High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor ...High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor topographical conformability to mating surfaces,limited deformability,large thickness,and low out-of-plane thermal conductivity,leading to high thermal resistance.Here,we fabricated a highly compressible 3D interconnected graphene lamellae network with abundant micro-bulges on its surface(SBGLN).The micro-bulges enable good topographical conformability to various solid substrates under pressure,and meanwhile,the lamellae can reconstruct the networks by deformation to enhance the out-of-plane thermal conductivity.Thus,the SBGLN achieves an ultra-low total thermal resistance of 0.081 cm^(2)K W^(−1)with a minimal bonding line thickness of 23μm,which are much better than those of previ-ously reported solid TIMs and state-of-the-art commercial TIMs.Moreover,it exhibits a negligible change in thermal resistance when subjected to heat shock at 160℃ for 80 h,in contrast to the 284%increase observed in thermal grease.These combined excellent properties,along with the ease of scaling up,establish the SBGLN as a highly reliable and high-performance solid TIMs for the thermal management of high-power electronics.展开更多
基金financially supported by the Guangdong Basic and Applied Basic Research Foundation(No.2020B0301030002)the National Key R&D Program of China(Nos.2022YFA1205301 and 2022YFA1205300)+1 种基金the National Natural Science Foundation of China(Nos.52188101 and 52273240)the LiaoNing Revitalization Talents Program(No.XLYC2201003).
文摘High-performance solid thermal interface materials(TIMs)are crucial for addressing overheating issues in high-power electronics,especially in extreme temperature environments.However,solid TIMs often suffer from poor topographical conformability to mating surfaces,limited deformability,large thickness,and low out-of-plane thermal conductivity,leading to high thermal resistance.Here,we fabricated a highly compressible 3D interconnected graphene lamellae network with abundant micro-bulges on its surface(SBGLN).The micro-bulges enable good topographical conformability to various solid substrates under pressure,and meanwhile,the lamellae can reconstruct the networks by deformation to enhance the out-of-plane thermal conductivity.Thus,the SBGLN achieves an ultra-low total thermal resistance of 0.081 cm^(2)K W^(−1)with a minimal bonding line thickness of 23μm,which are much better than those of previ-ously reported solid TIMs and state-of-the-art commercial TIMs.Moreover,it exhibits a negligible change in thermal resistance when subjected to heat shock at 160℃ for 80 h,in contrast to the 284%increase observed in thermal grease.These combined excellent properties,along with the ease of scaling up,establish the SBGLN as a highly reliable and high-performance solid TIMs for the thermal management of high-power electronics.
