Numerical simulations are performed to examine the packing behavior of human red blood cells(RBCs). A combined ?nite-discrete element method(FDEM) is utilized, in which the RBCs are modeled as no-friction and no-adhes...Numerical simulations are performed to examine the packing behavior of human red blood cells(RBCs). A combined ?nite-discrete element method(FDEM) is utilized, in which the RBCs are modeled as no-friction and no-adhesion solid bodies. The packed volume and the void ratio of a large number of randomly packed RBCs are clari?ed,and the effects of the RBC shape, the mesh size, the cell number, and the container size are investigated. The results show that the packed human RBCs with normal shape have a void ratio of 28.45%, which is slightly higher than that of the ?at or thick cells used in this study. Such information is bene?cial to the further understanding on the geometric features of human RBCs and the research on RBC simulations.展开更多
Purpose: We examined the relationship between the urinary ATP level and the desire to void, voided urine volume, and urinary osmotic pressure. Materials and Methods: The subjects were 4 healthy volunteers (2 men and 2...Purpose: We examined the relationship between the urinary ATP level and the desire to void, voided urine volume, and urinary osmotic pressure. Materials and Methods: The subjects were 4 healthy volunteers (2 men and 2 women) without micturition disorders who were not taking any medications and had normal urinalysis findings. Over 2 - 3 days, they urinated into a clean cup a total of 20 times. The strength of the desire to void was classified (none, slight, moderate, or strong;scored from 1 to 4, respectively) and a voiding score was assigned at each urination, along with measurement of the voided volume, urinary ATP, urinary creatinine, and urinary osmotic pressure (one man). Results: Variation of the urinary ATP/creatinine ratio was large in both male and female subjects. The urinary ATP/creatinine ratio was lower in the 2 men compared with the 2 women. This ratio showed a significant negative correlation (R2 = 0.1577 and 0.1673, both p < 0.05) with the voided urine volume in the male subjects. However, there was no relationship between the urinary ATP/creatinine ratio and the voiding score or voided urine volume in the female subjects. Conclusions: The urinary ATP level may not be a clinically useful marker of bladder pathology. Both the present study and our previous studies identified a large sex difference in the urinary ATP/creatinine ratio, and this finding may be important when considering the causes of overactive bladder (OAB) in women. The mechanism underlying the increase in urinary ATP in women should be investigated to develop new therapies for OAB.展开更多
Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulatin...Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.展开更多
Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt format...Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
Compaction grouting is primarily applied based on empiricism,and it is challenging to quantify its densification effect.To address this issue,five sets of laboratory model tests on ideal compaction grouting were condu...Compaction grouting is primarily applied based on empiricism,and it is challenging to quantify its densification effect.To address this issue,five sets of laboratory model tests on ideal compaction grouting were conducted,with varying pressures from 400 kPa to 800 kPa,to quantitatively evaluate the densification effect in unsaturated soils.The response of surrounding soil during compaction grouting was monitored.The changes in dry density and void ratio induced by compaction grouting were obtained by monitoring volumetric water content to determine compaction efficiency.In addition,a model was developed and validated to predict the effective compaction range.The results show that soil dry density increased rapidly during compaction grouting before being stabilized at a consistent level.As expected,it is positively correlated with grouting pressures(GPs)and negatively correlated with the distance from the injection point.At higher GPs,the difference in densification effect around the injection point after compaction grouting was significant.Interestingly,variations in ultimate dry density and peak earth pressures perpendicular to the injection direction exhibited axisymmetric behavior around the injection point when comparing the dry density and earth pressure results.Furthermore,soil densification resulted in a decrease in suction.However,no significant effect of GP on suction at different soil positions was observed.Moreover,compaction efficiency decreased with increasing distance from the injection point,showing a strong linear relationship.In addition,the model results for the effective compaction range were basically consistent with the extrapolated values from the experimental results.展开更多
Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applicat...Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement...Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.展开更多
Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systema...Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systematic quantification of performance boundaries for air-coupled(A-CGPR)and ground-coupled(G-CGPR)systems within the complex electromagnetic environment of multilayer reinforced HSR tunnels remains limited.This study establishes physics-based quantitative performance limits for A-CGPR and G-CGPR through rigorously validated GPRMax finite-difference time-domain(FDTD)simulations and comprehensive field validation over a 300 m operational HSR tunnel section.Key performance metrics were quantified as functions of:(a)detection distance(A-CGPR:2.0–4.5 m;G-CGPR:≤0.1 m),(b)antenna frequency(A-CGPR:300 MHz;G-CGPR:400/900 MHz),(c)reinforcement configuration(unreinforced,single-layer,multilayer rebar),and(d)void geometry(axial length:0.1–1.0 m;radial depth:0.1–0.5 m).Key findings demonstrate:a.A-CGPR(300 MHz):Reliably detects axial voids≥0.3 m at distances≤3 m in minimally reinforced(single-layer rebar)linings(field R2=0.89).Performance degrades significantly at distances>3 m(>60%signal attenuation at 4.5 m)or under multilayer rebar interference,causing 25%–40%accuracy loss for voids<0.3 m.Optimal distance:2.0–2.5 m.b.G-CGPR(900 MHz):Achieves<5%size measurement error for axial voids≥0.1 m and radial voids≥0.2 m in unreinforced linings.Resolution degrades under multilayer reinforcement due to severe signal attenuation,increasing axial void detection error to 10%–20%for voids≥0.3 m and constraining radial size measurement.c.Synergistic Framework:A hybrid inspection protocol is proposed,integrating A-CGPR(20 km/h)for rapid large-area screening and targeted G-CGPR(3 km/h)for high-resolution verification of identified anomalies.This framework enhances NDT efficiency while reducing estimated lifecycle inspection costs by 34%compared to G-CGPR alone.This research provides the first physics-derived quantitative detection thresholds for A-CGPR and G-CGPR in multi-rebar HSR tunnels,validated through field-correlated simulations.Future work will focus on multi-frequency antenna arrays and deep learning algorithms to mitigate reinforcement interference.The established performance boundaries and hybrid framework offer critical guidance for optimizing tunnel lining inspection strategies in extensive HSR networks.展开更多
Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques o...Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques often require specialized equipment and skilled operators,posing practical challenges.In this study,a cost-effective photogrammetric approach is proposed.Particularly,local coordinate systems are established to facilitate the alignment and precise quantification of the relative position between two halves of a rock joint.Push/pull tests are conducted on rock joints with varying roughness levels to induce different contact states.A high-precision laser scanner serves as a benchmark for evaluating the photogrammetry method.Despite certain deviations exist,the measured evolution of void geometry is generally consistent with the qualitative findings of previous studies.The photogrammetric measurements yield comparable accuracy to laser scanning,with maximum errors of 13.2%for aperture and 14.4%for void volume.Most joint matching coefficient(JMC)measurement errors are below 20%.Larger measurement errors occur primarily in highly mismatched rock joints with JMC values below 0.2,but even in cases where measurement errors exceed 80%,the maximum JMC error is only 0.0434.Thus,the proposed photogrammetric approach holds promise for widespread application in void geometry measurements in rock joints.展开更多
Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible ...Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.展开更多
Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the fo...Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.展开更多
In order to investigate the effect of microvoids on the mechanical behavior of casting magnesium alloy,a spherical void-cell model of the material was presented.The velocity and strain fields of the model were obtaine...In order to investigate the effect of microvoids on the mechanical behavior of casting magnesium alloy,a spherical void-cell model of the material was presented.The velocity and strain fields of the model were obtained from the assumption that the material matrix is homogeneous and incompressible.The hardening and softening functions,which respectively reflect the deformation-hardening and void-softening behaviors of the material,were presented and introduced to an endochronic constitutive equation for describing the mechanical behavior of the material including microvoids.The corresponding numerical algorithm and finite element procedure were developed and applied to the analyses of the elastoplastic response and the porosity of casting magnesium alloy ZL102.The computed results show satisfactory agreement with experimental data.展开更多
To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of ...To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of strength reduction due to the increases in void ratio were the same for binders with different strengths. To study the influence of aggregate size, 3 single size aggregates with nominal sizes of 5.0, 13.0 and 20.0 mm （Nos. 7, 6 and 5 according to JIS A 5001） were used to make porous concrete. The strengths of porous concrete are found to be dependent on aggregate size. The rate of strength reduction of porous concrete with small aggregate size is found to be higher than that with larger aggregate size. At the same void ratio, the strength of porous concrete with large aggregate is larger than that with small aggregate. The general equations for porous concrete are related to compressive strength and void ratio for different binder strengths and aggregate sizes.展开更多
In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifte...In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifted mortar were measured by image analysis method. The relationship between the air void size distribution and strength of mortar was studied by methods of grey connection analysis and multiple linear regression analysis. The multiple linear regression equation was established with a correlation coefficient of 0.966. The weight of the affection of hierarchical porosity on the compressive strength ratio was also obtained. In addition, the effect of air voids on the paste-aggregate interfacial transition zone (ITZ) was analyzed by microhardness. The results show that the correlation between different pore size range and the compressive strength is negative. The effect of air void size distribution on 28 days compressive strength is different: under the condition of similar total porosity, with the increase of the porosity of the air void size, ranging from 10 to 200 mu m, and the decrease of the porosity, ranging from 200 to 1 600 mu m, the average air void diameter and mean free spacing are decreased; as well as the width of ITZ. On the contrary, the microhardness of the ITZ is increased while the compressive strength loss is decreased.展开更多
The shape characterization and spatial distribution of aggregate,mastic and air void phases for asphalt mixture were analyzed.Three air void percentage asphalt mixtures,4%,7% and 8%,respectively,were cut into cross se...The shape characterization and spatial distribution of aggregate,mastic and air void phases for asphalt mixture were analyzed.Three air void percentage asphalt mixtures,4%,7% and 8%,respectively,were cut into cross sections and polished.X-ray scanning microscope was used to capture aggregate,mastic,air void phase by the image.The average of polygon diameter was chosen as a threshold to determine which aggregates would be retained on a given sieve.The aggregate morphological image from scanned image was utilized by digital image processing method to calculate the gradation of aggregate and simulate the real gradation.Analysis result shows that the air void of asphalt mixture has influence on the correlation between calculation gradation and actual gradation.When comparing 4.75 mm sieve size of 4%,7% and 8% air void asphalt mixtures,7% air void asphalt mixture has 55% higher than actual size gradation,8% air void asphalt mixture has 8% higher than actual size gradation,and 4% air void asphalt mixture has 3.71% lower than actual size gradation.4% air void asphalt mixture has the best correlation between calculation gradation and actual gradation comparing to other specimens.The air void percentage of asphalt mixture has no obvious influence on the air void orientation,and three asphalt mixtures show the similar air orientation along the same direction.展开更多
In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed ...In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force. In the developed model, both the electric field and capillary force on the void's surface are solved analytically. Based on the mass conversation principle, the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under electric current. It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or collapse to a finger shape, depending on the relative magnitude of the electric current and surface capillary force. However, the elliptical-shaped void will elongate along the electric current direction and finally collapse to the finger shape. On the other hand, the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.展开更多
基金Project supported by the Engineering and Physical Sciences Research Council(EPSRC)Turbulence Consortium Grant(No.EP/G069581/1)the Marie Curie International Incoming Fellowship(No.PIIF-GA-253453)
文摘Numerical simulations are performed to examine the packing behavior of human red blood cells(RBCs). A combined ?nite-discrete element method(FDEM) is utilized, in which the RBCs are modeled as no-friction and no-adhesion solid bodies. The packed volume and the void ratio of a large number of randomly packed RBCs are clari?ed,and the effects of the RBC shape, the mesh size, the cell number, and the container size are investigated. The results show that the packed human RBCs with normal shape have a void ratio of 28.45%, which is slightly higher than that of the ?at or thick cells used in this study. Such information is bene?cial to the further understanding on the geometric features of human RBCs and the research on RBC simulations.
文摘Purpose: We examined the relationship between the urinary ATP level and the desire to void, voided urine volume, and urinary osmotic pressure. Materials and Methods: The subjects were 4 healthy volunteers (2 men and 2 women) without micturition disorders who were not taking any medications and had normal urinalysis findings. Over 2 - 3 days, they urinated into a clean cup a total of 20 times. The strength of the desire to void was classified (none, slight, moderate, or strong;scored from 1 to 4, respectively) and a voiding score was assigned at each urination, along with measurement of the voided volume, urinary ATP, urinary creatinine, and urinary osmotic pressure (one man). Results: Variation of the urinary ATP/creatinine ratio was large in both male and female subjects. The urinary ATP/creatinine ratio was lower in the 2 men compared with the 2 women. This ratio showed a significant negative correlation (R2 = 0.1577 and 0.1673, both p < 0.05) with the voided urine volume in the male subjects. However, there was no relationship between the urinary ATP/creatinine ratio and the voiding score or voided urine volume in the female subjects. Conclusions: The urinary ATP level may not be a clinically useful marker of bladder pathology. Both the present study and our previous studies identified a large sex difference in the urinary ATP/creatinine ratio, and this finding may be important when considering the causes of overactive bladder (OAB) in women. The mechanism underlying the increase in urinary ATP in women should be investigated to develop new therapies for OAB.
文摘Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.
基金financial support from the National Key Research and Development Program of China(No.2024YFB4007100)the Basic ForwardLooking Project of the Sinopec Science and Technology Department,“Research on the Long-Term Sealing Mechanism of Multi-layer Salt Cavern Hydrogen Storage”(No.P24197-4)。
文摘Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
基金the National Natural Science Foundation of China(Grant Nos.42172298,42002289)the Shanghai Geological Star Program for their financial support.
文摘Compaction grouting is primarily applied based on empiricism,and it is challenging to quantify its densification effect.To address this issue,five sets of laboratory model tests on ideal compaction grouting were conducted,with varying pressures from 400 kPa to 800 kPa,to quantitatively evaluate the densification effect in unsaturated soils.The response of surrounding soil during compaction grouting was monitored.The changes in dry density and void ratio induced by compaction grouting were obtained by monitoring volumetric water content to determine compaction efficiency.In addition,a model was developed and validated to predict the effective compaction range.The results show that soil dry density increased rapidly during compaction grouting before being stabilized at a consistent level.As expected,it is positively correlated with grouting pressures(GPs)and negatively correlated with the distance from the injection point.At higher GPs,the difference in densification effect around the injection point after compaction grouting was significant.Interestingly,variations in ultimate dry density and peak earth pressures perpendicular to the injection direction exhibited axisymmetric behavior around the injection point when comparing the dry density and earth pressure results.Furthermore,soil densification resulted in a decrease in suction.However,no significant effect of GP on suction at different soil positions was observed.Moreover,compaction efficiency decreased with increasing distance from the injection point,showing a strong linear relationship.In addition,the model results for the effective compaction range were basically consistent with the extrapolated values from the experimental results.
基金supported by the National Natural Science Foundation of China(Grant Nos.12232005 and 12072101).
文摘Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金supported by the Ministry of Industry and Information Technology of China(grant number TC220A04W-7,203)CNNC Youth Elite Scientific Research Project,the National Key R&D Plan of China(grant number 2020YFB1901600)the National Science Technology Major Project of China(grant numbers 2017ZX06902012 and 2017ZX06901024).
文摘Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.
基金funded by the Key Project of Science&Technology Research ofChina Academy of Railway Sciences,grant number 2023YJ022.
文摘Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systematic quantification of performance boundaries for air-coupled(A-CGPR)and ground-coupled(G-CGPR)systems within the complex electromagnetic environment of multilayer reinforced HSR tunnels remains limited.This study establishes physics-based quantitative performance limits for A-CGPR and G-CGPR through rigorously validated GPRMax finite-difference time-domain(FDTD)simulations and comprehensive field validation over a 300 m operational HSR tunnel section.Key performance metrics were quantified as functions of:(a)detection distance(A-CGPR:2.0–4.5 m;G-CGPR:≤0.1 m),(b)antenna frequency(A-CGPR:300 MHz;G-CGPR:400/900 MHz),(c)reinforcement configuration(unreinforced,single-layer,multilayer rebar),and(d)void geometry(axial length:0.1–1.0 m;radial depth:0.1–0.5 m).Key findings demonstrate:a.A-CGPR(300 MHz):Reliably detects axial voids≥0.3 m at distances≤3 m in minimally reinforced(single-layer rebar)linings(field R2=0.89).Performance degrades significantly at distances>3 m(>60%signal attenuation at 4.5 m)or under multilayer rebar interference,causing 25%–40%accuracy loss for voids<0.3 m.Optimal distance:2.0–2.5 m.b.G-CGPR(900 MHz):Achieves<5%size measurement error for axial voids≥0.1 m and radial voids≥0.2 m in unreinforced linings.Resolution degrades under multilayer reinforcement due to severe signal attenuation,increasing axial void detection error to 10%–20%for voids≥0.3 m and constraining radial size measurement.c.Synergistic Framework:A hybrid inspection protocol is proposed,integrating A-CGPR(20 km/h)for rapid large-area screening and targeted G-CGPR(3 km/h)for high-resolution verification of identified anomalies.This framework enhances NDT efficiency while reducing estimated lifecycle inspection costs by 34%compared to G-CGPR alone.This research provides the first physics-derived quantitative detection thresholds for A-CGPR and G-CGPR in multi-rebar HSR tunnels,validated through field-correlated simulations.Future work will focus on multi-frequency antenna arrays and deep learning algorithms to mitigate reinforcement interference.The established performance boundaries and hybrid framework offer critical guidance for optimizing tunnel lining inspection strategies in extensive HSR networks.
基金supported by the National Natural Science Foundation of China (Nos.42207175 and 42177117)the Ningbo Natural Science Foundation (No.2022J115)。
文摘Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques often require specialized equipment and skilled operators,posing practical challenges.In this study,a cost-effective photogrammetric approach is proposed.Particularly,local coordinate systems are established to facilitate the alignment and precise quantification of the relative position between two halves of a rock joint.Push/pull tests are conducted on rock joints with varying roughness levels to induce different contact states.A high-precision laser scanner serves as a benchmark for evaluating the photogrammetry method.Despite certain deviations exist,the measured evolution of void geometry is generally consistent with the qualitative findings of previous studies.The photogrammetric measurements yield comparable accuracy to laser scanning,with maximum errors of 13.2%for aperture and 14.4%for void volume.Most joint matching coefficient(JMC)measurement errors are below 20%.Larger measurement errors occur primarily in highly mismatched rock joints with JMC values below 0.2,but even in cases where measurement errors exceed 80%,the maximum JMC error is only 0.0434.Thus,the proposed photogrammetric approach holds promise for widespread application in void geometry measurements in rock joints.
基金National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803)Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1)Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)
文摘Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.
文摘Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.
基金Project(10872221)supported by the National Natural Science Foundation of China
文摘In order to investigate the effect of microvoids on the mechanical behavior of casting magnesium alloy,a spherical void-cell model of the material was presented.The velocity and strain fields of the model were obtained from the assumption that the material matrix is homogeneous and incompressible.The hardening and softening functions,which respectively reflect the deformation-hardening and void-softening behaviors of the material,were presented and introduced to an endochronic constitutive equation for describing the mechanical behavior of the material including microvoids.The corresponding numerical algorithm and finite element procedure were developed and applied to the analyses of the elastoplastic response and the porosity of casting magnesium alloy ZL102.The computed results show satisfactory agreement with experimental data.
文摘To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of strength reduction due to the increases in void ratio were the same for binders with different strengths. To study the influence of aggregate size, 3 single size aggregates with nominal sizes of 5.0, 13.0 and 20.0 mm （Nos. 7, 6 and 5 according to JIS A 5001） were used to make porous concrete. The strengths of porous concrete are found to be dependent on aggregate size. The rate of strength reduction of porous concrete with small aggregate size is found to be higher than that with larger aggregate size. At the same void ratio, the strength of porous concrete with large aggregate is larger than that with small aggregate. The general equations for porous concrete are related to compressive strength and void ratio for different binder strengths and aggregate sizes.
基金Funded by the Major State Basic Research Development Program of China(973 Program)(No.2009CB623100)the National Natural Science Foundation of China(No.51378391)
文摘In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifted mortar were measured by image analysis method. The relationship between the air void size distribution and strength of mortar was studied by methods of grey connection analysis and multiple linear regression analysis. The multiple linear regression equation was established with a correlation coefficient of 0.966. The weight of the affection of hierarchical porosity on the compressive strength ratio was also obtained. In addition, the effect of air voids on the paste-aggregate interfacial transition zone (ITZ) was analyzed by microhardness. The results show that the correlation between different pore size range and the compressive strength is negative. The effect of air void size distribution on 28 days compressive strength is different: under the condition of similar total porosity, with the increase of the porosity of the air void size, ranging from 10 to 200 mu m, and the decrease of the porosity, ranging from 200 to 1 600 mu m, the average air void diameter and mean free spacing are decreased; as well as the width of ITZ. On the contrary, the microhardness of the ITZ is increased while the compressive strength loss is decreased.
基金National Natural Science Foundation of China(51250110077)
文摘The shape characterization and spatial distribution of aggregate,mastic and air void phases for asphalt mixture were analyzed.Three air void percentage asphalt mixtures,4%,7% and 8%,respectively,were cut into cross sections and polished.X-ray scanning microscope was used to capture aggregate,mastic,air void phase by the image.The average of polygon diameter was chosen as a threshold to determine which aggregates would be retained on a given sieve.The aggregate morphological image from scanned image was utilized by digital image processing method to calculate the gradation of aggregate and simulate the real gradation.Analysis result shows that the air void of asphalt mixture has influence on the correlation between calculation gradation and actual gradation.When comparing 4.75 mm sieve size of 4%,7% and 8% air void asphalt mixtures,7% air void asphalt mixture has 55% higher than actual size gradation,8% air void asphalt mixture has 8% higher than actual size gradation,and 4% air void asphalt mixture has 3.71% lower than actual size gradation.4% air void asphalt mixture has the best correlation between calculation gradation and actual gradation comparing to other specimens.The air void percentage of asphalt mixture has no obvious influence on the air void orientation,and three asphalt mixtures show the similar air orientation along the same direction.
基金supported by the National Natural Science Foundation of China (Grant 11572249)the Aerospace Technology Foundation (Grant N2014KC0068)the Aeronautical Science Foundation of China (Grant N2014KC0073)
文摘In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force. In the developed model, both the electric field and capillary force on the void's surface are solved analytically. Based on the mass conversation principle, the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under electric current. It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or collapse to a finger shape, depending on the relative magnitude of the electric current and surface capillary force. However, the elliptical-shaped void will elongate along the electric current direction and finally collapse to the finger shape. On the other hand, the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.
