Permeable electronics promise improved physiological comfort,but remain constrained by limited functional integration and poor mechanical robustness.Here,we report a three-dimensional(3D)permeable electronic system th...Permeable electronics promise improved physiological comfort,but remain constrained by limited functional integration and poor mechanical robustness.Here,we report a three-dimensional(3D)permeable electronic system that overcomes these challenges by combining electrospun SEBS nanofiber mats,high-resolution liquid metal conductors patterned via thermal imprinting(50μm),and a strain isolators(SIL)that protects vertical interconnects(VIAs)from stress concentration.This architecture achieves ultrahigh air permeability(>5.09 m L cm^(-2)min^(-1)),exceptional stretchability(750%fracture strain),and reliable conductivity maintained through more than 32,500 strain cycles.Leveraging these advances,we have integrated multilayer circuits,strain sensors,and a three-axis accelerometer to achieve a fully integrated,stretchable,permeable wireless real-time gesture recognition glove.The system enables accurate sign language interpretation(98%)and seamless robotic hand control,demonstrating its potential for assistive technologies.By uniting comfort,durability,and high-density integration,this work establishes a versatile platform for nextgeneration wearable electronics and interactive human-robot interfaces.展开更多
We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field t...We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field theory and derive,in a non-parametric setting,the sensitivity of the dissimilarity between the desired and the actual morphologies to arbitrary perturbations in the guiding pattern shape.The sensitivity is then used for the optimization of the confining pattern shapes such that the dissimilarity between the desired and the actual morphologies is minimized.The efficiency and robustness of the proposed gradient-based algorithm are demonstrated in a number of examples related to templating vertical interconnect accesses(VIA).展开更多
Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in man...Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in many applications.In this study,an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering tech-nique.The filled blind vias achieve a resistivity as low as 6.2μΩ·cm,which is comparable that of electroplated blind vias.Higher sintering pressure and temperature promote the filling performance,while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1.Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios,which is the key to understanding the evolution of the conductive properties of a paste-filled via.This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance.展开更多
基金supported in part by the National Key R&D Program of China under Grant 2024YFB4405300 and 2022YFA1204300the Natural Science Foundation of Hunan Province under Grant 2023JJ20016+2 种基金the National Natural Science Foundation of China under Grants of 52221001 and 62090035the Key Research and Development Plan of Hunan Province under grants of 2022GK3002 and 2023GK2012the Key Program of Science and Technology Department of Hunan Province under grant of 2020XK2001。
文摘Permeable electronics promise improved physiological comfort,but remain constrained by limited functional integration and poor mechanical robustness.Here,we report a three-dimensional(3D)permeable electronic system that overcomes these challenges by combining electrospun SEBS nanofiber mats,high-resolution liquid metal conductors patterned via thermal imprinting(50μm),and a strain isolators(SIL)that protects vertical interconnects(VIAs)from stress concentration.This architecture achieves ultrahigh air permeability(>5.09 m L cm^(-2)min^(-1)),exceptional stretchability(750%fracture strain),and reliable conductivity maintained through more than 32,500 strain cycles.Leveraging these advances,we have integrated multilayer circuits,strain sensors,and a three-axis accelerometer to achieve a fully integrated,stretchable,permeable wireless real-time gesture recognition glove.The system enables accurate sign language interpretation(98%)and seamless robotic hand control,demonstrating its potential for assistive technologies.By uniting comfort,durability,and high-density integration,this work establishes a versatile platform for nextgeneration wearable electronics and interactive human-robot interfaces.
文摘We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field theory and derive,in a non-parametric setting,the sensitivity of the dissimilarity between the desired and the actual morphologies to arbitrary perturbations in the guiding pattern shape.The sensitivity is then used for the optimization of the confining pattern shapes such that the dissimilarity between the desired and the actual morphologies is minimized.The efficiency and robustness of the proposed gradient-based algorithm are demonstrated in a number of examples related to templating vertical interconnect accesses(VIA).
基金This work was supported by the National Key R&D Program of China(2018YFE0204601),the National Natural Science Foundation of China[61874155,62174039]Key-area Research and Development Program of Guangdong Province[2021B0101290001,2020B0101290001]+1 种基金Open Project of the State Key Laboratory of Advanced Materials and Electronic Components[FHR-JS-202011005]Guangdong Basic and Applied Basic Research[2021A1515011642,2021A1515110656,2022A1515010141].
文摘Conductive fillers made from metal nanoparticles offer many advan-tages for the fabrication of a variety of electronic devices,but when they have a porous structure,their poor conductivity limits their adoption in many applications.In this study,an Ag-coated Cu micro-nanoparticle paste is used to achieve compact filling of blind vias on flexible copper clad polyimide laminates through a multistep filling and sintering tech-nique.The filled blind vias achieve a resistivity as low as 6.2μΩ·cm,which is comparable that of electroplated blind vias.Higher sintering pressure and temperature promote the filling performance,while the conductivity deteriorates at a via depth/diameter ratio greater than 1:1.Finite element simulations reveal a stress inhomogeneity in vias with large depth/diameter ratios,which is the key to understanding the evolution of the conductive properties of a paste-filled via.This study provides an effective method for high-performance microvia filling as well as insights into the mechanism that influences its performance.
