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基于非等径双球堆积模型和蒙特卡罗仿真模拟的纳米铜烧结互连机理分析 被引量:2
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作者 蒋大伟 樊嘉杰 +2 位作者 胡栋 樊学军 张国旗 《焊接学报》 EI CAS CSCD 北大核心 2021年第3期7-13,I0001,I0002,共9页
为了满足第三代半导体低温封装、高温服役的要求,纳米金属颗粒烧结封装互连逐渐替代传统钎料回流焊工艺,而高致密度烧结是实现高可靠性封装的必要条件之一.为了研究纳米铜颗粒烧结互连机理,首先通过非等径双球三维密集堆积模型构建理论... 为了满足第三代半导体低温封装、高温服役的要求,纳米金属颗粒烧结封装互连逐渐替代传统钎料回流焊工艺,而高致密度烧结是实现高可靠性封装的必要条件之一.为了研究纳米铜颗粒烧结互连机理,首先通过非等径双球三维密集堆积模型构建理论颗粒配比与堆积孔隙率之间的关系,然后采用蒙特卡罗仿真模拟不同粒径比的双球模型颗粒烧结过程,最后通过纳米铜混合烧结试验来验证理论推算和仿真模拟结果.结果表明,根据3种三维密集堆积模型估算,孔隙率最低时的颗粒粒径比在10∶1~5∶1之间;仿真模拟结果显示,粒径比为5∶1时的双球模型收缩率最大;选择250和50 nm两种粒径纳米铜进行混合烧结试验,证实烧结致密度最佳条件时的颗粒质量比为8∶1,与理论计算结果相符.由此可见,该方法可以为纳米铜烧结在第三代半导体封装互连中的应用和工艺优化提供了理论支持. 展开更多
关键词 第三代半导体 封装互连 纳米铜烧结 蒙特卡罗仿真模拟 致密性
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Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models
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作者 Jiajie Fan Zhou Jing +4 位作者 Yixing Cao Mesfin Seid Ibrahim Min Li Xuejun Fan Guoqi Zhang 《Energy and AI》 2021年第2期91-100,共10页
With their advantages of high efficiency,long lifetime,compact size and being free of mercury,ultraviolet light-emitting diodes(UV LEDs)are widely applied in disinfection and purification,photolithography,curing and b... With their advantages of high efficiency,long lifetime,compact size and being free of mercury,ultraviolet light-emitting diodes(UV LEDs)are widely applied in disinfection and purification,photolithography,curing and biomedical devices.However,it is challenging to assess the reliability of UV LEDs based on the traditional life test or even the accelerated life test.In this paper,radiation power degradation modeling is proposed to estimate the lifetime of UV LEDs under both constant stress and step stress degradation tests.Stochastic data-driven predic-tions with both Gamma process and Wiener process methods are implemented,and the degradation mechanisms occurring under different aging conditions are also analyzed.The results show that,compared to least squares regression in the IESNA TM-21 industry standard recommended by the Illuminating Engineering Society of North America(IESNA),the proposed stochastic data-driven methods can predict the lifetime with high accuracy and narrow confidence intervals,which confirms that they provide more reliable information than the IESNA TM-21 standard with greater robustness. 展开更多
关键词 Ultraviolet light-emitting diodes(UV LEDs) Degradation modeling Gamma process Wiener process IESNA TM-21
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