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Elevating thermoelectric performance in the sub-ambient temperature range for electronic refrigeration 被引量:1
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作者 Xiaojing Ma Chenhao Lin +13 位作者 Hengyu Yang Yuhao Fu Kun Liang Xin Bao Sheng Ye Jian Wang Peng Zhao Jiang Chen Shizhen Zhi Longzhi Wu Sichen Duan Feng Cao Qian Zhang Jun Mao 《The Innovation》 2025年第5期47-52,46,共7页
Solid-state thermoelectric coolers,which enable direct heat pumping by utilizing electricity,play an essential role in electronic refrigeration.Given that these devices usually cool down to the sub-ambient temperature... Solid-state thermoelectric coolers,which enable direct heat pumping by utilizing electricity,play an essential role in electronic refrigeration.Given that these devices usually cool down to the sub-ambient temperature range,their performance is critically dependent on the material properties at temperatures below 300 K.Consequently,enhancing the thermoelectric properties of materials at sub-ambient temperature is of paramount importance for advancing cooling technology.Herein,a single-crystalline Mg_(3)Bi_(2)-based material has been prepared and exhibits high electron mobility.As a result,thermoelectric figure-of-merit values of~1.05 at 300 K and~0.87 at 250 K(along the ab plane)have been achieved,which are superior to commercial n-type Bi_(2)(Te,Se)_(3).Thermoelectric coolers(single-and double-stage devices)based on the n-type single-crystalline Mg_(3)Bi_(1.497)Sb_(0.5)Te_(0.003)and p-type(Bi,Sb)_(2)Te_(3)have been fabricated.The double-stage cooler demonstrates a remarkable maximum cooling temperature difference of~106.8 K at the hot-side temperature of 350 K,surpassing the performance of commercial Bi_(2)Te_(3)-based devices.Notably,the Mg_(3)Bi_(2)-based doublestage device exhibits exceptional cyclic stability,maintaining its cooling performance without any observable degradation after approximately 2,000 cycles between the input currents of 1 and 3 A.These findings show that single-crystalline Mg_(3)Bi_(2)alloys hold great promise for thermoelectric cooling applications. 展开更多
关键词 thermoelectric materials sub ambient temperature electron mobility direct heat pumping thermoelectric coolers cooling technologyhereina thermoelectric figure merit thermoelectric properties
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