Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulatin...Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.展开更多
Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt format...Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.展开更多
Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are...Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.展开更多
Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applicat...Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement...Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.展开更多
A microscopic damage model of ellipsoidal body containing ellipsoidal void for nonlinear matrix materials is developed under a particular coordinate. The change of void shape is considered in this model. The viscous r...A microscopic damage model of ellipsoidal body containing ellipsoidal void for nonlinear matrix materials is developed under a particular coordinate. The change of void shape is considered in this model. The viscous restrained equation obtained from the model is affected by stress ?ij, void volume fraction f, material strain rate exponent m as well as the void shape. Gurson's equation is modified from the numerical solution. The modified equation is suitable for the case of nonlinear matrix materials and changeable voids. Lastly, the model is used to analyze the closing process of voids.展开更多
The growth of a prolate or oblate elliptic micro-void in a fiber reinforced anisotropic incompressible hyper-elastic rectangular thin plate subjected to uniaxial extensions is studied within the framework of finite el...The growth of a prolate or oblate elliptic micro-void in a fiber reinforced anisotropic incompressible hyper-elastic rectangular thin plate subjected to uniaxial extensions is studied within the framework of finite elasticity. Coupling effects of void shape and void size on the growth of the void are paid special attention to. The deformation function of the plate with an isolated elliptic void is given, which is expressed by two parameters to solve the differential equation. The solution is approximately obtained from the minimum potential energy principle. Deformation curves for the void with a wide range of void aspect ratios and the stress distributions on the surface of the void have been obtained by numerical computation. The growth behavior of the void and the characteristics of stress distributions on the surface of the void are captured. The combined effects of void size and void shape on the growth of the void in the thin plate are discussed. The maximum stresses for the void with different sizes and different void aspect ratios are compared.展开更多
The effects of voids(void content,void shape and size)on the interlaminar shear strength of[(±45)_(4)/(0,90)/(±45)_(2)]_(S) and [(±45)/0_(4)/(0,90)/0_(2)]_(S) composite laminates were investigated.Speci...The effects of voids(void content,void shape and size)on the interlaminar shear strength of[(±45)_(4)/(0,90)/(±45)_(2)]_(S) and [(±45)/0_(4)/(0,90)/0_(2)]_(S) composite laminates were investigated.Specimens with void contents in the range of 0.2%-8.0%for [(±45)_(4)/(0,90)/(±45)_(2)]_(S) and 0.2%-6.1%for[(±45)/0_(4)/(0,90)/0_(2)]_(S) were fabricated from carbon/epoxy fabric through varying autoclave pressures.The characteristics of the voids were studied by using optical image analysis to explain the interlaminar shear strength results.The influences of voids on the interlaminar shear strength of the two stacking sequences were compared in terms of the void content and size and shape of the void.The effect of voids on the initiation and propagation of interlaminar failure of both stacking sequence composites was found.展开更多
The problem of void growth and interaction is of importance to understanding the mechanics of failure in metals exhibiting ductility. In this work, the growth and interaction of voids in 6061-T6 aluminum were studied ...The problem of void growth and interaction is of importance to understanding the mechanics of failure in metals exhibiting ductility. In this work, the growth and interaction of voids in 6061-T6 aluminum were studied experimentally. Specifically, holes of varying numbers and relative placement were investigated for their normalized area growth with applied displacement. Flat dog-bone specimens were carefully drilled in their gauge area with no (zero) holes, one hole, and two holes (arranged vertically or horizontally) for experimentation after polishing. The growth of holes, captured by video recordings, exhibited exponential behavior and was influenced greatly by the number and arrangement of holes with the horizontal voids growing the fastest and the vertical ones growing the slowest. Also, the ensuring deformation of the sample was studied using load-displacement curves, pictography and videography, SEM imaging and Atomic Force Microscopy (AFM). The methods revealed that although the major part failure is due to large crack formation, it was preceded by intense dislocation slip activity and the formation of micro cavities. Also, the AFM quantified the three-dimensional nature of crystal or grain deformation and how it is greatly influenced by distance and location from the hole. Lastly, theoretical understanding of hole growth was offered.展开更多
Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, bu...Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.展开更多
A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell inc...A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell including one sphere void or two sphere voids. The results of three different orientations for single crystal and bicrystals are compared. It is found that crystallographic orientation has noticeable influences on the void growth directionvoid shape, and void coalescence of single crystal. The void growth rate of bicrystals depends on the crystallographic orientations and grain boundary direction.展开更多
The distribution characteristics of air voids in ultrathin asphalt friction course(UAFC) samples with different gradations and compaction methods were statistically analyzed using X-ray computed tomography(CT) and ima...The distribution characteristics of air voids in ultrathin asphalt friction course(UAFC) samples with different gradations and compaction methods were statistically analyzed using X-ray computed tomography(CT) and image analysis techniques. Based on the results, compared with the AC-5 sample, the OGFC-5mixture has a higher air void ratio, a larger air void size and a greater number of air voids, with the distribution of internal air voids being more uniform and their shapes being more rounded. The two-parameter Weibull function was applied to fit the gradation of air voids. The fitting results is good, and the function parameters are sensitive to changes in both mineral gradation and compaction method. Moreover, two homogeneity indices were proposed to evaluate the compaction uniformity of UAFC samples. Compared with the Marshall method,the SGC method is more conducive to improve the compaction uniformity of UAFC samples. The compaction method significantly influences the air void distribution characteristics and compaction uniformity of AC-5sample, but has a less significant impact on OGFC-5 sample. The experimental results in the study provides a solid foundation for further explorations on the internal structure and mixture design of UAFC.展开更多
A mechanism of plastic how localization in ductile matter near microvoids is studied. The voids with the size-scale of micromillimeter exist in sheet specimens under tensile loading, and the plastic strain held around...A mechanism of plastic how localization in ductile matter near microvoids is studied. The voids with the size-scale of micromillimeter exist in sheet specimens under tensile loading, and the plastic strain held around voids is obtained by digital image processing of deformed grids. The size growth of the microvoids, the spacing change of the neighboring voids, and the development of shear bands in the ligament between the voids, are presented by experimental results accompanied with the plastic strain distribution, that gives good interpretation to the process of void growth and coalescence with the how localization in the ligaments.展开更多
The influence of the surface effect on the nanosized spherical void growth in a rigidperfectly plastic material is analyzed and the mechanism of the nanosized void growth with high triaxiality is given. Based on the R...The influence of the surface effect on the nanosized spherical void growth in a rigidperfectly plastic material is analyzed and the mechanism of the nanosized void growth with high triaxiality is given. Based on the Rice and Tracey model for a macro void growth, the present model is proposed to account for the nanosized void growth under a uniform remote strain rate field with consideration on the surface effect. It is concluded that the surface effect yields an evident resistant influence on the nanosized void growth. That is, this influence decays as the void radius increases. With high triaxiality, the nanosized void growth is divided into two stages： the initial stage and the mature stage. At the first stage, the void grows slowly and the influence of surface effect is relatively weak, whereas at the second stage, the influence is significant and the void grows drastically.展开更多
Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques o...Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques often require specialized equipment and skilled operators,posing practical challenges.In this study,a cost-effective photogrammetric approach is proposed.Particularly,local coordinate systems are established to facilitate the alignment and precise quantification of the relative position between two halves of a rock joint.Push/pull tests are conducted on rock joints with varying roughness levels to induce different contact states.A high-precision laser scanner serves as a benchmark for evaluating the photogrammetry method.Despite certain deviations exist,the measured evolution of void geometry is generally consistent with the qualitative findings of previous studies.The photogrammetric measurements yield comparable accuracy to laser scanning,with maximum errors of 13.2%for aperture and 14.4%for void volume.Most joint matching coefficient(JMC)measurement errors are below 20%.Larger measurement errors occur primarily in highly mismatched rock joints with JMC values below 0.2,but even in cases where measurement errors exceed 80%,the maximum JMC error is only 0.0434.Thus,the proposed photogrammetric approach holds promise for widespread application in void geometry measurements in rock joints.展开更多
Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible ...Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.展开更多
Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the fo...Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.展开更多
This study aims at exploring the void space gas effect of earthquake-triggered slope instability and providing a new method for studying the formation mechanism of earthquake-triggered landslides. We analysed the basi...This study aims at exploring the void space gas effect of earthquake-triggered slope instability and providing a new method for studying the formation mechanism of earthquake-triggered landslides. We analysed the basic characteristics, kinematic characteristics, initiation mechanisms and physical mechanical parameters of the Daguangbao landslide, generalized a landslide prototype, and established a geological model and performed simulation tests. Based on the seismic wave propagation theory of rock-soil mass, rock fracture mechanics and the effective stress principle, we found that the void space gas effect is due to the occurrence of excess void space gas pressure when the dynamic response of seismic loads impacts the void space gas in weak intercalated layers of the slope. The excess void space gas pressure generated by the vibration(earthquake) damages the rock mass around the void space with a certain regularity. The model test results show that the effective shear strength of the rock mass can be reduced by 4.4% to 21.6% due to the void space gas effect.展开更多
文摘Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.
基金financial support from the National Key Research and Development Program of China(No.2024YFB4007100)the Basic ForwardLooking Project of the Sinopec Science and Technology Department,“Research on the Long-Term Sealing Mechanism of Multi-layer Salt Cavern Hydrogen Storage”(No.P24197-4)。
文摘Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.
基金supported by the National Natural Science Foundation of China(Grant Nos.12022210 and 12032001)。
文摘Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.
基金supported by the National Natural Science Foundation of China(Grant Nos.12232005 and 12072101).
文摘Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金supported by the Ministry of Industry and Information Technology of China(grant number TC220A04W-7,203)CNNC Youth Elite Scientific Research Project,the National Key R&D Plan of China(grant number 2020YFB1901600)the National Science Technology Major Project of China(grant numbers 2017ZX06902012 and 2017ZX06901024).
文摘Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.
文摘A microscopic damage model of ellipsoidal body containing ellipsoidal void for nonlinear matrix materials is developed under a particular coordinate. The change of void shape is considered in this model. The viscous restrained equation obtained from the model is affected by stress ?ij, void volume fraction f, material strain rate exponent m as well as the void shape. Gurson's equation is modified from the numerical solution. The modified equation is suitable for the case of nonlinear matrix materials and changeable voids. Lastly, the model is used to analyze the closing process of voids.
基金supported by the National Natural Science Foundation of China (Nos. 10772104 and 10872045)the Innovation Project of Shanghai Municipal Education Commission (No. 09YZ12)the Shanghai Leading Academic Discipline Project (No. S30106)
文摘The growth of a prolate or oblate elliptic micro-void in a fiber reinforced anisotropic incompressible hyper-elastic rectangular thin plate subjected to uniaxial extensions is studied within the framework of finite elasticity. Coupling effects of void shape and void size on the growth of the void are paid special attention to. The deformation function of the plate with an isolated elliptic void is given, which is expressed by two parameters to solve the differential equation. The solution is approximately obtained from the minimum potential energy principle. Deformation curves for the void with a wide range of void aspect ratios and the stress distributions on the surface of the void have been obtained by numerical computation. The growth behavior of the void and the characteristics of stress distributions on the surface of the void are captured. The combined effects of void size and void shape on the growth of the void in the thin plate are discussed. The maximum stresses for the void with different sizes and different void aspect ratios are compared.
基金Project supported by Harbin Aircraft Industry Co.,Ltd.,China。
文摘The effects of voids(void content,void shape and size)on the interlaminar shear strength of[(±45)_(4)/(0,90)/(±45)_(2)]_(S) and [(±45)/0_(4)/(0,90)/0_(2)]_(S) composite laminates were investigated.Specimens with void contents in the range of 0.2%-8.0%for [(±45)_(4)/(0,90)/(±45)_(2)]_(S) and 0.2%-6.1%for[(±45)/0_(4)/(0,90)/0_(2)]_(S) were fabricated from carbon/epoxy fabric through varying autoclave pressures.The characteristics of the voids were studied by using optical image analysis to explain the interlaminar shear strength results.The influences of voids on the interlaminar shear strength of the two stacking sequences were compared in terms of the void content and size and shape of the void.The effect of voids on the initiation and propagation of interlaminar failure of both stacking sequence composites was found.
文摘The problem of void growth and interaction is of importance to understanding the mechanics of failure in metals exhibiting ductility. In this work, the growth and interaction of voids in 6061-T6 aluminum were studied experimentally. Specifically, holes of varying numbers and relative placement were investigated for their normalized area growth with applied displacement. Flat dog-bone specimens were carefully drilled in their gauge area with no (zero) holes, one hole, and two holes (arranged vertically or horizontally) for experimentation after polishing. The growth of holes, captured by video recordings, exhibited exponential behavior and was influenced greatly by the number and arrangement of holes with the horizontal voids growing the fastest and the vertical ones growing the slowest. Also, the ensuring deformation of the sample was studied using load-displacement curves, pictography and videography, SEM imaging and Atomic Force Microscopy (AFM). The methods revealed that although the major part failure is due to large crack formation, it was preceded by intense dislocation slip activity and the formation of micro cavities. Also, the AFM quantified the three-dimensional nature of crystal or grain deformation and how it is greatly influenced by distance and location from the hole. Lastly, theoretical understanding of hole growth was offered.
基金financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416)the Fundamental Research funds for the Central Universities (No.3102017GX06003)
文摘Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.
基金supported by National Natural Science Foundation of China(No.50575143)the Research Fund for the Doctoral Program of Higher Educa-tion (No.20040248005)
文摘A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell including one sphere void or two sphere voids. The results of three different orientations for single crystal and bicrystals are compared. It is found that crystallographic orientation has noticeable influences on the void growth directionvoid shape, and void coalescence of single crystal. The void growth rate of bicrystals depends on the crystallographic orientations and grain boundary direction.
基金Funded by Technology Innovation Demonstration Project of the Transportation Department of Yunnan Province (Science and Technology Education Section of Transport Department of Yunnan Province [2019](No.14)。
文摘The distribution characteristics of air voids in ultrathin asphalt friction course(UAFC) samples with different gradations and compaction methods were statistically analyzed using X-ray computed tomography(CT) and image analysis techniques. Based on the results, compared with the AC-5 sample, the OGFC-5mixture has a higher air void ratio, a larger air void size and a greater number of air voids, with the distribution of internal air voids being more uniform and their shapes being more rounded. The two-parameter Weibull function was applied to fit the gradation of air voids. The fitting results is good, and the function parameters are sensitive to changes in both mineral gradation and compaction method. Moreover, two homogeneity indices were proposed to evaluate the compaction uniformity of UAFC samples. Compared with the Marshall method,the SGC method is more conducive to improve the compaction uniformity of UAFC samples. The compaction method significantly influences the air void distribution characteristics and compaction uniformity of AC-5sample, but has a less significant impact on OGFC-5 sample. The experimental results in the study provides a solid foundation for further explorations on the internal structure and mixture design of UAFC.
基金The project supported by the National Natural Science Foundation of China
文摘A mechanism of plastic how localization in ductile matter near microvoids is studied. The voids with the size-scale of micromillimeter exist in sheet specimens under tensile loading, and the plastic strain held around voids is obtained by digital image processing of deformed grids. The size growth of the microvoids, the spacing change of the neighboring voids, and the development of shear bands in the ligament between the voids, are presented by experimental results accompanied with the plastic strain distribution, that gives good interpretation to the process of void growth and coalescence with the how localization in the ligaments.
基金the National Natural Science Foundation of China(No.10572110).
文摘The influence of the surface effect on the nanosized spherical void growth in a rigidperfectly plastic material is analyzed and the mechanism of the nanosized void growth with high triaxiality is given. Based on the Rice and Tracey model for a macro void growth, the present model is proposed to account for the nanosized void growth under a uniform remote strain rate field with consideration on the surface effect. It is concluded that the surface effect yields an evident resistant influence on the nanosized void growth. That is, this influence decays as the void radius increases. With high triaxiality, the nanosized void growth is divided into two stages： the initial stage and the mature stage. At the first stage, the void grows slowly and the influence of surface effect is relatively weak, whereas at the second stage, the influence is significant and the void grows drastically.
基金supported by the National Natural Science Foundation of China (Nos.42207175 and 42177117)the Ningbo Natural Science Foundation (No.2022J115)。
文摘Accurate measurement of the evolution of rock joint void geometry is essential for comprehending the distribution characteristics of asperities responsible for shear and seepage behaviors.However,existing techniques often require specialized equipment and skilled operators,posing practical challenges.In this study,a cost-effective photogrammetric approach is proposed.Particularly,local coordinate systems are established to facilitate the alignment and precise quantification of the relative position between two halves of a rock joint.Push/pull tests are conducted on rock joints with varying roughness levels to induce different contact states.A high-precision laser scanner serves as a benchmark for evaluating the photogrammetry method.Despite certain deviations exist,the measured evolution of void geometry is generally consistent with the qualitative findings of previous studies.The photogrammetric measurements yield comparable accuracy to laser scanning,with maximum errors of 13.2%for aperture and 14.4%for void volume.Most joint matching coefficient(JMC)measurement errors are below 20%.Larger measurement errors occur primarily in highly mismatched rock joints with JMC values below 0.2,but even in cases where measurement errors exceed 80%,the maximum JMC error is only 0.0434.Thus,the proposed photogrammetric approach holds promise for widespread application in void geometry measurements in rock joints.
基金National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803)Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1)Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)
文摘Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.
文摘Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.
基金funded by the State Key Laboratory of Geohazard Prevention and Geoenvironment Protection (No.SKLGP2016Z015)the Natural Science Foundation of China (No. 41572308)
文摘This study aims at exploring the void space gas effect of earthquake-triggered slope instability and providing a new method for studying the formation mechanism of earthquake-triggered landslides. We analysed the basic characteristics, kinematic characteristics, initiation mechanisms and physical mechanical parameters of the Daguangbao landslide, generalized a landslide prototype, and established a geological model and performed simulation tests. Based on the seismic wave propagation theory of rock-soil mass, rock fracture mechanics and the effective stress principle, we found that the void space gas effect is due to the occurrence of excess void space gas pressure when the dynamic response of seismic loads impacts the void space gas in weak intercalated layers of the slope. The excess void space gas pressure generated by the vibration(earthquake) damages the rock mass around the void space with a certain regularity. The model test results show that the effective shear strength of the rock mass can be reduced by 4.4% to 21.6% due to the void space gas effect.
