An internal structure of Ternary Content Addressable Memory (TCAM) is designed and a Sorting Prefix Block (SPB) algorithm is presented, which is a wire-speed routing lookup algorithm based on TCAM. SPB algorithm makes...An internal structure of Ternary Content Addressable Memory (TCAM) is designed and a Sorting Prefix Block (SPB) algorithm is presented, which is a wire-speed routing lookup algorithm based on TCAM. SPB algorithm makes use of the parallelism of TCAM adequately, and improves the utilization of TCAM by optimum partitions. With the aid of effective management algorithm and memory image, SPB separates critical searching from assistant searching, and improves the searching effect. One performance test indicates that this algorithm can work with different TCAM to meet the requirement of wire-speed routing lookup.展开更多
铜线表面钯层特征是影响芯片封装过程中烧球和键合质量的重要因素。采用无卤直接涂镀工艺,制备了不同涂镀速度和涂镀温度下的镀钯铜线,研究了涂镀速度对镀层形貌和无空气焊球(free air ball,FAB)特征的影响。结果表明:随着涂镀速度增加...铜线表面钯层特征是影响芯片封装过程中烧球和键合质量的重要因素。采用无卤直接涂镀工艺,制备了不同涂镀速度和涂镀温度下的镀钯铜线,研究了涂镀速度对镀层形貌和无空气焊球(free air ball,FAB)特征的影响。结果表明:随着涂镀速度增加,涂镀时间减少,钯颗粒在铜线表面分布的均匀性变差,局部分布不均匀的钯颗粒团聚引起钯颗粒浓度较高,镀层表面钯颗粒团聚区域增加。在涂镀速度50 m/min下,镀层表面钯分布较为均匀。随着涂镀速度的增加,FAB球直径逐渐减小;镀钯铜线表面Pd颗粒团聚区域和未团聚区域的钯含量差增大,FAB球尺寸的一致性逐渐下降。在较低涂镀速度50 m/min下,FAB球表面钯分布比较均匀;在较高的涂镀速度100 m/min下,镀层表面大量团聚的钯颗粒重熔后在FAB球表面呈大面积连续的富钯区,钯再分布的均匀性较差。从FAB球尺寸的一致性和表面钯再分布的均匀性方面考虑,涂镀速度50 m/min和涂镀温度400℃为镀钯铜线涂镀较佳的工艺参数。展开更多
文摘An internal structure of Ternary Content Addressable Memory (TCAM) is designed and a Sorting Prefix Block (SPB) algorithm is presented, which is a wire-speed routing lookup algorithm based on TCAM. SPB algorithm makes use of the parallelism of TCAM adequately, and improves the utilization of TCAM by optimum partitions. With the aid of effective management algorithm and memory image, SPB separates critical searching from assistant searching, and improves the searching effect. One performance test indicates that this algorithm can work with different TCAM to meet the requirement of wire-speed routing lookup.
