To meet the processing requirements of resin transfer moulding(RTM)technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-de...To meet the processing requirements of resin transfer moulding(RTM)technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4’-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA),3,4’-oxydianiline(3,4’-ODA)and m-phenylenediamine(m-PDA).This blend shows low minimum melting viscosity(<1 Pa·s)and enlarged processing temperature window(260–361℃).FPI-R-1 stays below 1 Pa·s for2 h at 270℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380℃for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance(T_(g)=420-426℃).展开更多
基金financially supported by the National Natural Science Foundation of China(No.51803222)Science and Technology Service Network Initiative,Chinese Academy of Sciences。
文摘To meet the processing requirements of resin transfer moulding(RTM)technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4’-(hexafluoroisopropylidene)diphthalic anhydride(6 FDA),3,4’-oxydianiline(3,4’-ODA)and m-phenylenediamine(m-PDA).This blend shows low minimum melting viscosity(<1 Pa·s)and enlarged processing temperature window(260–361℃).FPI-R-1 stays below 1 Pa·s for2 h at 270℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380℃for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance(T_(g)=420-426℃).
