Polymer-based composite solid electrolytes(CSEs),incorporating fast Li+-conducting ceramic phases,leverage the advantages of both components to become one of the most promising next-generation solid electrolyte config...Polymer-based composite solid electrolytes(CSEs),incorporating fast Li+-conducting ceramic phases,leverage the advantages of both components to become one of the most promising next-generation solid electrolyte configurations.However,the interfacial incompatibility between the organic and inorganic components inevitably creates significant barriers to the interfacial Li+transport,representing a key challenge in further enhancing the ionic conductivity of CSEs.Herein,we pioneered a confined solvation strategy by growing a metal-organic framework(MOF)layer impregnated with ionic liquid(IL)on the surface of Li_(0.33)La_(0.557)TiO_(3)(LLTO)fibers,and subsequently incorporating the composite fibers into a polyethylene oxide(PEO)matrix to fabricate a novel CSE(signed as LLTO/ZIF-8@IL/PEO).Benefiting from the unique porous structure and attraction of the metal centers toward anions of MOF,IL is tightly confined within the MOF framework,while retaining its liquid-like high ionic conductivity and interfacial wetting ability at the nano scale.As a result,the Li+transport efficiency is substantially improved across the PEO-LLTO fiber interface to enable a high ionic conductivity of 1.07×10^(-3) S·cm^(-1) at 60℃ for LLTO/ZIF-8@IL/PEO.The corresponding pouch cell with a LiFePO_(4)(LFP)cathode(22 mg loading)and a lithium metal anode can successfully charge a mobile phone and deliver a stable capacity of 135.02 mAh·g^(-1) at 0.2 C over 100 cycles.This confined solvation strategy offers a universal and efficient approach for improving the Li+transport across the polymer-ceramic interface in CSEs.展开更多
To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mec...To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mechanical alloying initially;then, the SAC 105- 0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys were prepared using 72-h-milling Sn-Fe-B master alloys. The preparation process and the properties of solders were studied in this work. For the Sn-Fe-B master alloys, the results show that with the increase in the ball-milling time, the powder changes illustrate a cold welding-crushingcold welding cyclic process. Moreover, the supersaturated solid solubility of (Fe-B) increases gradually in the alloys, matrix and the lattice distortion increases to 0.167% after 72-h milling. Meanwhile, the alloying degree is increasingly apparent, and after 72-h milling, the content of B in the Sn matrix reaches 2.38 wt%. For the solder alloys, with the (Fe-B) content in creasing, the melting point decreases and a significant grain refinement occurs in the matrix. Compared to the benchmark SAC105, the hardness of SAC105-0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys prepared by this method is improved by 20.65% and 34.79%, respectively. The present research provides a novel approach for introducing the immiscible component into the lead-free solder alloys.展开更多
Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the ...Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were analyzed.The result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder paste.This reaction led the passivation layer to be peeled off.It also caused the change in solder powders’physical and chemical properties and made the metal boundary to be cold-welded.This is the root cause of solder paste exsiccation and deterioration.The study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.展开更多
17-4PH stainless steel powders were prepared using a supersonic nozzle in a close-coupled gas atomization system. The characteristics of powder particles were carried out by means of a laser particle size analyzer, sc...17-4PH stainless steel powders were prepared using a supersonic nozzle in a close-coupled gas atomization system. The characteristics of powder particles were carried out by means of a laser particle size analyzer, scanning electron microscopy （SEM）, and the X-ray diffraction （XRD） technique. The results show that the mass median particle diameter is about 19.15 prn. Three main types of surface microstructures are observed in the powders： well-developed dendrite, cellular, and cellular dendrite structure. The XRD measurements show that, as the particle size decreases, the amount of fcc phase gradually decreases and that of bcc phase increases. The cooling rate is inversely related to the particle size, i.e., it decreases with an increase in particle size.展开更多
Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and...Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.展开更多
Microorganisms are a huge mine of bioactive metabolites,and actinomycetes are one of the very active groups in this area.In this article,we are concerned about the full taxonomical characterization of Streptomyces liv...Microorganisms are a huge mine of bioactive metabolites,and actinomycetes are one of the very active groups in this area.In this article,we are concerned about the full taxonomical characterization of Streptomyces lividans AM,isolated from Egyptian soil.This isolate produced three new bioactive metabolites,namely:1-Nona-decanoyl,4-oleyl disuccinate(1),filoboletic acid;(9Z,11E)-8,13-dihydroxy octadeca-9,11-dienoic acid(2),and sitosteryl-3β-D-glucoside(3).Extensive 1D and 2D NMR and HR-mass spectrometry were used to elucidate the structures of the three compounds.Moreover,ten known compounds were also identified.The antimicrobial activity of the producing organism and newly reported compounds(1–3)was investigated against a selected group of pathogenic microorganisms.A full taxonomical characterization of the strain was described as well.展开更多
The influence of Mn on wettability and microstructure of low-silver solders was investigated. Mn degrades the wettability of low-silver solders, while the wettability of the Mn doping solders does not change with Mn c...The influence of Mn on wettability and microstructure of low-silver solders was investigated. Mn degrades the wettability of low-silver solders, while the wettability of the Mn doping solders does not change with Mn content in a linear way. As a result of Mn doping, the cellular/dendritic β-Sn and the eutectic phase are refined. It indicates that Mn promotes the spontaneous and heterogeneous nucleation process of the solder alloys. The growth of intermetallic compound on the joint inter＇ace during soldering is also restrained. Aging experiment shows that Mn suppresses the growth of Cu3Sn and Cu6Sn5 layers at the joint interface.展开更多
基金the National Natural Science Foundation of China(Nos.52322302 and 22075042)the National Key Research and Development Program of China(No.2023YFB3811902)+2 种基金the Fundamental Research Funds for the Central Universities(No.2232024A-06)Shanghai Rising-Star Program(No.22QA1400300)Shanghai Scientific and Technological Innovation Project(No.22520710100).
文摘Polymer-based composite solid electrolytes(CSEs),incorporating fast Li+-conducting ceramic phases,leverage the advantages of both components to become one of the most promising next-generation solid electrolyte configurations.However,the interfacial incompatibility between the organic and inorganic components inevitably creates significant barriers to the interfacial Li+transport,representing a key challenge in further enhancing the ionic conductivity of CSEs.Herein,we pioneered a confined solvation strategy by growing a metal-organic framework(MOF)layer impregnated with ionic liquid(IL)on the surface of Li_(0.33)La_(0.557)TiO_(3)(LLTO)fibers,and subsequently incorporating the composite fibers into a polyethylene oxide(PEO)matrix to fabricate a novel CSE(signed as LLTO/ZIF-8@IL/PEO).Benefiting from the unique porous structure and attraction of the metal centers toward anions of MOF,IL is tightly confined within the MOF framework,while retaining its liquid-like high ionic conductivity and interfacial wetting ability at the nano scale.As a result,the Li+transport efficiency is substantially improved across the PEO-LLTO fiber interface to enable a high ionic conductivity of 1.07×10^(-3) S·cm^(-1) at 60℃ for LLTO/ZIF-8@IL/PEO.The corresponding pouch cell with a LiFePO_(4)(LFP)cathode(22 mg loading)and a lithium metal anode can successfully charge a mobile phone and deliver a stable capacity of 135.02 mAh·g^(-1) at 0.2 C over 100 cycles.This confined solvation strategy offers a universal and efficient approach for improving the Li+transport across the polymer-ceramic interface in CSEs.
基金National Natural Science Foundation of China(51372211)Open Project of State Key Laboratory Cultivation Base for Nonmetal Composites and Functional(14tdfk05)Southwest University of Science and Technology Outstanding Youth Fundation(13zx9107)
基金financially supported by the National Key R&D Program of China (No. 2017YFB0305703)
文摘To introduce boron (B) into the Sn-1.0Ag-0.5Cu (SAC 105) solder, based on the thermodynamic calculations, iron (Fe) is a competent carrier component for bonding B and Sn. The Sn-Fe-B master alloys were prepared by mechanical alloying initially;then, the SAC 105- 0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys were prepared using 72-h-milling Sn-Fe-B master alloys. The preparation process and the properties of solders were studied in this work. For the Sn-Fe-B master alloys, the results show that with the increase in the ball-milling time, the powder changes illustrate a cold welding-crushingcold welding cyclic process. Moreover, the supersaturated solid solubility of (Fe-B) increases gradually in the alloys, matrix and the lattice distortion increases to 0.167% after 72-h milling. Meanwhile, the alloying degree is increasingly apparent, and after 72-h milling, the content of B in the Sn matrix reaches 2.38 wt%. For the solder alloys, with the (Fe-B) content in creasing, the melting point decreases and a significant grain refinement occurs in the matrix. Compared to the benchmark SAC105, the hardness of SAC105-0.05(Fe-B) and SAC 105-0.1 (Fe-B) solder alloys prepared by this method is improved by 20.65% and 34.79%, respectively. The present research provides a novel approach for introducing the immiscible component into the lead-free solder alloys.
基金financially supported by National Key R&D Program of China(No.2017YFB0305700)。
文摘Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were analyzed.The result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder paste.This reaction led the passivation layer to be peeled off.It also caused the change in solder powders’physical and chemical properties and made the metal boundary to be cold-welded.This is the root cause of solder paste exsiccation and deterioration.The study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.
基金financially supported by the National High-Tech Research and Development Program of China (No. 2009AA033901)the National Natural Science Foundation of China (No. 51004019)
文摘17-4PH stainless steel powders were prepared using a supersonic nozzle in a close-coupled gas atomization system. The characteristics of powder particles were carried out by means of a laser particle size analyzer, scanning electron microscopy （SEM）, and the X-ray diffraction （XRD） technique. The results show that the mass median particle diameter is about 19.15 prn. Three main types of surface microstructures are observed in the powders： well-developed dendrite, cellular, and cellular dendrite structure. The XRD measurements show that, as the particle size decreases, the amount of fcc phase gradually decreases and that of bcc phase increases. The cooling rate is inversely related to the particle size, i.e., it decreases with an increase in particle size.
文摘Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound(IMC) of Sn–1.0Ag–0.5Cu alloys(SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.
基金grant from the Deanship of Scientific Research at King Khalid University for Funding under Grant No.(R.G.P 2/90/41)German Academic Exchange Service(DAAD)Project-ID-57166072.
文摘Microorganisms are a huge mine of bioactive metabolites,and actinomycetes are one of the very active groups in this area.In this article,we are concerned about the full taxonomical characterization of Streptomyces lividans AM,isolated from Egyptian soil.This isolate produced three new bioactive metabolites,namely:1-Nona-decanoyl,4-oleyl disuccinate(1),filoboletic acid;(9Z,11E)-8,13-dihydroxy octadeca-9,11-dienoic acid(2),and sitosteryl-3β-D-glucoside(3).Extensive 1D and 2D NMR and HR-mass spectrometry were used to elucidate the structures of the three compounds.Moreover,ten known compounds were also identified.The antimicrobial activity of the producing organism and newly reported compounds(1–3)was investigated against a selected group of pathogenic microorganisms.A full taxonomical characterization of the strain was described as well.
文摘The influence of Mn on wettability and microstructure of low-silver solders was investigated. Mn degrades the wettability of low-silver solders, while the wettability of the Mn doping solders does not change with Mn content in a linear way. As a result of Mn doping, the cellular/dendritic β-Sn and the eutectic phase are refined. It indicates that Mn promotes the spontaneous and heterogeneous nucleation process of the solder alloys. The growth of intermetallic compound on the joint inter＇ace during soldering is also restrained. Aging experiment shows that Mn suppresses the growth of Cu3Sn and Cu6Sn5 layers at the joint interface.
