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Laser power-induced Fermi-level shift in graphene/Al_(2)O_(3) under ambient atmosphere: Toward neutralizing unintentional graphene doping
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作者 Jamal Q.M.Almarashi Mohamed K.Zayed +4 位作者 Hesham Fares Heba Sukar Takao Ono Yasushi Kanai Mohamed Almokhtar 《Chinese Physics B》 2025年第6期453-462,共10页
Manipulating unintentional doping in graphene layers, which is influenced by environmental factors and supporting substrates, is of significant concern for the performance and advancement of graphene-based devices. In... Manipulating unintentional doping in graphene layers, which is influenced by environmental factors and supporting substrates, is of significant concern for the performance and advancement of graphene-based devices. In this context,laser-induced tuning of charge carriers in graphene facilitates the exploration of graphene's properties in relation to its surroundings and enables laser-assisted functionalization. This has the potential to advance optoelectronic devices that utilize graphene on transparent dielectric substrates, such as Al_(2)O_(3). In this work, laser power(PL) in Raman spectroscopy is used as a convenient contactless tool to manipulate and control unintentional carrier concentration and Fermi level position(EF) in graphene/α-Al_(2)O_(3)(G/Al_(2)O_(3)) under ambient conditions. Samples are annealed at 400℃ for two hours in an(Ar + H_(2)) atmosphere to remove any chemical residues. Analysis of the peak frequency(ω) and full width at half maximum(Γ) of the G and 2D bands show that G/Al_(2)O_(3) layers initially exhibit p-type doping, with EF located at ~100 me V below its Dirac charge-neutral point(DCNP). Increasing P_(L) results in effective carrier manipulation and raises E_F above DCNP. No significant internal stress is produced due to P_(L), as inferred from the strain-sensitive G^(*) band of graphene. Raman analysis of three successive cycles reveals hysteretic behavior from cycle to cycle, which is commonly reported to be limited by the type and density of the existing unintentional doping. Because of the ubiquitous nature of unintentional doping in graphene,manipulating it using contactless laser power to realize the desired graphene properties would be one of the best available practical approaches. 展开更多
关键词 GRAPHENE Raman spectroscopy laser power unintentional graphene doping ambient conditions OPTOELECTRONICS
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Regulation mechanism of Si vacancies in unintentional silicon-doped diamond by gas flow in MPCVD
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作者 Kai Yang Liangxue Gu +6 位作者 Gengyou Zhao Kun Tang Bo Feng Jiandong Ye Rong Zhang Shunming Zhu Shulin Gu 《Chinese Physics B》 2025年第11期530-537,共8页
Diamond with silicon vacancies has an important role as a promising single-photon source applicable in the quantum information field.However,in a microwave plasma chemical vapor deposition(MPCVD)system,due to the pres... Diamond with silicon vacancies has an important role as a promising single-photon source applicable in the quantum information field.However,in a microwave plasma chemical vapor deposition(MPCVD)system,due to the presence of unintentional silicon doping sources such as quartz windows,the behavior of silicon vacancy formation in silicon-doped diamond is complex.In this work,the underlying mechanism of formation of silicon vacancies by unintentional silicon doping in diamond is investigated from the perspective of growing surface kinetics in a two-gas-flow MPCVD system.This system is equipped with a novel susceptor geometry designed to deliver an additional gas flow directly onto the substrate surface.Increasing the concentration of growth doping substances on the substrate surface thereby enhances the efficiency of silicon vacancy formation in diamond.At the same time,by changing the substrate deposition angle the distribution of gas and plasma on the substrate surface is changed,thereby regulating the concentration and distribution of silicon vacancies formed by unintentional silicon doping.Experimental and computational results demonstrate that the difference in silicon vacancies formed by unintentional silicon doping in diamond depends on the substances present on the substrate surface and the distribution of plasma. 展开更多
关键词 DIAMOND silicon vacancy doping mechanism unintentional doping
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Comparison of GaN/AlGaN/AlN/GaN HEMTs Grown on Sapphire with Fe-Modulation-Doped and Unintentionally Doped GaN Buffer:Material Growth and Device Fabrication 被引量:1
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作者 巩稼民 王权 +4 位作者 闫俊达 刘峰奇 冯春 王晓亮 王占国 《Chinese Physics Letters》 SCIE CAS CSCD 2016年第11期99-103,共5页
AlGaN/GaN high electron mobility transistors (HEMTs) grown on Fe-modulation-doped (MD) and unintentionally doped (UID) GaN buffer layers are investigated and compared. Highly resistive GaN buffers (10^9Ω·... AlGaN/GaN high electron mobility transistors (HEMTs) grown on Fe-modulation-doped (MD) and unintentionally doped (UID) GaN buffer layers are investigated and compared. Highly resistive GaN buffers (10^9Ω·cm) are induced by individual mechanisms for the electron traps' formation: the Fe MD buffer (sample A) and the UID buffer with high density of edge-type dislocations (7.24×10^9cm^-2, sample B). The 300K Hall test indicates that the mobility of sample A with Fe doping (2503cm^2V^-1s^-1) is much higher than sample B (1926cm^2V^-1s^-1) due to the decreased scattering effect on the two-dimensional electron gas. HEMT devices are fabricated on the two samples and pulsed I–V measurements are conducted. Device A shows better gate pinch-off characteristics and a higher threshold voltage (-2.63V) compared with device B (-3.71V). Lower gate leakage current |IGS| of device A (3.32×10^-7A) is present compared with that of device B (8.29×10^-7A). When the off-state quiescent points Q_2 (V GQ2=-8V, V DQ2=0V) are on, V th hardly shifts for device A while device B shows +0.21V positive threshold voltage shift, resulting from the existence of electron traps associated with the dislocations in the UID-GaN buffer layer under the gate. Under pulsed I–V and transconductance G m–V GS measurement, the device with the Fe MD-doped buffer shows more potential in improving reliability upon off-state stress. 展开更多
关键词 GAN in HEMT is Comparison of GaN/AlGaN/AlN/GaN HEMTs Grown on Sapphire with Fe-Modulation-Doped and unintentionally Doped GaN Buffer:Material Growth and Device Fabrication of Fe with on
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Growth of Semi-Insulating GaN Using N2 as Nucleation Layer Carrier Gas Combining with an Optimized Annealing Time
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作者 周忠堂 邢志刚 +2 位作者 郭丽伟 陈弘 周均铭 《Chinese Physics Letters》 SCIE CAS CSCD 2007年第6期1645-1648,共4页
Semi-insulating (SI) GaN is grown using N2 as the nucleation layer (NL) carrier gas combined with an optimized annealing time by metalorganic chemical vapour deposition. Influence of using 1-12 and N2 as the NL ca... Semi-insulating (SI) GaN is grown using N2 as the nucleation layer (NL) carrier gas combined with an optimized annealing time by metalorganic chemical vapour deposition. Influence of using 1-12 and N2 as the NL carrier gas is investigated in our experiment. It is found that the sheet resistance of unintentionally doped GaN can be increased from 10^4 Ω/sq to 10^10 Ω/sq by changing the NL carrier gas from 1-12 to N2 while keeping the other growth parameters to be constant, however crystal quality and roughness of the tilm are degraded unambiguously. This situation can be improved by optimizing the NL annealing time. The high resistance of GaN grown on NL using N2 as the carrier gas is due to higher density of threading dislocations caused by the higher density of nucleation islands and small statistic diameter grain compared to the one using 1-12 as carrier gas. Annealing the NL for an optimized annealing time can decrease the density of threading dislocation and improve the tilm roughness and interface of AlGaN/GaN without degrading the sheet resistance of as-grown GaN signiticantly. High-quality SI GaN is grown after optimizing the annealing time, and AlGaN/GaN high electron mobility transistors are also prepared. 展开更多
关键词 unintentionalLY DOPED GAN FILMS DISLOCATIONS BUFFER
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A brief review of co-doping 被引量:1
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作者 Jingzhao Zhang Kinfai Tse +2 位作者 Manhoi Wong Yiou Zhang Junyi Zhu 《Frontiers of physics》 SCIE CSCD 2016年第6期81-101,共21页
Dopants and defects are important in semiconductor and magnetic devices. Strategies for controlling doping and defects have been the focus of semiconductor physics research during the past decades and remain critical ... Dopants and defects are important in semiconductor and magnetic devices. Strategies for controlling doping and defects have been the focus of semiconductor physics research during the past decades and remain critical even today. Co-doping is a promising strategy that can be used for effectively tuning the dopant populations, electronic properties, and magnetic properties. It can enhance the solubility of dopants and improve the stability of desired defects. During the past 20 years, significant experimental and theoretical efforts have been devoted to studying the characteristics of co-doping. In this article, we first review the historical development of co-doping. Then, we review a variety of research performed on co-doping, based on the compensating nature of co-dopants. Finally, we review the effects of contamination and surfactants that can explain the general mechanisms of co-doping. 展开更多
关键词 CO-doping fully compensated partially compensated non-compensated unintentional \doping SURFACTANT
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