The n-type ultrathin fully depleted silicon-on-insulator(FDSOI) metal-oxide-semiconductor field-effect transistors(MOSFETs),with a Hf_(0.5)Zr_(0.5)O_(2) high dielectric permittivity(high-k) dielectric as gate insulato...The n-type ultrathin fully depleted silicon-on-insulator(FDSOI) metal-oxide-semiconductor field-effect transistors(MOSFETs),with a Hf_(0.5)Zr_(0.5)O_(2) high dielectric permittivity(high-k) dielectric as gate insulator,were fabricated.The total ionizing dose effects were investigated,and an X-ray radiation dose up to 1500 krad(Si) was applied for both long-and short-channel devices.The short-channel devices(0.025-0.100 μm) exhibited less irradiation sensitivity compared with the long-channel devices(0.35-16 μm),leading to a 71% reduction in the irradiation-induced drain current growth and a 26% decrease in the shift of the threshold voltage.It was experimentally demonstrated that the OFF mode is the worst case among the three working conditions(OFF,ON and A110) for short-channel devices.Also,the determined effective electron mobility was enhanced by 38% after X-ray irradiation,attributed to the different compensations for charges triggered by radiation between the highk dielectric and buried oxide.By extracting the carrier mobility,gate length modulation,and source/drain(S/D)parasitic resistance,the degradation mechanism on X-ray irradiation was revealed.Finally,the split capacitance-voltage measurements were used to validate the analysis.展开更多
In order to effectively remove the residual Ge atoms at the surface of channel and improve the interfacial characteristic of gate-all-around(GAA)Si nanosheet field effect transistors,a low-temperature atomic-level tri...In order to effectively remove the residual Ge atoms at the surface of channel and improve the interfacial characteristic of gate-all-around(GAA)Si nanosheet field effect transistors,a low-temperature atomic-level trimming approach using ammonia peroxide water mixture(APM)solution treatment followed by diluted hydrofluoric acid is proposed and carried out.The capacitor samples with SiGe epitaxy layer,similar thermal budget and channel release process were fabricated using advanced high-k/metal-gate.An 83%reduction in surface roughness at atomic level is obtained by increasing APM treatment time.Moreover,there are 99.45% reduction in the interface state density(D_(it))and 96.8%leakage reduction in current density(J_(g))after APM treatment,indicating a promising method for future GAA NSFET performance optimization.展开更多
A comprehensive study of the negative and positive bias temperature instability(NBTI/PBTI)of 3D FinFET devices with different small channel lengths is presented.It is found while with the channel lengths shrinking fro...A comprehensive study of the negative and positive bias temperature instability(NBTI/PBTI)of 3D FinFET devices with different small channel lengths is presented.It is found while with the channel lengths shrinking from 100 nm to 30 nm,both the NBTI characteristics of p-FinFET and PBTI characteristics of n-FinFET turn better.Moreover,the channel length dependence on NBTI is more serious than that on PBTI.Through the analysis of the physical mechanism of BTI and the simulation of 3-D stress in the FinFET device,a physical mechanism of the channel length dependence on NBTI/PBTI is proposed.Both extra fluorine passivation in the corner of bulk oxide and stronger channel stress in p-FinFETs with shorter channel length causes less NBTI issue,while the extra nitrogen passivation in the corner of bulk oxide induces less PBTI degradation as the channel length decreasing for n-FinFETs.The mechanism well matches the experimental result and provides one helpful guide for the improvement of reliability issues in the advanced FinFET process.展开更多
基金financially supported by the National Natural Science Foundation of China (Nos.61874135,61904194 and 11905287)the National Major Project of Science and Technology of China (No.2017ZX02315001)+1 种基金the Youth Innovation Promotion Association,CAS (No.Y9YQ01R004)the Opening Project of Key Laboratory of Microelectronic Devices & Integrated Technology,Institute of Microelectronics,CAS (No.Y9YS05X002)。
文摘The n-type ultrathin fully depleted silicon-on-insulator(FDSOI) metal-oxide-semiconductor field-effect transistors(MOSFETs),with a Hf_(0.5)Zr_(0.5)O_(2) high dielectric permittivity(high-k) dielectric as gate insulator,were fabricated.The total ionizing dose effects were investigated,and an X-ray radiation dose up to 1500 krad(Si) was applied for both long-and short-channel devices.The short-channel devices(0.025-0.100 μm) exhibited less irradiation sensitivity compared with the long-channel devices(0.35-16 μm),leading to a 71% reduction in the irradiation-induced drain current growth and a 26% decrease in the shift of the threshold voltage.It was experimentally demonstrated that the OFF mode is the worst case among the three working conditions(OFF,ON and A110) for short-channel devices.Also,the determined effective electron mobility was enhanced by 38% after X-ray irradiation,attributed to the different compensations for charges triggered by radiation between the highk dielectric and buried oxide.By extracting the carrier mobility,gate length modulation,and source/drain(S/D)parasitic resistance,the degradation mechanism on X-ray irradiation was revealed.Finally,the split capacitance-voltage measurements were used to validate the analysis.
基金financially supported by the Strategic Pilot Project of the Chinese Academy of Sciences-Class A(No.XDA0330302)the National Natural Science Foundation of China(Nos.62374183 and 62304247)the 2021 Jilin Province Science and Technology Department Key R&D Projects(No.20210201031GX)。
文摘In order to effectively remove the residual Ge atoms at the surface of channel and improve the interfacial characteristic of gate-all-around(GAA)Si nanosheet field effect transistors,a low-temperature atomic-level trimming approach using ammonia peroxide water mixture(APM)solution treatment followed by diluted hydrofluoric acid is proposed and carried out.The capacitor samples with SiGe epitaxy layer,similar thermal budget and channel release process were fabricated using advanced high-k/metal-gate.An 83%reduction in surface roughness at atomic level is obtained by increasing APM treatment time.Moreover,there are 99.45% reduction in the interface state density(D_(it))and 96.8%leakage reduction in current density(J_(g))after APM treatment,indicating a promising method for future GAA NSFET performance optimization.
基金the Science and Technology Program of Beijing Municipal Science and Technology Commission,China(Grant No.Z201100004220001)the National Major Project of Science and Technology of China(Grant No.2017ZX02315001)the Opening Project of Key Laboratory of Microelectronic Devices&Integrated Technology,Institute of Microelectronics,Chinese Academy of Sciences(Grant Nos.Y9YS05X002 and E0YS01X001).
文摘A comprehensive study of the negative and positive bias temperature instability(NBTI/PBTI)of 3D FinFET devices with different small channel lengths is presented.It is found while with the channel lengths shrinking from 100 nm to 30 nm,both the NBTI characteristics of p-FinFET and PBTI characteristics of n-FinFET turn better.Moreover,the channel length dependence on NBTI is more serious than that on PBTI.Through the analysis of the physical mechanism of BTI and the simulation of 3-D stress in the FinFET device,a physical mechanism of the channel length dependence on NBTI/PBTI is proposed.Both extra fluorine passivation in the corner of bulk oxide and stronger channel stress in p-FinFETs with shorter channel length causes less NBTI issue,while the extra nitrogen passivation in the corner of bulk oxide induces less PBTI degradation as the channel length decreasing for n-FinFETs.The mechanism well matches the experimental result and provides one helpful guide for the improvement of reliability issues in the advanced FinFET process.
