Based on the frequency-to-time mapping relation of the linearly chirped pulse, the temporal phase shift induced by a laser-excited wake in a helium gas jet is measured using a chirped-pulse spectral interferometry wi...Based on the frequency-to-time mapping relation of the linearly chirped pulse, the temporal phase shift induced by a laser-excited wake in a helium gas jet is measured using a chirped-pulse spectral interferometry with ～ 140 fs resolution over a temporal region of I ps in a single shot. In this measurement, the image of the wake is obtained with one-dimensional spatial resolution and temporal resolution limited only by the bandwidth and chirp of the pulse. The ＇bubbles＇ feature of the wake structure, along with multiple wakes excited by the main lobe and the side lobe of a laser focal-spot, is captured simultaneously.展开更多
Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as ...Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as foil thickness（35–140 μm） were studied on the microstructure of joint region and its mechanical properties. The solidification sequence in the joint region was found to be（i） formation of γ solid solution in the isothermally solidified zone, followed by（ii） ternary eutectic of γ ＋ Ni3 B ＋ Cr B, and finally（iii） binary eutectic of γ ＋ Ni3 Si in the athermally solidified zone. Fine Ni3 Si particles were also formed via a solid state transformation within the γ matrix in the vicinity of eutectic products. A deviation of isothermal solidification kinetics from the standard parabolic TLP model was observed by increasing the bonding temperature to 1170 °C, which resulted in the formation of eutectic constituents at the joint centerline.The analysis of mechanical and fractographic test results revealed that the samples with complete isothermal solidification exhibit the highest shear strength, whereas the hard eutectic constituents act as preferential failure sites and lead to a significant reduction in the joint shear strength in samples with incomplete isothermal solidification.展开更多
In this study, a two-step heating process is introduced for transient liquid phase ( TLP) diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating ...In this study, a two-step heating process is introduced for transient liquid phase ( TLP) diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9/ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend's strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.展开更多
Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti?6Al?4V using Cu?22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the mic...Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti?6Al?4V using Cu?22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Cu and Zn into Ti?6Al?4V and Al 2024 alloys followed by eutectic formation and isothermal solidification along the Cu?Zn/Al 2024 interface. The hardness of the joints at the interface increases with an increase in bonding time which can be attributed to formation of intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 and TiZn16 in the joint zone. Moreover, shear strength of the joint reaches the highest value of 37 MPa at bonding time of 60 min.展开更多
Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the ...Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).展开更多
This study focuses on the transient liquid phase(TLP)bonding of DD5 single-crystal superalloy to Cr Co Nibased medium-entropy alloy(MEA)using a BNi-2 filler alloy.The microstructure and mechanical properties of the TL...This study focuses on the transient liquid phase(TLP)bonding of DD5 single-crystal superalloy to Cr Co Nibased medium-entropy alloy(MEA)using a BNi-2 filler alloy.The microstructure and mechanical properties of the TLP-bonded DD5/MEA joint were evaluated,and the microstructural evolution mechanism was investigated.The formation of the isothermal solidification zone(ISZ)depended on the diffusion of the melting-point depressants(Si and B elements)from the liquid filler into the DD5 and MEA substrates,as well as the dissolution of the substrates.Boron diffused along theγchannel of DD5 and reacted to form M_(5)B_(3)boride,herein referred to as the diffusion-affected zone(DAZ I).Similarly,the Cr_(5)B_(3)boride precipitated in the Ni-rich MEA matrix adjacent to the MEA substrate(i.e.,DAZ II).Additionally,a coherent orientation of[0]_(BCY)//[011]_(FCC)and(002)_(BCY)//(200)_(FCC)was detected between M_(5)B_(3)boride with a body-centered tetragonal(BCT)structure and the face-centered cubic(FCC)matrix.The performance of the joint was dominated by the properties of the bonding seam.As the bonding time increased from 20to 80 min,the athermal solidification zone(including eutectic microstructure)was gradually replaced by the ISZ exhibiting excellent plastic deformation capability,and the shear strength of the joint was improved.The maximum shear strength(752 MPa)was achieved when the eutectic-free joint was bonded at 1050℃ for 80 min.The fracture morphology revealed a mixture mode,indicating the initiation of cracks in the DAZ II,mainly propagating in the ISZ,and passing through the DAZ I.展开更多
In order to investigate the microstructure evolution and gain complete isothermal solidification time, transient liquid phase （TLP） bonding of IN-738LC superalloy was carried out using powdered AMS 4777 as the fille...In order to investigate the microstructure evolution and gain complete isothermal solidification time, transient liquid phase （TLP） bonding of IN-738LC superalloy was carried out using powdered AMS 4777 as the filler metal. The influence of gap size and bonding time on the joints was investigated. For example, complete isothermal solidification time for 40μm gap size was obtained as 45 min. In the case of lack of completion of isothermal solidification step, the remained molten interlayer cooled in the bonding zone under non-equilibrium condition andγ–γ′ eutectic phase formed in that area. The relationship between gap size and holding time was not linear. With the increase in gap size, eutectic phase width became thicker. In the diffusion affected zone, a much larger amount of alloying elements were observed reaching a peak. These peaks might be due to the formation of boride or silicide intermetallic. With the increase in gap size, the time required for bonding will increase, so the alloying elements have more time for diffusion and distribution in farther areas. As a result, concentrations of alloying elements decreased slightly with the increase in the gap size. The present bi-phasic model did not properly predict the complete isothermal solidification time for IN-738LC-AMS 4777-IN-738LC TLP bonding system.展开更多
The transient liquid phase(TLP)bonding of CoCuFeMnNi high entropy alloy(HEA)was studied.The TLP bonding was performed using AWS BNi-2 interlayer at 1050℃ with the TLP bonding time of 20,60,180 and 240 min.The effect ...The transient liquid phase(TLP)bonding of CoCuFeMnNi high entropy alloy(HEA)was studied.The TLP bonding was performed using AWS BNi-2 interlayer at 1050℃ with the TLP bonding time of 20,60,180 and 240 min.The effect of bonding time on the joint microstructure was characterized by SEM and EDS.Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time.For samples bonded at 20,60 and 180 min,athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn3Si intermetallic compound.For all samples,theγsolid solution was formed in the isothermal solidification zone of the bonding zone.To evaluate the effect of TLP bonding time on mechanical properties of joints,the shear strength and micro-hardness of joints were measured.The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints.The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min,respectively.展开更多
This work has successfully proposed a solution to produce robust Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints optimized for a maximum operating temperature of 873 K;transient liquid phase bonding(TLPB)of Ti-6Al-...This work has successfully proposed a solution to produce robust Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints optimized for a maximum operating temperature of 873 K;transient liquid phase bonding(TLPB)of Ti-6Al-4V/Nb side was carried out with Cu and Ni fillers to suppress brittle intermetallic compounds(IMCs),whereas brazing of Nb/Si_(3)N_(4)side was performed using a highly ductile Ti-added Ag-rich filler for effective residual-stress relaxation.A sound yet simple one-step bonding process incorporating simul-taneous TLPB and brazing was achieved with a relatively short holding time of 10 min at 1213 K.TLPB of Ti-6Al-4V/Nb side with Cu and Ni foils of 2-μm-thick each as a laminated filler suppressed brittle Ti-based IMCs and developed a homogenized microstructure consisting mainly of(α+β)-Ti via isothermal solidification.Meanwhile,brazing of Nb/Si_(3)N_(4)side with 100-μm-thick SILVER-ABA filler(92.75Ag-5Cu-1Al-1.25Ti mass%)foil enhanced interfacial bonding with sufficient total Ti content and accommodated residual stress better than conventional eutectic Ag-Cu-based fillers,and it was verified by finite element analysis with consideration of materials’temperature-dependent elasto-plastic properties.All joints with a bonding area of 10 mm×10 mm were tested via symmetrical four-point bending from room temper-ature(RT)to 873 K fractured from Nb/Si_(3)N_(4)side.When re-heating the joints from RT to 673 K,frac-ture initiation gradually shifted from Si_(3)N_(4)towards interfacial-compounds/Si_(3)N_(4)interface and bending strengths maintained∼220 MPa as weakening of SILVER-ABA filler was compensated by residual-stress relaxation in Si_(3)N_(4).When tested at 873 K,joints fractured mainly across the Ag-rich solid solution in a ductile manner and bending strength degraded by∼20%to 171 MPa as weakening of SILVER-ABA filler dominated.展开更多
Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmen...Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.展开更多
The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process...The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid diffusion (stage 1), dissolution of interlayer and base metal (stage 2), isothermal solidification (stage 3) and homogenization (stage 4). The microstructure of the joint depends on the joint formation process (distinct stages). The plastic deformation and solid diffusion in stage 1 favoure the intimate contact at interfaces and liquid layer formation. The microstructure of joint consists of aluminium solid solution, alumina particle, Al 2Cu and MgAl 2O 4 compounds in stage 2. The most pronounced feature of joint microstructure in stage 3 is the alumina particle segregation in the center of the joint. The increase of joint shear strength with increasing bonding temperature is mainly attributed to improving the fluidity and wettability of liquid phase and decreasing the amount of Al 2Cu brittle phase in the joint. The principal reason of higher bonding temperature (>600 ℃) resulting in lowering obviously the joint shear strength is the widening of alumina particle segregation region that acts as a preferential site for failure. The increase of joint shear strength with increasing holding time is mainly associated with decreasing the amount of Al 2Cu brittle phase and promoting homogenization of joint.展开更多
Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times fro...Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.展开更多
Fatigue properties of Al7075-T6 alloy joined by temperature gradient transient liquid phase(TGTLP) diffusion bonding using liquid gallium interlayer was investigated. The fatigue specimen was jointed at 460 °C un...Fatigue properties of Al7075-T6 alloy joined by temperature gradient transient liquid phase(TGTLP) diffusion bonding using liquid gallium interlayer was investigated. The fatigue specimen was jointed at 460 °C under 10 MPa pressure for 10 min. The TLP bonded samples were homogenized at 465 °C for 2 h and then T6-heat treated. The fatigue life of Al7075-T6 alloy was determined as 107 cycles under 90 MPa while the fatigue life of TLP bonded sample under this stress amplitude was 1.2×106 cycles, which is about 10% of the total Al7075 alloy fatigue life. The fatigue fracture surfaces of Al7075 sample and TGTLP bonded sample were studied using scanning electron microscope to characterize the nucleation sites and crack growth stages in both samples.展开更多
Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was ...Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.展开更多
Partial transient liquid phase （PTLP） bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate ...Partial transient liquid phase （PTLP） bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885℃ under a pulsed pressure of 2-10 MPa within durations in the range of 2-8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the o- phase with a limit solubility of Nb, a sequence of Ti-Cu intermetallic phases and solid solutions of Ni and Cu in α＋β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 rain, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti-Cu intermetallics interface and spread to the interior of TiC cermet in a brittle cleavage manner.展开更多
Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetall...Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.展开更多
Ductile transient liquid phase(TLP)bonding joints reinforced by multiple precipitates were produced using novel pre-sintered coatings and Au-Si fillers;therefore,the highest strength of NiTi/sapphire joints brazed at ...Ductile transient liquid phase(TLP)bonding joints reinforced by multiple precipitates were produced using novel pre-sintered coatings and Au-Si fillers;therefore,the highest strength of NiTi/sapphire joints brazed at 460℃ for 30 min reached 72 MPa.The pre-sintering process improved the surface-active of sapphire by forming metastable Ti_(3)O and non-stoichiometric Al_(2)O_(3).The typical brazing seam consisted of O-rich compounds,TiSi_(2),and Ti-Ni-Si,wherein the O-rich phase featured different crystallinity depending on the oxygen content.The sapphire/seam interface was either a nanoscale diffusion region or a Si-rich amorphous layer.The breakdown of the Stokes-Einstein relation(SER)occurred,and the deviation from SER increased with a higher cooling rate.The influence of coating thickness was reflected in(i)the supercooling related to the viscosity and fractional exponent of liquids and(ii)the microstructural change of the joint related to the driving force for crystal growth.This work presented a new strategy for joining ceramics to metals at lower temperatures but using the joint at higher temperatures;furthermore,gave an insight into the microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint.展开更多
Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.M...Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.Microstructural evaluations using electron probe microanalysis(EPMA)and electron backscattered diffraction(EBSD)show that the central eutectic phases present in the athermally solidified zone(ASZ)are Ni_(3)B,Ni_(2)Si,and CrB,and the precipitates formed in the diffusion-affected zone(DAZ)are MoB,CrB_(2),and Mo_(2)B_(5).According to the results,decreasing the filler thickness as well as increasing the holding time helps realize the completion of isothermal solidification and reduction in the density of precipitates in the DAZ,leading to a joint with more uniform properties.Diffusion of boron and silicon to longer distances with increasing holding time causes the removal of Cr-rich borides in the DAZ and the formation of Mo-rich silicide at the joint interface.Decrease in hardness of ASZ and DAZ due to the elimination of brittle phases in these zones during long holding time causes more uniform hardness distribution in the joint area.The best results are obtained for the sample joined with the 35μm-thick filler metal for 640 min holding time.展开更多
The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and...The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.展开更多
The brazing of Al 2O 3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni 5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1 4231 573 K fo...The brazing of Al 2O 3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni 5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1 4231 573 K for 1120 min. The results show that the shear strength of the joint first increases and then decreases with increasing holding time and brazing temperature. The joint interface microstructure and elements distribution were investigated. It can be concluded that a composite structure, in which the base metals are solid solution Nb(V) and Nb(Ti) reinforced by Ni 2Ti, is formed when the brazing temperature is 1 473 K and holding time 15 min, and a satisfactory joint strength can be achieved. The interaction of Ti foil and Ni 5V foil leads to the formation of liquid eutectic phase with low melting point, at the same time the combination of Ti come from the interlayer with O atoms from Al 2O 3 results in the bonding of Al 2O 3 and Nb.展开更多
基金Supported by the National Natural Science Foundation of China under Grant No 61377102the Defense Industrial Technology Development Program under Grant No B1520133010
文摘Based on the frequency-to-time mapping relation of the linearly chirped pulse, the temporal phase shift induced by a laser-excited wake in a helium gas jet is measured using a chirped-pulse spectral interferometry with ～ 140 fs resolution over a temporal region of I ps in a single shot. In this measurement, the image of the wake is obtained with one-dimensional spatial resolution and temporal resolution limited only by the bandwidth and chirp of the pulse. The ＇bubbles＇ feature of the wake structure, along with multiple wakes excited by the main lobe and the side lobe of a laser focal-spot, is captured simultaneously.
文摘Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as foil thickness（35–140 μm） were studied on the microstructure of joint region and its mechanical properties. The solidification sequence in the joint region was found to be（i） formation of γ solid solution in the isothermally solidified zone, followed by（ii） ternary eutectic of γ ＋ Ni3 B ＋ Cr B, and finally（iii） binary eutectic of γ ＋ Ni3 Si in the athermally solidified zone. Fine Ni3 Si particles were also formed via a solid state transformation within the γ matrix in the vicinity of eutectic products. A deviation of isothermal solidification kinetics from the standard parabolic TLP model was observed by increasing the bonding temperature to 1170 °C, which resulted in the formation of eutectic constituents at the joint centerline.The analysis of mechanical and fractographic test results revealed that the samples with complete isothermal solidification exhibit the highest shear strength, whereas the hard eutectic constituents act as preferential failure sites and lead to a significant reduction in the joint shear strength in samples with incomplete isothermal solidification.
基金supported by the Natural Science Foundation of Henan Province(Grant No.152107000047)
文摘In this study, a two-step heating process is introduced for transient liquid phase ( TLP) diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9/ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend's strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.
文摘Transient liquid phase bonding of two dissimilar alloys Al 2024 and Ti?6Al?4V using Cu?22%Zn interlayer was carried out at 510 °C under vacuum of 0.01 Pa for various bonding time. In order to characterize the microstructure evolution in the joint zone, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) were applied. The results show that joint formation is attributed to the solid-state diffusion of Cu and Zn into Ti?6Al?4V and Al 2024 alloys followed by eutectic formation and isothermal solidification along the Cu?Zn/Al 2024 interface. The hardness of the joints at the interface increases with an increase in bonding time which can be attributed to formation of intermetallic compounds such as Al2Cu, TiCu3, Al4.2Cu3.2Zn0.7, Al0.71Zn0.29, Ti2Cu, TiAl3 and TiZn16 in the joint zone. Moreover, shear strength of the joint reaches the highest value of 37 MPa at bonding time of 60 min.
文摘Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).
基金supported by the fund of Natural Science Basic Research Program of Shaanxi(Grant No.2020JQ-190)National Natural Science Foundations of China(Grant Nos.51975480,52075449,and U1737205)China Postdoctoral Science Foundation funded project(Grant Nos.2019TQ0263,and 2020M683560)。
文摘This study focuses on the transient liquid phase(TLP)bonding of DD5 single-crystal superalloy to Cr Co Nibased medium-entropy alloy(MEA)using a BNi-2 filler alloy.The microstructure and mechanical properties of the TLP-bonded DD5/MEA joint were evaluated,and the microstructural evolution mechanism was investigated.The formation of the isothermal solidification zone(ISZ)depended on the diffusion of the melting-point depressants(Si and B elements)from the liquid filler into the DD5 and MEA substrates,as well as the dissolution of the substrates.Boron diffused along theγchannel of DD5 and reacted to form M_(5)B_(3)boride,herein referred to as the diffusion-affected zone(DAZ I).Similarly,the Cr_(5)B_(3)boride precipitated in the Ni-rich MEA matrix adjacent to the MEA substrate(i.e.,DAZ II).Additionally,a coherent orientation of[0]_(BCY)//[011]_(FCC)and(002)_(BCY)//(200)_(FCC)was detected between M_(5)B_(3)boride with a body-centered tetragonal(BCT)structure and the face-centered cubic(FCC)matrix.The performance of the joint was dominated by the properties of the bonding seam.As the bonding time increased from 20to 80 min,the athermal solidification zone(including eutectic microstructure)was gradually replaced by the ISZ exhibiting excellent plastic deformation capability,and the shear strength of the joint was improved.The maximum shear strength(752 MPa)was achieved when the eutectic-free joint was bonded at 1050℃ for 80 min.The fracture morphology revealed a mixture mode,indicating the initiation of cracks in the DAZ II,mainly propagating in the ISZ,and passing through the DAZ I.
文摘In order to investigate the microstructure evolution and gain complete isothermal solidification time, transient liquid phase （TLP） bonding of IN-738LC superalloy was carried out using powdered AMS 4777 as the filler metal. The influence of gap size and bonding time on the joints was investigated. For example, complete isothermal solidification time for 40μm gap size was obtained as 45 min. In the case of lack of completion of isothermal solidification step, the remained molten interlayer cooled in the bonding zone under non-equilibrium condition andγ–γ′ eutectic phase formed in that area. The relationship between gap size and holding time was not linear. With the increase in gap size, eutectic phase width became thicker. In the diffusion affected zone, a much larger amount of alloying elements were observed reaching a peak. These peaks might be due to the formation of boride or silicide intermetallic. With the increase in gap size, the time required for bonding will increase, so the alloying elements have more time for diffusion and distribution in farther areas. As a result, concentrations of alloying elements decreased slightly with the increase in the gap size. The present bi-phasic model did not properly predict the complete isothermal solidification time for IN-738LC-AMS 4777-IN-738LC TLP bonding system.
文摘The transient liquid phase(TLP)bonding of CoCuFeMnNi high entropy alloy(HEA)was studied.The TLP bonding was performed using AWS BNi-2 interlayer at 1050℃ with the TLP bonding time of 20,60,180 and 240 min.The effect of bonding time on the joint microstructure was characterized by SEM and EDS.Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time.For samples bonded at 20,60 and 180 min,athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn3Si intermetallic compound.For all samples,theγsolid solution was formed in the isothermal solidification zone of the bonding zone.To evaluate the effect of TLP bonding time on mechanical properties of joints,the shear strength and micro-hardness of joints were measured.The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints.The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min,respectively.
基金This work was financially supported by the Light Metal Educa-tional Foundation,Inc.of Japan.
文摘This work has successfully proposed a solution to produce robust Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints optimized for a maximum operating temperature of 873 K;transient liquid phase bonding(TLPB)of Ti-6Al-4V/Nb side was carried out with Cu and Ni fillers to suppress brittle intermetallic compounds(IMCs),whereas brazing of Nb/Si_(3)N_(4)side was performed using a highly ductile Ti-added Ag-rich filler for effective residual-stress relaxation.A sound yet simple one-step bonding process incorporating simul-taneous TLPB and brazing was achieved with a relatively short holding time of 10 min at 1213 K.TLPB of Ti-6Al-4V/Nb side with Cu and Ni foils of 2-μm-thick each as a laminated filler suppressed brittle Ti-based IMCs and developed a homogenized microstructure consisting mainly of(α+β)-Ti via isothermal solidification.Meanwhile,brazing of Nb/Si_(3)N_(4)side with 100-μm-thick SILVER-ABA filler(92.75Ag-5Cu-1Al-1.25Ti mass%)foil enhanced interfacial bonding with sufficient total Ti content and accommodated residual stress better than conventional eutectic Ag-Cu-based fillers,and it was verified by finite element analysis with consideration of materials’temperature-dependent elasto-plastic properties.All joints with a bonding area of 10 mm×10 mm were tested via symmetrical four-point bending from room temper-ature(RT)to 873 K fractured from Nb/Si_(3)N_(4)side.When re-heating the joints from RT to 673 K,frac-ture initiation gradually shifted from Si_(3)N_(4)towards interfacial-compounds/Si_(3)N_(4)interface and bending strengths maintained∼220 MPa as weakening of SILVER-ABA filler was compensated by residual-stress relaxation in Si_(3)N_(4).When tested at 873 K,joints fractured mainly across the Ag-rich solid solution in a ductile manner and bending strength degraded by∼20%to 171 MPa as weakening of SILVER-ABA filler dominated.
基金supported by the National Science and Technology Major Project(2017-VI-0009-0080)the Key-Area Research and Development Program of Guangdong Province(2019B010935001)+1 种基金Shenzhen Science and Technology Plan(Project No.JSGG20210802093205015)Industry and Information Technology Bureau of Shenzhen Municipality(Project No.201806071354163490).
文摘Nickel based single crystal superalloy is currently widely used as the material for turbine blades in aerospace engines.However,metallurgical defects during the manufacturing process and damage during harsh environmental service are inevitable challenges for turbine blades.Therefore,bonding techniques play a very important role in the manufacturing and repair of turbine blades.The transient liquid phase(TLP)bonding of DD5 Ni-based single crystal superalloy was performed using the designed H1 interlayer.A new third-generation Ni-based superalloy T1 powder was mixed with H1 powder as another interlayer to improve the mechanical properties of the bonded joints.The res-ults show that,such a designed H1 interlayer is beneficial to the improvement of shear strength of DD5 alloy bonded joints by adjusting the bonding temperature and the prolongation of holding time.The maximum shear strength at room temperature of the joint with H1 interlayer reached 681 MPa when bonded at 1260℃for 3 h.The addition of T1 powder can effectively reduce holding time or relatively lower bond-ing temperature,while maintaining relatively high shear strength.When 1 wt.%T1 powder was mixed into H1 interlayer,the maximum room temperature shear strength of the joint bonded at 1260℃reached 641 MPa,which could be obtained for only 1 h.Considering the bonding temperature and the efficiency,the acceptable process parameter of H1+5 wt.%T1 interlayer was 1240℃/2 h,and the room tem-perature shear strength reached 613 MPa.
文摘The formation process, microstructure and mechanical properties of transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joint with copper interlayer were investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid diffusion (stage 1), dissolution of interlayer and base metal (stage 2), isothermal solidification (stage 3) and homogenization (stage 4). The microstructure of the joint depends on the joint formation process (distinct stages). The plastic deformation and solid diffusion in stage 1 favoure the intimate contact at interfaces and liquid layer formation. The microstructure of joint consists of aluminium solid solution, alumina particle, Al 2Cu and MgAl 2O 4 compounds in stage 2. The most pronounced feature of joint microstructure in stage 3 is the alumina particle segregation in the center of the joint. The increase of joint shear strength with increasing bonding temperature is mainly attributed to improving the fluidity and wettability of liquid phase and decreasing the amount of Al 2Cu brittle phase in the joint. The principal reason of higher bonding temperature (>600 ℃) resulting in lowering obviously the joint shear strength is the widening of alumina particle segregation region that acts as a preferential site for failure. The increase of joint shear strength with increasing holding time is mainly associated with decreasing the amount of Al 2Cu brittle phase and promoting homogenization of joint.
文摘Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.
文摘Fatigue properties of Al7075-T6 alloy joined by temperature gradient transient liquid phase(TGTLP) diffusion bonding using liquid gallium interlayer was investigated. The fatigue specimen was jointed at 460 °C under 10 MPa pressure for 10 min. The TLP bonded samples were homogenized at 465 °C for 2 h and then T6-heat treated. The fatigue life of Al7075-T6 alloy was determined as 107 cycles under 90 MPa while the fatigue life of TLP bonded sample under this stress amplitude was 1.2×106 cycles, which is about 10% of the total Al7075 alloy fatigue life. The fatigue fracture surfaces of Al7075 sample and TGTLP bonded sample were studied using scanning electron microscope to characterize the nucleation sites and crack growth stages in both samples.
文摘Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.
基金Project(51421001)supported by the National Natural Science Foundation of ChinaProjects(106112015CDJXZ138803,106112015CDJXY130003)supported by the Fundamental Research Funds for the Central Universities,China
文摘Partial transient liquid phase （PTLP） bonding of TiC cermet to 06Cr19Ni10 stainless steel was carried out. Impulse pressuring was used to reduce the bonding time, and a Ti/Cu/Nb interlayer was employed to alleviate the detrimental effect of interfacial reaction products on the bonding strength. Successful bonding was achieved at 885℃ under a pulsed pressure of 2-10 MPa within durations in the range of 2-8 min, which was notably shortened in comparison with conventional PTLP bonding. Microstructure characterization revealed the o- phase with a limit solubility of Nb, a sequence of Ti-Cu intermetallic phases and solid solutions of Ni and Cu in α＋β Ti in the reaction zone. The maximum shear strength of 106.7 MPa was obtained when the joint was bonded for 5 rain, indicating that a robust metallurgical bonding was achieved. Upon shear loading, the joints fractured along the Ti-Cu intermetallics interface and spread to the interior of TiC cermet in a brittle cleavage manner.
基金Project(51375260) supported by the National Natural Science Foundation of China
文摘Transient liquid phase(TLP)bonding is a potential high-temperature(HT)electron packaging technology that is used inthe interconnection of wide band-gap semiconductors.This study focused on the mechanism of intermetallic compounds(IMCs)evolution in Ag/Sn TLP soldering at different temperatures.Experimental results indicated that morphologies of Ag3Sn grains mainlywere scallop-type,and some other shapes such as prism,needle,hollow column,sheet and wire of Ag3Sn grains were also observed,which was resulted from their anisotropic growths.However,the scallop-type Ag3Sn layer turned into more planar with prolongingsoldering time,due to grain coarsening and anisotropic mass flow of Ag atoms from substrate.Furthermore,a great amount ofnano-Ag3Sn particles were found on the surfaces of Ag3Sn grains,which were formed in Ag-rich areas of the molten Sn and adsorbedby the Ag3Sn grains during solidification process.Growth kinetics of the Ag3Sn IMCs in TLP soldering followed a parabolicrelationship with soldering time,and the growth rate constants of250,280and320°C were calculated as5.83×10-15m2/s,7.83×10-15m2/s and2.83×10-14m2/s,respectively.Accordingly,the activation energy of the reaction was estimated about58.89kJ/mol.
基金supported by the National MCF Energy R&D Program(No.2019YFE03100100)National Natural Science Foundation of China(NSFC,Nos.51975150,51974101,U21A20128,52175302,and 52105332)+2 种基金National Strategic International Science and Technology Innovation Cooperation Key Project(No.2020YFE0205304)Natural Science Foundation of Heilongjiang Province,China(Nos.JQ2020E003 and LH2020E037)Applied Basic Research Key Project of Yunnan(No.202002AB080001-1).
文摘Ductile transient liquid phase(TLP)bonding joints reinforced by multiple precipitates were produced using novel pre-sintered coatings and Au-Si fillers;therefore,the highest strength of NiTi/sapphire joints brazed at 460℃ for 30 min reached 72 MPa.The pre-sintering process improved the surface-active of sapphire by forming metastable Ti_(3)O and non-stoichiometric Al_(2)O_(3).The typical brazing seam consisted of O-rich compounds,TiSi_(2),and Ti-Ni-Si,wherein the O-rich phase featured different crystallinity depending on the oxygen content.The sapphire/seam interface was either a nanoscale diffusion region or a Si-rich amorphous layer.The breakdown of the Stokes-Einstein relation(SER)occurred,and the deviation from SER increased with a higher cooling rate.The influence of coating thickness was reflected in(i)the supercooling related to the viscosity and fractional exponent of liquids and(ii)the microstructural change of the joint related to the driving force for crystal growth.This work presented a new strategy for joining ceramics to metals at lower temperatures but using the joint at higher temperatures;furthermore,gave an insight into the microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint.
文摘Transient liquid phase(TLP)bonding was investigated in Hastelloy-X samples with different filler metal thicknesses(20,35,50,65,and 100μm)and holding time(5,20,80,320,and 640 min)to obtain optimum bonding parameters.Microstructural evaluations using electron probe microanalysis(EPMA)and electron backscattered diffraction(EBSD)show that the central eutectic phases present in the athermally solidified zone(ASZ)are Ni_(3)B,Ni_(2)Si,and CrB,and the precipitates formed in the diffusion-affected zone(DAZ)are MoB,CrB_(2),and Mo_(2)B_(5).According to the results,decreasing the filler thickness as well as increasing the holding time helps realize the completion of isothermal solidification and reduction in the density of precipitates in the DAZ,leading to a joint with more uniform properties.Diffusion of boron and silicon to longer distances with increasing holding time causes the removal of Cr-rich borides in the DAZ and the formation of Mo-rich silicide at the joint interface.Decrease in hardness of ASZ and DAZ due to the elimination of brittle phases in these zones during long holding time causes more uniform hardness distribution in the joint area.The best results are obtained for the sample joined with the 35μm-thick filler metal for 640 min holding time.
文摘The interfacial reactions in partial transient liquid-phase bonding of Si3N4 ceramics with Ti/Ni/Ti interlayers were studied by means of scanning electron microscopy （SEM）, energy dispersive spectrometry （EDS） and X-ray diffractometry （XRD）. It was shown that the interfacial structure of Si3N4/TiN/Ti5Si3+Ti5Si4 + Ni3Si/ （NiTi ） /Ni3Ti/ Ni was formed after bonding. The activation energies for TiN layer and the mixed reaction layer of Ti5Si3 + Ti5Si4 + Ni3Si are 546. 8 kJ/mol and 543. 9 kJ/mol, respectively. The formation and transition processes of interface layer sequence in the joint were clarified by diffusion path. An important characteristic, which is different from the conventional brazing and soid-state diffusion bonding, has been found, i. e., during the partial transient liquid-phase bonding, not only the reaction layers which have formed grow, but also the diffusion path in the subsequent reaction changes because of the remarkable variation of the concentration on the metal side.
文摘The brazing of Al 2O 3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni 5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1 4231 573 K for 1120 min. The results show that the shear strength of the joint first increases and then decreases with increasing holding time and brazing temperature. The joint interface microstructure and elements distribution were investigated. It can be concluded that a composite structure, in which the base metals are solid solution Nb(V) and Nb(Ti) reinforced by Ni 2Ti, is formed when the brazing temperature is 1 473 K and holding time 15 min, and a satisfactory joint strength can be achieved. The interaction of Ti foil and Ni 5V foil leads to the formation of liquid eutectic phase with low melting point, at the same time the combination of Ti come from the interlayer with O atoms from Al 2O 3 results in the bonding of Al 2O 3 and Nb.
