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Surface properties of Al-doped ZnO thin film before and after CF_4/Ar plasma etching
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作者 Young-Hee JOO Gwan-Ha KIM +1 位作者 Doo-Seung UM Chang-Il KIM 《Plasma Science and Technology》 SCIE EI CAS CSCD 2022年第7期194-200,共7页
Al-doped ZnO(AZO) is considered as an alternative to transparent conductive oxide materials.Patterning and achieving a stable surface are important challenges in the development and optimization of dry etching process... Al-doped ZnO(AZO) is considered as an alternative to transparent conductive oxide materials.Patterning and achieving a stable surface are important challenges in the development and optimization of dry etching processes, which must be overcome for the application of AZO in various devices. Therefore, in this study, the etch rate and surface properties of an AZO thin film after plasma etching using the adaptive coupled plasma system were investigated. The fastest etch rate was achieved with a CF_(4)/Ar ratio of 50:50 sccm. Regardless of the ratio of CF_(4) to Ar,the transmittance of the film in the visible region exceeded 80%. X-ray photoelectron spectroscopy analysis of the AZO thin film confirmed that metal-F bonding persists on the surface after plasma etching. It was also shown that F eliminates O vacancies. Consequently, the work function and bandgap energy increased as the ratio of CF-4 increased. This study not only provides information on the effect of plasma on AZO thin film, but identifies the cause of changes in the device characteristics during device fabrication. 展开更多
关键词 Al-doped ZnO plasma etching F-based plasma surface characteristics X-ray photoelectron spectroscopy ultraviolet photoelectron spectroscopy
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Structure and Thermoelectric Properties of Nanostructured (Bi, Sb)<sub>2</sub>Te<sub>3</sub>(Review)
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作者 Igor A. Drabkin Vladimir V. Karataev +3 位作者 Vladimir B. Osvenski Aleksandr I. Sorokin Gennady I. Pivovarov Natalie Yu. Tabachkova 《Advances in Materials Physics and Chemistry》 2013年第2期119-132,共14页
The investigation of the structure and thermoelectric properties of nanostructured solid solutions (Bi, Sb)2Te3 p-type has been carried out. The samples were obtained by grinding of original compositions in a planetar... The investigation of the structure and thermoelectric properties of nanostructured solid solutions (Bi, Sb)2Te3 p-type has been carried out. The samples were obtained by grinding of original compositions in a planetary ball mill and by spark plasma sintering (SPS). Initial powder has an average particle size of 10 - 12 nm according to transmission electron microscopy, and the size of the coherent scattering region (CSR) obtained by X-ray line broadening. During sintering at Ts = 250°C - 400°C, the grain size and CSR increased, which was associated with the processes of recrystallization. The maximum of size distribution of CSR shifts to larger sizes when Ts increases so that no broadening of X-ray lines at Ts = 400°C can take place. At higher Ts, the emergence of new nanograins is observed. The formation of nanograins is conditioned by reducing of quantity of the intrinsic point defects produced in the grinding of the source materials. The study of the electrical conductivity and the Hall effect in a single crystal allows to estimate the mean free path of the holes-L in the single crystal Bi0.5Sb1.5Te3 which at room temperature is 2 - 5 nm (it is much smaller than the dimensions of CSR in the samples). The method for evaluation of L in polycrystalline samples is proposed. At room temperature, L is close to the mean free path in single crystals. Scattering parameter holes in SPS samples obtained from the temperature dependence of the Seebeck coefficient are within the measurement error equal to the parameter of the scattering of holes in a single crystal. The figure of merit ZT of SPS samples as a function of composition and sintering temperature has been investigated. Maximum ZT, equal to 1.05 at room temperature, is obtained for the composition Bi0.4Sb1.6Te3 at Ts = 500°C and a pressure of 50 MPa. The causes of an apparent increase in thermoelectric efficiency are discussed. 展开更多
关键词 Solid Solutions (Bi Sb)2Te3 P-Type Nanostructure Spark Plasma Sintering CONDUCTIVITY Hall Effect Hole Free Path SEEBECK Coefficient Thermal CONDUCTIVITY Figure of Merit
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Perimeter Effects on Heavy Doping GaAs Diodes
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作者 SHI Xiao-zhong WANG Le XIA Guan-qun 《Chinese Physics Letters》 SCIE CAS CSCD 1998年第5期370-372,共3页
The influence of perimeter effects on dark I-V characteristics of GaAs diode is investigated experimentally.The results indicate that the diodes with high energy states density will be more easily shorted than that wi... The influence of perimeter effects on dark I-V characteristics of GaAs diode is investigated experimentally.The results indicate that the diodes with high energy states density will be more easily shorted than that with low energy states density during alloying.The possibility of shunt short of GaAs diode increases with the decrease of the distance between the front contact and pn junction.The AlGaAs layers enhance the dark current. 展开更多
关键词 DIODE ALGAAS DIODES
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用于制备具有超光滑表面异质集成4英寸硅基砷化镓薄膜的高效离子剥离技术 被引量:2
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作者 孙嘉良 林家杰 +6 位作者 金婷婷 池超旦 周民 Robert Kudrawiec 李进 游天桂 欧欣 《Science China Materials》 SCIE EI CAS CSCD 2023年第1期211-218,共8页
在Si衬底上将单晶GaAs薄膜与其进行异质集成有望为硅基光电集成提供新的材料平台.本文基于对GaAs材料剥离机理的分析阐述,优化了GaAs薄膜转移工艺的离子注入条件.结果表明,相比于He离子单独注入,由于较小的热预算和注入后相对更低的缺... 在Si衬底上将单晶GaAs薄膜与其进行异质集成有望为硅基光电集成提供新的材料平台.本文基于对GaAs材料剥离机理的分析阐述,优化了GaAs薄膜转移工艺的离子注入条件.结果表明,相比于He离子单独注入,由于较小的热预算和注入后相对更低的缺陷密度,He/H离子共注入对于GaAs薄膜转移更高效.以Al2O3为键合介质层,通过优化的离子剥离技术成功地将4英寸GaAs薄膜转移到Si(100)衬底上.探索了包括化学机械抛光、臭氧辐照氧化和KOH清洗的表面处理工艺,以将转移后GaAs薄膜的表面质量提高到可以高质量外延的水平.在400℃退火1 h后,转移的GaAs薄膜单晶质量进一步提高,X射线摇摆曲线的半峰全宽仅为89.03 arcsec. 展开更多
关键词 剥离技术 化学机械抛光 异质集成 缺陷密度 光电集成 GaAs薄膜 离子注入 表面处理工艺
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Si-based InGaAs photodetectors on heterogeneous integrated substrate 被引量:1
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作者 Chaodan Chi Jiajie Lin +14 位作者 Xingyou Chen Chengli Wang Ziping Li Liping Zhang Zhanglong Fu Xiaomeng Zhao Hua Li Tiangui You Li Yue Jiaxiang Zhang Niefeng Sun Peng Gao Robert Kudrawiec Shumin Wang Xin Ou 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS CSCD 2021年第6期83-89,共7页
In this paper,InGaAs p-i-n photodetectors(PDs)on an InP/SiO2/Si(InPOI)substrate fabricated by ion-slicing technology are demonstrated and compared with the identical device on a commercial InP substrate.The quality of... In this paper,InGaAs p-i-n photodetectors(PDs)on an InP/SiO2/Si(InPOI)substrate fabricated by ion-slicing technology are demonstrated and compared with the identical device on a commercial InP substrate.The quality of epitaxial layers on the InPOI substrate is similar to that on the InP substrate.The photo responsivities of both devices measured at 1.55μm are comparable,which are about 0.808-0.828 A W^(-1).Although the dark current of PD on the InPOI substrate is twice as high as that of PD on the InP substrate at 300 K,the peak detectivities of both PDs are comparable.In general,the overall performance of the InPOI-based PD is comparable to the InP-based PD,demonstrating that the ion-slicing technology is a promising route to enable the highquality Si-based InP platform for the full photonic integration on a Si substrate. 展开更多
关键词 InPOI InGaAs photodetector molecular beam epitaxy monolithic integration
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