In recent years,the development of wafer-level GaN nanowires photocatalyst loaded onto silicon substrates has progressed rapidly depending on its simplicity of instrumentation,collection and separation from the water....In recent years,the development of wafer-level GaN nanowires photocatalyst loaded onto silicon substrates has progressed rapidly depending on its simplicity of instrumentation,collection and separation from the water.Accordingly,the wafer-level GaN-based nanowires(GaN NWs)photocatalyst can be a fabulous candidate for the application in the field of photocatalytic hydrogen evolution reaction(PHER)and provides a novel route to address the environmental and energy crisis.Herein,a range of innovative strategies to improve the performance of GaN NWs photocatalyst are systematically summarized.Then,the solar-to-hydrogen conversion efficiency,the characteristics of GaN NWs system,the cost of the origin material required,as well as the stability,activity and the corrosion resistance to seawater are discussed in detail as some of the essential conditions for advancing its large-scale industry-friendly application.Last but not least,we provide the potential application of this system for splitting seawater to produce hydrogen and point out the direction for overcoming the barriers to future industrial-scale implementation.展开更多
A new wafer-level 3D packaging structure with Benzocyclobutene（BCB）as interlayer dielectrics（ILDs） for multichip module fabrication is proposed for application in the Ku-band wave.The packaging structure consists ...A new wafer-level 3D packaging structure with Benzocyclobutene（BCB）as interlayer dielectrics（ILDs） for multichip module fabrication is proposed for application in the Ku-band wave.The packaging structure consists of two layers of BCB films and three layers of metallized films,in which the monolithic microwave IC（MMIC）,thin film resistors,striplines and microstrip lines are integrated.Wet etched cavities fabricated on the silicon substrate are used for mounting active and passive components.BCB layers cover the components and serve as ILDs for interconnections.Gold bumps are used as electric interconnections between different layers,which eliminates the need to prepare vias by costly dry etching and deposition processes.In order to get high-quality BCB films for the subsequent chemical mechanical planarization（CMP）and multilayer metallization processes,the BCB curing profile is optimized and the roughness of the BCB film after the CMP process is kept lower than 10 nm.The thermal,mechanical and electrical properties of the packaging structure are investigated.The thermal resistance can be controlled below 2℃/W.The average shear strength of the gold bumps on the BCB surface is around 70 N/mm^2.The performances of MMIC and interconnection structure at high frequencies are optimized and tested.The S-parameters curves of the packaged MMIC shift slightly showing perfect transmission character.The insertion loss change after the packaging process is less than 1 dB range at the operating frequency and the return loss is less than –8 dB from 10 to 15 GHz.展开更多
A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied ...A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with self- adaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity. The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a wafer- level scale phosphor conformal coating. The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP.展开更多
基金supported by the Natural Science Foundation of China(No.51902101,22479079)Innovation Support Programme(Soft Science Research)Project Achievements of Jiangsu Province(BK20231514)+3 种基金the Youth Natural Science Foundation of Hunan Province(No.2021JJ40044)Natural Science Foundation of Jiangsu Province(No.BK20201381)Science Foundation of Nanjing University of Posts and Telecommunications(Nos.NY219144,NY221046)the National College Student Innovation and Entrepre-neurship Training Program(No.202210293083Y).
文摘In recent years,the development of wafer-level GaN nanowires photocatalyst loaded onto silicon substrates has progressed rapidly depending on its simplicity of instrumentation,collection and separation from the water.Accordingly,the wafer-level GaN-based nanowires(GaN NWs)photocatalyst can be a fabulous candidate for the application in the field of photocatalytic hydrogen evolution reaction(PHER)and provides a novel route to address the environmental and energy crisis.Herein,a range of innovative strategies to improve the performance of GaN NWs photocatalyst are systematically summarized.Then,the solar-to-hydrogen conversion efficiency,the characteristics of GaN NWs system,the cost of the origin material required,as well as the stability,activity and the corrosion resistance to seawater are discussed in detail as some of the essential conditions for advancing its large-scale industry-friendly application.Last but not least,we provide the potential application of this system for splitting seawater to produce hydrogen and point out the direction for overcoming the barriers to future industrial-scale implementation.
文摘A new wafer-level 3D packaging structure with Benzocyclobutene（BCB）as interlayer dielectrics（ILDs） for multichip module fabrication is proposed for application in the Ku-band wave.The packaging structure consists of two layers of BCB films and three layers of metallized films,in which the monolithic microwave IC（MMIC）,thin film resistors,striplines and microstrip lines are integrated.Wet etched cavities fabricated on the silicon substrate are used for mounting active and passive components.BCB layers cover the components and serve as ILDs for interconnections.Gold bumps are used as electric interconnections between different layers,which eliminates the need to prepare vias by costly dry etching and deposition processes.In order to get high-quality BCB films for the subsequent chemical mechanical planarization（CMP）and multilayer metallization processes,the BCB curing profile is optimized and the roughness of the BCB film after the CMP process is kept lower than 10 nm.The thermal,mechanical and electrical properties of the packaging structure are investigated.The thermal resistance can be controlled below 2℃/W.The average shear strength of the gold bumps on the BCB surface is around 70 N/mm^2.The performances of MMIC and interconnection structure at high frequencies are optimized and tested.The S-parameters curves of the packaged MMIC shift slightly showing perfect transmission character.The insertion loss change after the packaging process is less than 1 dB range at the operating frequency and the return loss is less than –8 dB from 10 to 15 GHz.
基金supported by the Guangdong Province Scientific Research Program(Nos.2011B090400083,2011A081301019)
文摘A new self-adaptive phosphor coating technology has been successfully developed, which adopted a slurry method combined with a self-exposure process. A phosphor suspension in the water-soluble photoresist was applied and exposed to LED blue light itself and developed to form a conformal phosphor coating with self- adaptability to the angular distribution of intensity of blue light and better-performing spatial color uniformity. The self-adaptive phosphor coating technology had been successfully adopted in the wafer surface to realize a wafer- level scale phosphor conformal coating. The first-stage experiments show satisfying results and give an adequate demonstration of the flexibility of self-adaptive coating technology on application of WLSCP.
