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Effect of bonding temperature and heat treatment on microstructure and mechanical property of Mg−6Gd−3Y alloy vacuum diffusion bonded joints 被引量:3
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作者 Ping-yi MA Xu CHEN +2 位作者 Xing HAN Zhi-qiang LUO He-li PENG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第7期2205-2215,共11页
Diffusion bonding of as-cast Mg−6Gd−3Y magnesium alloy was carried out at temperatures of 400−480℃ with bonding pressure of 6 MPa for 90 min.Diffusion bonded joints were solution treated at 495℃ for 14 h and then ag... Diffusion bonding of as-cast Mg−6Gd−3Y magnesium alloy was carried out at temperatures of 400−480℃ with bonding pressure of 6 MPa for 90 min.Diffusion bonded joints were solution treated at 495℃ for 14 h and then aged at 200℃ for 30 h.Microstructures and mechanical properties of joints were analyzed.The results showed that rare earth elements and their compounds gathering at bonding interface hindered the grain boundary migration crossing bonding interface.Tensile strength of as-bonded and as-solution treated joints increased firstly and then decreased with the bonding temperature increasing due to the combined effects of grain coarsening and solid-solution strengthening.As-bonded and solution-treated joints fractured at matrix except the joint bonded at 400℃,while aged joints fractured at bonding interface.The highest ultimate tensile strength of 279 MPa with elongation of 2.8%was found in joint bonded at 440℃ with solution treatment followed by aging treatment. 展开更多
关键词 Mg−Gd−Y alloy vacuum diffusion bonding post-weld heat treatment bonding interface bonding strength
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Effect of joining temperature on microstructure and properties of diffusion bonded Mg/Al joints 被引量:6
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作者 尚晶 王克鸿 +3 位作者 周琦 张德库 黄俊 葛佳棋 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2012年第8期1961-1966,共6页
The joining of AZ31B Mg alloy to 6061 Al alloy was investigated at different joining temperatures by vacuum diffusion bonding method. The microstructures of Mg/Al dissimilar joints were studied by means of optical mic... The joining of AZ31B Mg alloy to 6061 Al alloy was investigated at different joining temperatures by vacuum diffusion bonding method. The microstructures of Mg/Al dissimilar joints were studied by means of optical microscopy (OM), scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). The results show that the thickness of each layer in the diffusion zone increases with the increase of joining temperature, and the microstructure changes obviously. At joining temperature of 440 °C, the diffusion zone is composed of Mg2Al3 layer and Mg17Al12 layer. At joining temperatures of 460 and 480 °C, the diffusion zone is composed of Mg2Al3 layer, Mg17Al12 layer, eutectic layer of Mg17Al12 and Mg-based solid solution. The width of high-hardness zone in the joint increases with increasing joining temperature, and the micro-hardnesses at different locations in the diffusion zone are significantly different. The joining temperature of 440 °C offers the highest tensile strength of 37 MPa, and the corresponding joint exhibits brittle fracture at the intermetallic compound layer of Mg17Al12. 展开更多
关键词 vacuum diffusion bonding 6061 aluminum alloy AZ31 magnesium alloy dissimilar metal joint MICROSTRUCTURE mechanical property
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Interfacial Microstructure and Properties of Ti(C, N)/Ni Bonded by Transient Liquid-phase Diffusion
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作者 周世权 熊惟皓 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2009年第3期432-439,共8页
Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The in... Effects of the main process parameters(temperature and time) on microstructure and properties of Ti(C, N)/Ni interface bonded by (Cu+Nb) interlayer in a vacuum diffusion bonding device were investigated. The interfacial microstructures consisted initially of Ni3Nb metallic compound and eutectic of Ni3Nb + CuNiss, and finally transformed to (Ti, Nb) (C, N)+Ni3Nb near Ti (C, N) and NiCuss + Ni3Nb near Ni when diffusion bonding temperature was 1 523-1 573 K. It was clear that Cu was a constituent in the transient liquid phase (TLP) into which Ni was dissolved by forming Cu-Ni transition liquid. Nb was dissolved in Cu-Ni transition liquid rapidly. Ti (C, N) conld be wetted by resultant Ni-Nb-Cu transient liquid phase which was followed by a little (Ti, Nb) (C, N) solid solution formed at interface. This increased the interface combining capability. Ultimately the interface shear strength was able to reach 140 MPa. The theoretle analysis and experimental results show that the growth of interfacial reaction layer Ni3Nb accords with parabola law, and the activation energy of diffusion reaction is 115.0±0.5 kJ/mol, while the diffusion reaction speed constant is 12.53 mm/s^1/2. 展开更多
关键词 vacuum diffusion bonding transient liquid phase (TLP) diffusion bonding interlayer activation energy
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