By controlling Dy vapor deposition process, the amount of Dy that diffused into the magnet was increased gradually from 0.1 wt.% to 0.3 wt.%. Compared with the original status, the coercivity increment was not proport...By controlling Dy vapor deposition process, the amount of Dy that diffused into the magnet was increased gradually from 0.1 wt.% to 0.3 wt.%. Compared with the original status, the coercivity increment was not proportional to the Dy diffusion amount. Subsequent H（cj） and Dy content gradient data showed that slope of the 0.3 wt.% sample gradient was bigger than that of 0.1 wt.% one, and the gaps between outer flakes and inner flakes enlarged with the increasement of Dy diffusion amount. Although Dy mostly enriched in triple-junction regions in electron-probe microscope analysis（EPMA） images, the following Auger depth graph showed that Dy content was as high as 3.0 at.% in 1.5 mm deep center. It proved that Dy tended to get into the main phase rather than stayed in the grain boundary during the diffusion process, and over-diffusion of Dy in the main phase was unhelpful for the coercivity enhancement.展开更多
文摘By controlling Dy vapor deposition process, the amount of Dy that diffused into the magnet was increased gradually from 0.1 wt.% to 0.3 wt.%. Compared with the original status, the coercivity increment was not proportional to the Dy diffusion amount. Subsequent H（cj） and Dy content gradient data showed that slope of the 0.3 wt.% sample gradient was bigger than that of 0.1 wt.% one, and the gaps between outer flakes and inner flakes enlarged with the increasement of Dy diffusion amount. Although Dy mostly enriched in triple-junction regions in electron-probe microscope analysis（EPMA） images, the following Auger depth graph showed that Dy content was as high as 3.0 at.% in 1.5 mm deep center. It proved that Dy tended to get into the main phase rather than stayed in the grain boundary during the diffusion process, and over-diffusion of Dy in the main phase was unhelpful for the coercivity enhancement.
