A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transist...A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transistors. The chip is designed to provide standard framing and mapping of 10/100/1000Mbit/s Ethernet, Resilient Packet Ring （RPR） and E1 traffics into protected Synchronous Digital Hierarchy （SDH） STM-1 transport payloads using hitless rate adaptation for optimum bandwidth utilization. It consumes 4W of power on average and utilizes 756 pin enhanced BGA package.展开更多
The research system based on intelligent handheld devices combined with a portable infrared camera, relying on the intelligent shipment inspection control platform of direct testing of the infrared spectrum of acquisi...The research system based on intelligent handheld devices combined with a portable infrared camera, relying on the intelligent shipment inspection control platform of direct testing of the infrared spectrum of acquisition and analysis, to provide intelligent auxiliary judgment for equipment overheating, effectively avoid the tedious report late processing and upload process, improve the efficiency and accuracy of the field work, has a good application prospect and popularization value.展开更多
文摘A highly integrated monolithic Multi-Service Transport Platform （MSTP） Application Specified Integrated Circuit （AS1C） MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×10^6 transistors. The chip is designed to provide standard framing and mapping of 10/100/1000Mbit/s Ethernet, Resilient Packet Ring （RPR） and E1 traffics into protected Synchronous Digital Hierarchy （SDH） STM-1 transport payloads using hitless rate adaptation for optimum bandwidth utilization. It consumes 4W of power on average and utilizes 756 pin enhanced BGA package.
文摘The research system based on intelligent handheld devices combined with a portable infrared camera, relying on the intelligent shipment inspection control platform of direct testing of the infrared spectrum of acquisition and analysis, to provide intelligent auxiliary judgment for equipment overheating, effectively avoid the tedious report late processing and upload process, improve the efficiency and accuracy of the field work, has a good application prospect and popularization value.
