Two-dimensional transition metal dichalcogenides(TMDs)have shown great potential for application in the next generation of electronics and optoelectronics due to their atomically thin thickness,tunable band gap,and st...Two-dimensional transition metal dichalcogenides(TMDs)have shown great potential for application in the next generation of electronics and optoelectronics due to their atomically thin thickness,tunable band gap,and strong light-matter interaction.However,their practical application is still limited by challenges such as the constraints of high-temperature synthesis processes,compatibility issues of p-type/n-type doping strategies,and insufficient nanoscale patterning accuracy.Plasma treatment has become a key technology to break through these bottlenecks with its unique advantages such as low-temperature operation capability,generation of highly active reactive species and precise controllability of multiple parameters.This review comprehensively reviews the latest progress in plasma engineering of TMDs(MoS_(2),WS_(2),WSe_(2),etc.)based on a systematic“fundamental process-property modulation-device innovation”framework.The key plasma technologies are highlighted:plasma-enhanced chemical vapor deposition(PECVD)for low-temperature growth,bidirectional doping achieved through active species regulation,atomic layer precision etching,and defect engineering.The regulation mechanism of plasma on the intrinsic properties of materials is systematically analyzed,including electronic structure modification,optical property optimization(such as photoluminescence enhancement)and structural feature evolution.It then reveals how plasma technology promotes device innovation:achieving customizable structures(p-n junctions,sub-10 nanometer channels),optimizing interface properties(reducing contact resistance,integrating high-k dielectrics),and significantly improving the performance of gas sensors,photodetectors and neuromorphic computing systems.Finally,this article looks forward to future research directions,emphasizing that plasma technology is a versatile and indispensable platform for promoting TMDs towards practical applications.展开更多
The proliferation of wearable biodevices has boosted the development of soft,innovative,and multifunctional materials for human health monitoring.The integration of wearable sensors with intelligent systems is an over...The proliferation of wearable biodevices has boosted the development of soft,innovative,and multifunctional materials for human health monitoring.The integration of wearable sensors with intelligent systems is an overwhelming tendency,providing powerful tools for remote health monitoring and personal health management.Among many candidates,two-dimensional(2D)materials stand out due to several exotic mechanical,electrical,optical,and chemical properties that can be efficiently integrated into atomic-thin films.While previous reviews on 2D materials for biodevices primarily focus on conventional configurations and materials like graphene,the rapid development of new 2D materials with exotic properties has opened up novel applications,particularly in smart interaction and integrated functionalities.This review aims to consolidate recent progress,highlight the unique advantages of 2D materials,and guide future research by discussing existing challenges and opportunities in applying 2D materials for smart wearable biodevices.We begin with an in-depth analysis of the advantages,sensing mechanisms,and potential applications of 2D materials in wearable biodevice fabrication.Following this,we systematically discuss state-of-the-art biodevices based on 2D materials for monitoring various physiological signals within the human body.Special attention is given to showcasing the integration of multi-functionality in 2D smart devices,mainly including self-power supply,integrated diagnosis/treatment,and human–machine interaction.Finally,the review concludes with a concise summary of existing challenges and prospective solutions concerning the utilization of2D materials for advanced biodevices.展开更多
In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, ...In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, both in the retention feature animated films, based on the performance of each with different strengths, thus forming a different artistic style. Wherein the two-dimensional animation is the most common one is the most basic form of expression in animation technology is relatively mature and complete, but because of the development of animation techniques, two-dimensional animation can not meet the needs of the audience. Thus, the effective combination of two-dimensional animation and three-dimensional animation technology, the advantages of integration between the two is particularly important, so that innovation in the form of screen performance, enhance audio-visual experience. In this paper, two-dimensional animation and three-dimensional animation skills fusion analysis and research, and put forward a number of specific observations, in order to learn.展开更多
Based on the two-dimensional （2D） system theory, an integrated predictive iterative learning control （2D-IPILC） strategy for batch processes is presented. First, the output response and the error transition model ...Based on the two-dimensional （2D） system theory, an integrated predictive iterative learning control （2D-IPILC） strategy for batch processes is presented. First, the output response and the error transition model predictions along the batch index can be calculated analytically due to the 2D Roesser model of the batch process. Then, an integrated framework of combining iterative learning control （ILC） and model predictive control （MPC） is formed reasonably. The output of feedforward ILC is estimated on the basis of the predefined process 2D model. By min- imizing a quadratic objective function, the feedback MPC is introduced to obtain better control performance for tracking problem of batch processes. Simulations on a typical batch reactor demonstrate that the satisfactory tracking performance as well as faster convergence speed can be achieved than traditional proportion type （P- t-we） ILC despite the model error and disturbances.展开更多
The integrability character of nonlinear equations of motion of two-dimensional gravity with dynamical torsion and bosonic string coupling is studied in this paper. The space-like and time-like first integrals of equa...The integrability character of nonlinear equations of motion of two-dimensional gravity with dynamical torsion and bosonic string coupling is studied in this paper. The space-like and time-like first integrals of equations of motion are also found.展开更多
Because exact analytic solution is not available, we use double expansion and boundary collocation to construct an approximate solution for a class of two-dimensional dual integral equations in mathematical physics. T...Because exact analytic solution is not available, we use double expansion and boundary collocation to construct an approximate solution for a class of two-dimensional dual integral equations in mathematical physics. The integral equations by this procedure are reduced to infinite algebraic equations. The accuracy of the solution lies in the boundary collocation technique. The application of which for some complicated initialboundary value problems in solid mechanics indicates the method is powerful.展开更多
In this paper,the approximate solutions for two different type of two-dimensional nonlinear integral equations:two-dimensional nonlinear Volterra-Fredholm integral equations and the nonlinear mixed Volterra-Fredholm i...In this paper,the approximate solutions for two different type of two-dimensional nonlinear integral equations:two-dimensional nonlinear Volterra-Fredholm integral equations and the nonlinear mixed Volterra-Fredholm integral equations are obtained using the Laguerre wavelet method.To do this,these two-dimensional nonlinear integral equations are transformed into a system of nonlinear algebraic equations in matrix form.By solving these systems,unknown coefficients are obtained.Also,some theorems are proved for convergence analysis.Some numerical examples are presented and results are compared with the analytical solution to demonstrate the validity and applicability of the proposed method.展开更多
<div style="text-align:justify;"> Transceiver module and two-dimensional sum difference network are important components of phased array antenna. In this paper, multilayer printed board is used to inte...<div style="text-align:justify;"> Transceiver module and two-dimensional sum difference network are important components of phased array antenna. In this paper, multilayer printed board is used to integrate millimeter wave multi-channel transceiver circuit and sum difference network. The interconnection between them is realized through RF coaxial vertical transition. At the same time, the heat dissipation design and inter channel shielding design of the module are carried out. The RF and low frequency required by the module are completed through the wiring between and within the dielectric plate layers. Finally, 128 arrays are fabricated and verified by multi-channel passive test. The results show that the type transceiver module integrating with two-dimensional sum difference network has good performance, and 128 channels have excellent amplitude and phase characteristics. The integration technology has the characteristics of lightweight, miniaturization, high integration and low manufacturing cost. It can be widely used in miniaturized phased array antennas. </div>展开更多
Freestanding oxide thin films represent a revolutionary platform for next-generation high-performance electronics,offering unparalleled electrical,optical,and mechanical properties.However,realizing their full potenti...Freestanding oxide thin films represent a revolutionary platform for next-generation high-performance electronics,offering unparalleled electrical,optical,and mechanical properties.However,realizing their full potential hinges on overcoming key challenges in scalable fabrication,controlled release,and damage-free integration-particularly when interfacing with delicate two-dimensional(2D)materials or nanoarchitected devices.This review highlights cutting-edge strategies to address these barriers,with a central focus on van der Waals(vdW)integration as a transformative paradigm.Established fabrication techniques-including mechanical exfoliation,chemical vapor synthesis,remote epitaxy,and sacrificial layer-based wet-etching are critically analyzed,while persistent limitations are dissected such as strain control,interface stability,crystalline integrity,and thickness precision.The significant advantages offered by vdW integration are underscored,particularly in reducing carrier scattering,enhancing device performance,and enabling novel functionalities.Successful applications in transistors,memristors,and flexible devices are presented,demonstrating the transformative potential of freestanding oxides.Finally,future pathways are outlined for optimizing fabrication processes and developing scalable manufacturing techniques.These advancements are crucial for unlocking broader applications in disruptive technologies,ultimately positioning freestanding oxides integrated with 2D materials as pivotal hybrid material platform for future electronics.展开更多
Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the ...Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the evolution of M3D integration from traditional bulk semiconductors to low-dimensional materials like two-dimensioanl(2D)transition metal dichalcogenides(TMDCs)and carbon nanotubes(CNTs).Key applications include logic circuits,static random access memory(SRAM),resistive random access memory(RRAM),sensors,optoelectronics,and artificial intelligence(AI)processing.M3D integration enhances device performance by reducing footprint,improving power efficiency,and alleviating the von Neumann bottleneck.The integration of 2D materials in M3D structures demonstrates significant advancements in terms of scalability,energy efficiency,and functional diversity.Challenges in manufacturing and scaling are discussed,along with prospects for future research directions.Overall,the M3D integration with low-dimensional materials presents a promising pathway for the development of next-generation electronic devices and systems.展开更多
Graphene and other two-dimensional materials have recently emerged as promising candidates for next-generation, high-performance photonics. In this paper, the progress of research into photodetectors and other electro...Graphene and other two-dimensional materials have recently emerged as promising candidates for next-generation, high-performance photonics. In this paper, the progress of research into photodetectors and other electro-optical devices based on graphene integrated silicon photonics is briefly reviewed. We discuss the performance metrics, photo-response mechanisms, and experimental results of the latest graphene photodetectors integrated with silicon photonics, We also lay out the unavoidable performance trade-offs in meeting the requirements of various applications. In addition, we describe other opto-electronic devices based on this idea. Integrating two-dimensional materials with a silicon platform provides new opportunities in advanced integrated photonics.展开更多
Vertical three-dimensional(3D)integration is a highly attractive strategy to integrate a large number of transistor devices per unit area.This approach has emerged to accommodate the higher demand of data processing c...Vertical three-dimensional(3D)integration is a highly attractive strategy to integrate a large number of transistor devices per unit area.This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation.A huge number of research efforts have been attempted to demonstrate vertically stacked electronics in the last two decades.In this review,we revisit materials and devices for the vertically integrated electronics with an emphasis on the emerging semiconductor materials that can be processable by bottom-up fabrication methods,which are suitable for future flexible and wearable electronics.The vertically stacked integrated circuits are reviewed based on the semiconductor materials:organic semiconductors,carbon nanotubes,metal oxide semiconductors,and atomically thin two-dimensional materials including transi-tion metal dichalcogenides.The features,device performance,and fabrication methods for 3D integration of the transistor based on each semiconductor are discussed.Moreover,we highlight recent advances that can be important milestones in the vertically integrated elec-tronics including advanced integrated circuits,sensors,and display systems.There are remaining challenges to overcome;however,we believe that the vertical 3D integration based on emerging semiconductor materials and devices can be a promising strategy for future electronics.展开更多
With the unprecedented increasing demand for extremely fast processing speed and huge data capacity,traditional silicon-based information technology is becoming saturated due to the encountered bottle-necks of Moore&#...With the unprecedented increasing demand for extremely fast processing speed and huge data capacity,traditional silicon-based information technology is becoming saturated due to the encountered bottle-necks of Moore's Law.New material systems and new device architectures are considered promising strategies for this challenge.Two-dimensional(2D)materials are layered materials and garnered persistent attention in recent years owing to their advantages in ultrathin body,strong light-matter interaction,flexible integration,and ultrabroad operation wavelength range.To this end,the integra-tion of 2D materials into silicon-based platforms opens a new path for silicon photonic integration.In this work,a comprehensive review is given of the recent signs of progress related to 2D material inte-grated optoelectronic devices and their potential applications in silicon photonics.Firstly,the basic op-tical properties of 2D materials and heterostructures are summarized in the first part.Then,the state-of-the-art three typical 2D optoelectronic devices for silicon photonic applications are reviewed in detail.Finally,the perspective and challenges for the aim of 3D monolithic heterogeneous integration of these 2D optoelectronic devices are discussed.展开更多
A nonlinear problem of mean-square approximation of a real nonnegative continuous function with respect to two variables by the modulus of double Fourier integral dependent on two real parameters with use of the smoot...A nonlinear problem of mean-square approximation of a real nonnegative continuous function with respect to two variables by the modulus of double Fourier integral dependent on two real parameters with use of the smoothing functional is studied. Finding the optimal solutions of this problem is reduced to solution of the Hammerstein type two-dimensional nonlinear integral equation. The numerical algorithms to find the branching lines and branching-off solutions of this equation are constructed and justified. Numerical examples are presented.展开更多
Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for t...Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for the post-Moore era,offering significant potential in domains such as integrated circuits and next-generation computing.Here,in this review,the progress of 2D semiconductors in process engineering and various electronic applications are summarized.A careful introduction of material synthesis,transistor engineering focused on device configuration,dielectric engineering,contact engineering,and material integration are given first.Then 2D transistors for certain electronic applications including digital and analog circuits,heterogeneous integration chips,and sensing circuits are discussed.Moreover,several promising applications(artificial intelligence chips and quantum chips)based on specific mechanism devices are introduced.Finally,the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed,and potential development pathways or roadmaps are further speculated and outlooked.展开更多
The heterogeneous integration of photonic integrated circuits(PICs)with a diverse range of optoelectronic materials has emerged as a transformative approach,propelling photonic chips toward larger scales,superior perf...The heterogeneous integration of photonic integrated circuits(PICs)with a diverse range of optoelectronic materials has emerged as a transformative approach,propelling photonic chips toward larger scales,superior performance,and advanced integration levels.Notably,two-dimensional(2D)materials,such as graphene,transition metal dichalcogenides(TMDCs),black phosphorus(BP),and hexagonal boron nitride(hBN),exhibit remarkable device performance and integration capabilities,offering promising potential for large-scale implementation in PICs.In this paper,we first present a comprehensive review of recent progress,systematically categorizing the integration of photonic circuits with 2D materials based on their types while also emphasizing their unique advantages.Then,we discuss the integration approaches of 2D materials with PICs.We also summarize the technical challenges in the heterogeneous integration of 2D materials in photonics and envision their immense potential for future applications in PICs.展开更多
As we enter the post-Moore era,heterogeneous optoelectronic integrated circuits(OEICs)are attracting significant attention as an alternative approach to scaling to smaller-sized transistors.Two-dimensional(2D)material...As we enter the post-Moore era,heterogeneous optoelectronic integrated circuits(OEICs)are attracting significant attention as an alternative approach to scaling to smaller-sized transistors.Two-dimensional(2D)materials,offering a range of intriguing optoelectronic properties as semiconductors,semimetals,and insulators,provide great potential for developing nextgeneration heterogeneous OEICs.For instance,Fermi levels of 2D materials can be tuned by applying electrical voltages,while their atomically thin geometries are inherently suited for the fabrication of planar devices without suffering from lattice mismatch.Since the first graphene-on-silicon OEICs were demonstrated in 2011,2D-material heterogeneous OEICs have significantly progressed.To date,researchers have a better understanding of the importance of interface states on the optical properties of chip-integrated 2D materials.Moreover,there has been impressive progress towards the use of 2D materials for waveguide-integrated lasers,modulators,and photodetectors.In this review,we summarize the history,status,and trend of integrated optoelectronics with 2D materials.展开更多
Two-dimensional(2D)nanomaterials have attracted a great deal of attention since the discovery of graphene in 2004,due to their intriguing physicochemical properties and wide-ranging applications in catalysis,energy-re...Two-dimensional(2D)nanomaterials have attracted a great deal of attention since the discovery of graphene in 2004,due to their intriguing physicochemical properties and wide-ranging applications in catalysis,energy-related devices,electronics and optoelectronics.To maximize the potential of 2D nanomaterials for their technological applications,controlled assembly of 2D nanobulding blocks into integrated systems is critically needed.This mini review summarizes the reported strategies of 2D materials-based assembly into integrated functional nanostructures,from in-situ assembly method to post-synthesis assembly.The applications of 2D assembled integrated structures are also covered,especially in the areas of energy,electronics and sensing,and we conclude with discussion on the remaining challenges and potential directions in this emerging field.展开更多
Traditional scheduling algorithms for avionics communication have the shortcoming of messages accumulation,the efficiency and reliability of the service can be improved by combining the distributed integrated modular ...Traditional scheduling algorithms for avionics communication have the shortcoming of messages accumulation,the efficiency and reliability of the service can be improved by combining the distributed integrated modular avionics(DIMA)system with a time trigger mechanism.To further improve the utilization of system resources,the static scheduling algorithm of time triggered service is studied.By making the time trigger message schedule dispersedly,the stabilities of both the available time slots for the event triggered messages and the system will be improved.An improved two-dimensional bin packing algorithm is also presented to achieve the above-mentioned purpose with an extra benefit of better delay performance.展开更多
基金supported by the National Science Foundation of China(Nos.62304151,62204170,and 62474124)the Natural Science Foundation of Tianjin(No.24JCQNJC00520)+3 种基金the China Postdoctoral Science Foundation(No.2023M742585)the Open Project of State Key Laboratory of Transducer Technology(No.SKT2208)the open research of Songshan Lake Materials Laboratory(No.2023SLABFK07)the State Key Laboratory of Fluid Power and Mechatronic Systems(No.GZKF-202327).
文摘Two-dimensional transition metal dichalcogenides(TMDs)have shown great potential for application in the next generation of electronics and optoelectronics due to their atomically thin thickness,tunable band gap,and strong light-matter interaction.However,their practical application is still limited by challenges such as the constraints of high-temperature synthesis processes,compatibility issues of p-type/n-type doping strategies,and insufficient nanoscale patterning accuracy.Plasma treatment has become a key technology to break through these bottlenecks with its unique advantages such as low-temperature operation capability,generation of highly active reactive species and precise controllability of multiple parameters.This review comprehensively reviews the latest progress in plasma engineering of TMDs(MoS_(2),WS_(2),WSe_(2),etc.)based on a systematic“fundamental process-property modulation-device innovation”framework.The key plasma technologies are highlighted:plasma-enhanced chemical vapor deposition(PECVD)for low-temperature growth,bidirectional doping achieved through active species regulation,atomic layer precision etching,and defect engineering.The regulation mechanism of plasma on the intrinsic properties of materials is systematically analyzed,including electronic structure modification,optical property optimization(such as photoluminescence enhancement)and structural feature evolution.It then reveals how plasma technology promotes device innovation:achieving customizable structures(p-n junctions,sub-10 nanometer channels),optimizing interface properties(reducing contact resistance,integrating high-k dielectrics),and significantly improving the performance of gas sensors,photodetectors and neuromorphic computing systems.Finally,this article looks forward to future research directions,emphasizing that plasma technology is a versatile and indispensable platform for promoting TMDs towards practical applications.
基金the support from the National Natural Science Foundation of China(22272004,62272041)the Fundamental Research Funds for the Central Universities(YWF-22-L-1256)+1 种基金the National Key R&D Program of China(2023YFC3402600)the Beijing Institute of Technology Research Fund Program for Young Scholars(No.1870011182126)。
文摘The proliferation of wearable biodevices has boosted the development of soft,innovative,and multifunctional materials for human health monitoring.The integration of wearable sensors with intelligent systems is an overwhelming tendency,providing powerful tools for remote health monitoring and personal health management.Among many candidates,two-dimensional(2D)materials stand out due to several exotic mechanical,electrical,optical,and chemical properties that can be efficiently integrated into atomic-thin films.While previous reviews on 2D materials for biodevices primarily focus on conventional configurations and materials like graphene,the rapid development of new 2D materials with exotic properties has opened up novel applications,particularly in smart interaction and integrated functionalities.This review aims to consolidate recent progress,highlight the unique advantages of 2D materials,and guide future research by discussing existing challenges and opportunities in applying 2D materials for smart wearable biodevices.We begin with an in-depth analysis of the advantages,sensing mechanisms,and potential applications of 2D materials in wearable biodevice fabrication.Following this,we systematically discuss state-of-the-art biodevices based on 2D materials for monitoring various physiological signals within the human body.Special attention is given to showcasing the integration of multi-functionality in 2D smart devices,mainly including self-power supply,integrated diagnosis/treatment,and human–machine interaction.Finally,the review concludes with a concise summary of existing challenges and prospective solutions concerning the utilization of2D materials for advanced biodevices.
文摘In recent years, with the level of science and technology progress, largely to promote the development of animation techniques. Animated film is divided into two-dimensional animation and three-dimensional animation, both in the retention feature animated films, based on the performance of each with different strengths, thus forming a different artistic style. Wherein the two-dimensional animation is the most common one is the most basic form of expression in animation technology is relatively mature and complete, but because of the development of animation techniques, two-dimensional animation can not meet the needs of the audience. Thus, the effective combination of two-dimensional animation and three-dimensional animation technology, the advantages of integration between the two is particularly important, so that innovation in the form of screen performance, enhance audio-visual experience. In this paper, two-dimensional animation and three-dimensional animation skills fusion analysis and research, and put forward a number of specific observations, in order to learn.
基金Supported in part by the State Key Development Program for Basic Research of China(2012CB720505)the National Natural Science Foundation of China(61174105,60874049)
文摘Based on the two-dimensional （2D） system theory, an integrated predictive iterative learning control （2D-IPILC） strategy for batch processes is presented. First, the output response and the error transition model predictions along the batch index can be calculated analytically due to the 2D Roesser model of the batch process. Then, an integrated framework of combining iterative learning control （ILC） and model predictive control （MPC） is formed reasonably. The output of feedforward ILC is estimated on the basis of the predefined process 2D model. By min- imizing a quadratic objective function, the feedback MPC is introduced to obtain better control performance for tracking problem of batch processes. Simulations on a typical batch reactor demonstrate that the satisfactory tracking performance as well as faster convergence speed can be achieved than traditional proportion type （P- t-we） ILC despite the model error and disturbances.
文摘The integrability character of nonlinear equations of motion of two-dimensional gravity with dynamical torsion and bosonic string coupling is studied in this paper. The space-like and time-like first integrals of equations of motion are also found.
基金Project supported by the National Natural Science Foundation of China(No.K19672007)
文摘Because exact analytic solution is not available, we use double expansion and boundary collocation to construct an approximate solution for a class of two-dimensional dual integral equations in mathematical physics. The integral equations by this procedure are reduced to infinite algebraic equations. The accuracy of the solution lies in the boundary collocation technique. The application of which for some complicated initialboundary value problems in solid mechanics indicates the method is powerful.
文摘In this paper,the approximate solutions for two different type of two-dimensional nonlinear integral equations:two-dimensional nonlinear Volterra-Fredholm integral equations and the nonlinear mixed Volterra-Fredholm integral equations are obtained using the Laguerre wavelet method.To do this,these two-dimensional nonlinear integral equations are transformed into a system of nonlinear algebraic equations in matrix form.By solving these systems,unknown coefficients are obtained.Also,some theorems are proved for convergence analysis.Some numerical examples are presented and results are compared with the analytical solution to demonstrate the validity and applicability of the proposed method.
文摘<div style="text-align:justify;"> Transceiver module and two-dimensional sum difference network are important components of phased array antenna. In this paper, multilayer printed board is used to integrate millimeter wave multi-channel transceiver circuit and sum difference network. The interconnection between them is realized through RF coaxial vertical transition. At the same time, the heat dissipation design and inter channel shielding design of the module are carried out. The RF and low frequency required by the module are completed through the wiring between and within the dielectric plate layers. Finally, 128 arrays are fabricated and verified by multi-channel passive test. The results show that the type transceiver module integrating with two-dimensional sum difference network has good performance, and 128 channels have excellent amplitude and phase characteristics. The integration technology has the characteristics of lightweight, miniaturization, high integration and low manufacturing cost. It can be widely used in miniaturized phased array antennas. </div>
基金support from Zhejiang Provincial Natural Science Foundation of China(No.LMS25E020003)Wenzhou Fundamental Scientific Research Projects(No.G20240021)the National Natural Science Foundation of China(Nos.52072272 and 52331009).
文摘Freestanding oxide thin films represent a revolutionary platform for next-generation high-performance electronics,offering unparalleled electrical,optical,and mechanical properties.However,realizing their full potential hinges on overcoming key challenges in scalable fabrication,controlled release,and damage-free integration-particularly when interfacing with delicate two-dimensional(2D)materials or nanoarchitected devices.This review highlights cutting-edge strategies to address these barriers,with a central focus on van der Waals(vdW)integration as a transformative paradigm.Established fabrication techniques-including mechanical exfoliation,chemical vapor synthesis,remote epitaxy,and sacrificial layer-based wet-etching are critically analyzed,while persistent limitations are dissected such as strain control,interface stability,crystalline integrity,and thickness precision.The significant advantages offered by vdW integration are underscored,particularly in reducing carrier scattering,enhancing device performance,and enabling novel functionalities.Successful applications in transistors,memristors,and flexible devices are presented,demonstrating the transformative potential of freestanding oxides.Finally,future pathways are outlined for optimizing fabrication processes and developing scalable manufacturing techniques.These advancements are crucial for unlocking broader applications in disruptive technologies,ultimately positioning freestanding oxides integrated with 2D materials as pivotal hybrid material platform for future electronics.
基金fundings from the National Natural Science Foundation of China(Nos.62274013 and 92163206)the National Key Research and Development Program of China(No.2023YFB3405600)Science Fund for Creative Research Groups of the National Natural Science Foundation of China(No.12321004)。
文摘Monolithic three-dimensional(M3D)integration represents a transformative approach in semiconductor technology,enabling the vertical integration of diverse functionalities within a single chip.This review explores the evolution of M3D integration from traditional bulk semiconductors to low-dimensional materials like two-dimensioanl(2D)transition metal dichalcogenides(TMDCs)and carbon nanotubes(CNTs).Key applications include logic circuits,static random access memory(SRAM),resistive random access memory(RRAM),sensors,optoelectronics,and artificial intelligence(AI)processing.M3D integration enhances device performance by reducing footprint,improving power efficiency,and alleviating the von Neumann bottleneck.The integration of 2D materials in M3D structures demonstrates significant advancements in terms of scalability,energy efficiency,and functional diversity.Challenges in manufacturing and scaling are discussed,along with prospects for future research directions.Overall,the M3D integration with low-dimensional materials presents a promising pathway for the development of next-generation electronic devices and systems.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61522507 and 11404264)
文摘Graphene and other two-dimensional materials have recently emerged as promising candidates for next-generation, high-performance photonics. In this paper, the progress of research into photodetectors and other electro-optical devices based on graphene integrated silicon photonics is briefly reviewed. We discuss the performance metrics, photo-response mechanisms, and experimental results of the latest graphene photodetectors integrated with silicon photonics, We also lay out the unavoidable performance trade-offs in meeting the requirements of various applications. In addition, we describe other opto-electronic devices based on this idea. Integrating two-dimensional materials with a silicon platform provides new opportunities in advanced integrated photonics.
基金This work was supported by the National Research Foundation of Korea(NRF)grants by the Korean Government(MSIT)(NRF-2021R1A6A3A14038580,NRF-2020R1A2C1101647)This work was supported by the Technology Innovation Program(00144300,Interface Technology of 3D Stacked Heterogeneous System for SCM-based Process-in-Memory)funded by the Ministry of Trade,Industry&Energy(MOTIE,Korea).
文摘Vertical three-dimensional(3D)integration is a highly attractive strategy to integrate a large number of transistor devices per unit area.This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation.A huge number of research efforts have been attempted to demonstrate vertically stacked electronics in the last two decades.In this review,we revisit materials and devices for the vertically integrated electronics with an emphasis on the emerging semiconductor materials that can be processable by bottom-up fabrication methods,which are suitable for future flexible and wearable electronics.The vertically stacked integrated circuits are reviewed based on the semiconductor materials:organic semiconductors,carbon nanotubes,metal oxide semiconductors,and atomically thin two-dimensional materials including transi-tion metal dichalcogenides.The features,device performance,and fabrication methods for 3D integration of the transistor based on each semiconductor are discussed.Moreover,we highlight recent advances that can be important milestones in the vertically integrated elec-tronics including advanced integrated circuits,sensors,and display systems.There are remaining challenges to overcome;however,we believe that the vertical 3D integration based on emerging semiconductor materials and devices can be a promising strategy for future electronics.
基金supported by the National Natural Science Foundation of China(Nos.52221001,U19A2090,62090035,52172140,51902098,62175061)the Key Program of the Hunan Provincial Science and Technology Department(Nos.2019XK2001,2020XK2001)+3 种基金the International Science and Technology Innovation Cooperation Base of Hunan Province(No.2018WK4004)the Outstanding Scholarship Program of Hunan Province(No.2021JJ10021)the Science and Technology Innovation Program of Hunan Province(No.2021RC3061)the Natural Science Foundation of Hunan Province(Nos.2022JJ30167,2021JJ20016).
文摘With the unprecedented increasing demand for extremely fast processing speed and huge data capacity,traditional silicon-based information technology is becoming saturated due to the encountered bottle-necks of Moore's Law.New material systems and new device architectures are considered promising strategies for this challenge.Two-dimensional(2D)materials are layered materials and garnered persistent attention in recent years owing to their advantages in ultrathin body,strong light-matter interaction,flexible integration,and ultrabroad operation wavelength range.To this end,the integra-tion of 2D materials into silicon-based platforms opens a new path for silicon photonic integration.In this work,a comprehensive review is given of the recent signs of progress related to 2D material inte-grated optoelectronic devices and their potential applications in silicon photonics.Firstly,the basic op-tical properties of 2D materials and heterostructures are summarized in the first part.Then,the state-of-the-art three typical 2D optoelectronic devices for silicon photonic applications are reviewed in detail.Finally,the perspective and challenges for the aim of 3D monolithic heterogeneous integration of these 2D optoelectronic devices are discussed.
文摘A nonlinear problem of mean-square approximation of a real nonnegative continuous function with respect to two variables by the modulus of double Fourier integral dependent on two real parameters with use of the smoothing functional is studied. Finding the optimal solutions of this problem is reduced to solution of the Hammerstein type two-dimensional nonlinear integral equation. The numerical algorithms to find the branching lines and branching-off solutions of this equation are constructed and justified. Numerical examples are presented.
基金supported in part by STI 2030-Major Projects under Grant 2022ZD0209200sponsored by Tsinghua-Toyota Joint Research Fund+12 种基金in part by National Natural Science Foundation of China under Grant 62374099, Grant 62022047, Grant U20A20168, Grant 51861145202, Grant 51821003, and Grant 62175219in part by the National Key R&D Program under Grant 2016YFA0200400in part by Beijing Natural Science-Xiaomi Innovation Joint Fund Grant L233009in part supported by Tsinghua University-Zhuhai Huafa Industrial Share Company Joint Institute for Architecture Optoelectronic Technologies (JIAOT KF202204)in part by the Daikin-Tsinghua Union Programin part sponsored by CIE-Tencent Robotics X Rhino-Bird Focused Research Programin part by the Guoqiang Institute, Tsinghua Universityin part by the Research Fund from Beijing Innovation Center for Future Chipin part by Shanxi “1331 Project” Key Subjects Constructionin part by the Youth Innovation Promotion Association of Chinese Academy of Sciences (2019120)the opening fund of Key Laboratory of Science and Technology on Silicon Devices, Chinese Academy of Sciencesin part by the project of MOE Innovation Platformin part by the State Key Laboratory of Integrated Chips and Systems
文摘Due to the constraints imposed by physical effects and performance degra certain limitations in sustaining the advancement of Moore’s law.Two-dimensional(2D)materials have emerged as highly promising candidates for the post-Moore era,offering significant potential in domains such as integrated circuits and next-generation computing.Here,in this review,the progress of 2D semiconductors in process engineering and various electronic applications are summarized.A careful introduction of material synthesis,transistor engineering focused on device configuration,dielectric engineering,contact engineering,and material integration are given first.Then 2D transistors for certain electronic applications including digital and analog circuits,heterogeneous integration chips,and sensing circuits are discussed.Moreover,several promising applications(artificial intelligence chips and quantum chips)based on specific mechanism devices are introduced.Finally,the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed,and potential development pathways or roadmaps are further speculated and outlooked.
文摘The heterogeneous integration of photonic integrated circuits(PICs)with a diverse range of optoelectronic materials has emerged as a transformative approach,propelling photonic chips toward larger scales,superior performance,and advanced integration levels.Notably,two-dimensional(2D)materials,such as graphene,transition metal dichalcogenides(TMDCs),black phosphorus(BP),and hexagonal boron nitride(hBN),exhibit remarkable device performance and integration capabilities,offering promising potential for large-scale implementation in PICs.In this paper,we first present a comprehensive review of recent progress,systematically categorizing the integration of photonic circuits with 2D materials based on their types while also emphasizing their unique advantages.Then,we discuss the integration approaches of 2D materials with PICs.We also summarize the technical challenges in the heterogeneous integration of 2D materials in photonics and envision their immense potential for future applications in PICs.
基金supported by the National Natural Science Foundation of China(62161160335,62175179,61922034,61805164,61805175)the Science and Technology Plan Project of Shenzhen(JCYJ20190808120801661)Hong Kong Research Grants Council(RGC)Research Grants(N_CUHK423/21)。
文摘As we enter the post-Moore era,heterogeneous optoelectronic integrated circuits(OEICs)are attracting significant attention as an alternative approach to scaling to smaller-sized transistors.Two-dimensional(2D)materials,offering a range of intriguing optoelectronic properties as semiconductors,semimetals,and insulators,provide great potential for developing nextgeneration heterogeneous OEICs.For instance,Fermi levels of 2D materials can be tuned by applying electrical voltages,while their atomically thin geometries are inherently suited for the fabrication of planar devices without suffering from lattice mismatch.Since the first graphene-on-silicon OEICs were demonstrated in 2011,2D-material heterogeneous OEICs have significantly progressed.To date,researchers have a better understanding of the importance of interface states on the optical properties of chip-integrated 2D materials.Moreover,there has been impressive progress towards the use of 2D materials for waveguide-integrated lasers,modulators,and photodetectors.In this review,we summarize the history,status,and trend of integrated optoelectronics with 2D materials.
基金G.Y.acknowledges the funding support from the U.S.Department of Energy,Office of Science,Basic Energy Sciences under Award DE-SC0019019,Camille Dreyfus Teacher-Scholar Award.
文摘Two-dimensional(2D)nanomaterials have attracted a great deal of attention since the discovery of graphene in 2004,due to their intriguing physicochemical properties and wide-ranging applications in catalysis,energy-related devices,electronics and optoelectronics.To maximize the potential of 2D nanomaterials for their technological applications,controlled assembly of 2D nanobulding blocks into integrated systems is critically needed.This mini review summarizes the reported strategies of 2D materials-based assembly into integrated functional nanostructures,from in-situ assembly method to post-synthesis assembly.The applications of 2D assembled integrated structures are also covered,especially in the areas of energy,electronics and sensing,and we conclude with discussion on the remaining challenges and potential directions in this emerging field.
基金Supported by Joint Fundation for Equipment Pre-research of Aerospace Science and Technology
文摘Traditional scheduling algorithms for avionics communication have the shortcoming of messages accumulation,the efficiency and reliability of the service can be improved by combining the distributed integrated modular avionics(DIMA)system with a time trigger mechanism.To further improve the utilization of system resources,the static scheduling algorithm of time triggered service is studied.By making the time trigger message schedule dispersedly,the stabilities of both the available time slots for the event triggered messages and the system will be improved.An improved two-dimensional bin packing algorithm is also presented to achieve the above-mentioned purpose with an extra benefit of better delay performance.
