Poly(m-phenylene isophthalamide)(PMIA),a key aromatic polyamide,is widely used for its outstanding mechanical strength,high thermal stability,and excellent insulation properties.However,different applications demand v...Poly(m-phenylene isophthalamide)(PMIA),a key aromatic polyamide,is widely used for its outstanding mechanical strength,high thermal stability,and excellent insulation properties.However,different applications demand varying dielectric properties,so tailoring its dielectric per-formance is essential.PMIA was first synthesized in this study,followed by introducing pores and developing porous PMIA films and PMIA-based composites with reduced dielectric constants.Porous PMIA films were fabricated using the wet phase inversion process with N,N-dimethylac-etamide(DMAC)solvent and water as the non-solvent.The impact of casting solution composi-tion and coagulation bath temperature on pore structures was analyzed.A film produced with 18%PMIA and 5%LiCl in a 35℃coagulation bath achieved the lowest dielectric constant of 1.76 at 1 Hz,48%lower than the standard PMIA film,which had a tensile strength of 18.5 MPa and an initial degradation temperature of 320℃.展开更多
文摘Poly(m-phenylene isophthalamide)(PMIA),a key aromatic polyamide,is widely used for its outstanding mechanical strength,high thermal stability,and excellent insulation properties.However,different applications demand varying dielectric properties,so tailoring its dielectric per-formance is essential.PMIA was first synthesized in this study,followed by introducing pores and developing porous PMIA films and PMIA-based composites with reduced dielectric constants.Porous PMIA films were fabricated using the wet phase inversion process with N,N-dimethylac-etamide(DMAC)solvent and water as the non-solvent.The impact of casting solution composi-tion and coagulation bath temperature on pore structures was analyzed.A film produced with 18%PMIA and 5%LiCl in a 35℃coagulation bath achieved the lowest dielectric constant of 1.76 at 1 Hz,48%lower than the standard PMIA film,which had a tensile strength of 18.5 MPa and an initial degradation temperature of 320℃.
