The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of...The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.展开更多
Photonic crystal[PC]laser diodes[LDs]exhibit high power and narrow divergence angle output.Enhancing their thermal characteristics is critical for improving device performance and reliability.In this study,we develop ...Photonic crystal[PC]laser diodes[LDs]exhibit high power and narrow divergence angle output.Enhancing their thermal characteristics is critical for improving device performance and reliability.In this study,we develop a 3D heat dissipation model for 976 nm PC LDs packaged in conduction-cooled heat sink mounts[CS-mounts].The steady-state thermal characteristics are simulated using the finite element method[FEM]to optimize heat sink dimensions and transition heat sink design.Through optimization,the heat sink volume is reduced by 83.3%,while heat dissipation efficiency is improved by18.2%.Under 60 A continuous-wave operation,the PC LD with the optimized heat dissipation structure achieves an output power of 48.2 W at 20°C with the thermal resistance of 1.17 K/W,and an output power of 54.5 W at 5℃ with the maximum power conversion efficiency of 62.4%.展开更多
Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determin...Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors＇ influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.展开更多
文摘The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion(CTE) are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.
基金supported by the National Key R&D Program of China(Nos.2021YFA1400604 and 2023YFB3610800)the Key R&D Program of Shandong Province(Nos.2023ZLYS03and 2022CXGC020104)。
文摘Photonic crystal[PC]laser diodes[LDs]exhibit high power and narrow divergence angle output.Enhancing their thermal characteristics is critical for improving device performance and reliability.In this study,we develop a 3D heat dissipation model for 976 nm PC LDs packaged in conduction-cooled heat sink mounts[CS-mounts].The steady-state thermal characteristics are simulated using the finite element method[FEM]to optimize heat sink dimensions and transition heat sink design.Through optimization,the heat sink volume is reduced by 83.3%,while heat dissipation efficiency is improved by18.2%.Under 60 A continuous-wave operation,the PC LD with the optimized heat dissipation structure achieves an output power of 48.2 W at 20°C with the thermal resistance of 1.17 K/W,and an output power of 54.5 W at 5℃ with the maximum power conversion efficiency of 62.4%.
基金Project supported by the National S&T Major Projects(No.2011ZX02709-2)the China National Science Foundation(No.61176098)
文摘Based on ANSYS and Icepak softwares, the numerical analysis method is used to build up the thermal analysis model of the 2.5D package, which contains a high power CPU chip. The focus of the research is on the determination of the contributing factors and their effects on the thermal resistance and heat distribution of the package. The parametric analysis illustrates that the substrate conductivity, TIM conductivity and fin height are more crucial for heat conduction in the package. Furthermore, these major parameters are compared and analyzed by orthogonal tests, and the optimal solution for 2.5D integration is proposed. The factors＇ influence patterns on thermal resistance, obtained in this article, could be utilized as a thermal design reference.
