We present the design consideration and fabrication of 4H-SiC trenched-and-implanted vertical junction field-effect transistors （TI-VJFETs）. Different design factors, including channel width, channel doping, and mes...We present the design consideration and fabrication of 4H-SiC trenched-and-implanted vertical junction field-effect transistors （TI-VJFETs）. Different design factors, including channel width, channel doping, and mesa height, are con- sidered and evaluated by numerical simulations. Based on the simulation result, normally-on and normally-off devices are fabricated. The fabricated device has a 12 μm thick drift layer with 8 × 10^15 cm^-3 N-type doping and 2.6 μm channel length. The normally-on device shows a 1.2 kV blocking capability with a minimum on-state resistance of 2.33 mΩ.cm2, while the normally-off device shows an on-state resistance of 3.85 mΩ.cm2. Both the on-state and the blocking performances of the device are close to the state-of-the-art values in this voltage range.展开更多
基金supported by the National High Technology Research and Development Program of China(Grant No.2011AA050401)the National Science Fundfor Distinguished Young Scholars,China(Grant No.51225701)
文摘We present the design consideration and fabrication of 4H-SiC trenched-and-implanted vertical junction field-effect transistors （TI-VJFETs）. Different design factors, including channel width, channel doping, and mesa height, are con- sidered and evaluated by numerical simulations. Based on the simulation result, normally-on and normally-off devices are fabricated. The fabricated device has a 12 μm thick drift layer with 8 × 10^15 cm^-3 N-type doping and 2.6 μm channel length. The normally-on device shows a 1.2 kV blocking capability with a minimum on-state resistance of 2.33 mΩ.cm2, while the normally-off device shows an on-state resistance of 3.85 mΩ.cm2. Both the on-state and the blocking performances of the device are close to the state-of-the-art values in this voltage range.
