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Amorphous-to-crystalline transition-induced two-step thin film growth of quasi-one-dimensional penta-telluride ZrTe_(5)
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作者 Yi Shuang Yuta Saito +3 位作者 Shogo Hatayama Paul Fons Ando Daisuke Yuji Sutou 《Journal of Materials Science & Technology》 2025年第7期246-253,共8页
Quasi-one-dimensional(quasi-1D)van der Waals(vdWs)materials,such as ZrTe_(5),exhibit unique elec-trical properties and quantum phenomena,making them attractive for advanced electronic applications.However,large-scale ... Quasi-one-dimensional(quasi-1D)van der Waals(vdWs)materials,such as ZrTe_(5),exhibit unique elec-trical properties and quantum phenomena,making them attractive for advanced electronic applications.However,large-scale growth of ZrTe_(5) thin films presents challenges.We address this by employing sput-tering,a common semiconductor industry technique.The as-deposited ZrTe_(5) film is amorphous,and post-annealing induces a crystallization process akin to transition-metal dichalcogenides.Our study in-vestigates the electrical and optical properties during this amorphous-to-crystalline transition,reveal-ing insights into the underlying mechanism.This work contributes to the fundamental understanding of quasi-1D materials and introduces a scalable fabrication method for ZrTe_(5) which offers the possibility of fabricating unique future electronic and optical devices. 展开更多
关键词 QUASI-ONE-DIMENSIONAL ZrTe_(5) Large-scale Thin film PHASE-CHANGE
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Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
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作者 Shingo Kariya Takashi Matsumae +3 位作者 Yuichi Kurashima Hideki Takagi Masanori Hayase Eiji Higurashi 《Microsystems & Nanoengineering》 SCIE EI CSCD 2022年第1期139-147,共9页
In this study,we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package.A package without a leak path was obtained by the direct b... In this study,we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package.A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers.After packaging,annealing at 450°C caused thermal diffusion of the Ti underlayer atoms to the inner surface,which led to absorption of the residual gas molecules.These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases,which can simplify vacuum packaging processes in the electronics industry. 展开更多
关键词 VACUUM ABSORPTION SEALING
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