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Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations
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作者 董昌道 周强 +1 位作者 蔡懿慈 刘大为 《Tsinghua Science and Technology》 SCIE EI CAS 2011年第1期41-50,共10页
This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire de... This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations. The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution. The global placement is based on a top-down recursive bisection framework. The partitioning algorithm is used in the bisectioning to impact the wire density uniformity. Tests show that, with a 10% constraint, the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis, 1039.1% better than MLPart, and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%. 展开更多
关键词 partitioning PLACEMENT chemical-mechanical polishing (CMP) design for manufacturing (DFM) wire-density
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