片
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The influence of the capping ligands on the optoelectronic performance,morphology,and ion liberation of CsPbBr_(3)perovskite quantum dots 被引量:2
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作者 Yongfeng Liu Shi Tang +6 位作者 Zhaoju Gao Xiuwen Shao Xiaolin Zhu Joan Ràfols Ribé Thomas Wågberg Ludvig Edman Jia Wang 《Nano Research》 SCIE EI CSCD 2023年第7期10626-10633,共8页
Perovskite quantum dots(PeQDs)endowed with capping ligands exhibit impressive optoelectronic properties and enable for costefficient solution processing and exciting application opportunities.We synthesize and charact... Perovskite quantum dots(PeQDs)endowed with capping ligands exhibit impressive optoelectronic properties and enable for costefficient solution processing and exciting application opportunities.We synthesize and characterize three different PeQDs with the same cubic CsPbBr_(3)core,but which are distinguished by the ligand composition and density.PeQD-1 features a binary didodecyldimethylammonium bromide(DDAB)and octanoic acid capping ligand system,with a high surface density of 1.53 nm^(-2),whereas PeQD-2 and PeQD-3 are coated by solely DDAB at a gradually lower surface density.We show that PeQD-1 endowed with highest ligand density features the highest dispersibility in toluene of 150 g/L,the highest photoluminescence quantum yield of 95%in dilute solution and 59%in a neat film,and the largest core-to-core spacing in neat thin films.We further establish that ions are released from the core of PeQD-1 when it is exposed to an electric field,although it comprises a dense coating of one capping ligand per four surface core atoms.We finally exploit these combined findings to the development of a light-emitting electrochemical cell(LEC),where the active layer is composed solely of solution-processed pure PeQDs,without additional electrolytes.In this device,the ion release is utilized as an advantage for the electrochemical doping process and efficient emissive operation of the LEC. 展开更多
关键词 CsPbBr_(3)quantum dots capping ligand ion liberation light-emitting electrochemical cell
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An Inference Microprocessor Design
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作者 沈绪榜 马光悌 陈岚 《Journal of Computer Science & Technology》 SCIE EI CSCD 1991年第3期209-213,共5页
This paper is concerned with the design of an inference microprocessor for production rule systems. Its implementation is based on both exact and inexact (fuzzy logic) reasoning,so it can he used for building various ... This paper is concerned with the design of an inference microprocessor for production rule systems. Its implementation is based on both exact and inexact (fuzzy logic) reasoning,so it can he used for building various production rule systems.The methods of translating linguistically expressed rules into nu- merical representations are described and the hardware implementations are discussed.Finally,a parallel architecture for the inference microprocessor is presented. 展开更多
关键词 In An Inference Microprocessor Design LENGTH
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