Ni_(83)Fe_(17) films with a thickness of about 100 nm were deposited onthermal oxidized silicon substrates at ambient temperature, 240, 350, and 410℃ by DC magnetronsputtering. The deposition rate was about 0.11 nm/s...Ni_(83)Fe_(17) films with a thickness of about 100 nm were deposited onthermal oxidized silicon substrates at ambient temperature, 240, 350, and 410℃ by DC magnetronsputtering. The deposition rate was about 0.11 nm/s. The as-deposited films were annealed at 450,550, and 650℃, respectively, in a vacuum lower than 3 x 10~3 Pa for 1 h. The Ni_(83)Fe_(17) filmsmainly grow with a crystalline orientation of [111] in the direction of the film growth. With theannealing temperature increasing, the [111] orientation enhances. For films deposited at all fourdifferent temperatures, the significant improvement on anisotropic magnetoresistance occurs at theannealing temperature higher than 550℃. But for films deposited at ambient temperatures and 240 ℃,the anisotropic magnetoresistance can only rise to about 1% after 650 ℃ annealing. For filmsdeposited at 350℃ and 410℃, the anisotropic magnetoresistance rises to about 3.8% after 650℃annealing. The atomic force microscopy (AFM) observation shows a significant increase in grain sizeof the film deposited at 350℃ after 650℃ annealing. The decrease in resistivity and the increasein anisotropic magnetoresistance are caused by the decrease in point defects, the increase in grainsize, and the improvement in lattice structure integrity of the films.展开更多
文摘Ni_(83)Fe_(17) films with a thickness of about 100 nm were deposited onthermal oxidized silicon substrates at ambient temperature, 240, 350, and 410℃ by DC magnetronsputtering. The deposition rate was about 0.11 nm/s. The as-deposited films were annealed at 450,550, and 650℃, respectively, in a vacuum lower than 3 x 10~3 Pa for 1 h. The Ni_(83)Fe_(17) filmsmainly grow with a crystalline orientation of [111] in the direction of the film growth. With theannealing temperature increasing, the [111] orientation enhances. For films deposited at all fourdifferent temperatures, the significant improvement on anisotropic magnetoresistance occurs at theannealing temperature higher than 550℃. But for films deposited at ambient temperatures and 240 ℃,the anisotropic magnetoresistance can only rise to about 1% after 650 ℃ annealing. For filmsdeposited at 350℃ and 410℃, the anisotropic magnetoresistance rises to about 3.8% after 650℃annealing. The atomic force microscopy (AFM) observation shows a significant increase in grain sizeof the film deposited at 350℃ after 650℃ annealing. The decrease in resistivity and the increasein anisotropic magnetoresistance are caused by the decrease in point defects, the increase in grainsize, and the improvement in lattice structure integrity of the films.
