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High-voltage super-junction lateral double-diffused metal-oxide semiconductor with a partial lightly doped pillar 被引量:3
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作者 伍伟 张波 +2 位作者 方健 罗小蓉 李肇基 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第6期633-636,共4页
A novel super-junction lateral double-diffused metal-oxide semiconductor (SJ-LDMOS) with a partial lightly doped P pillar (PD) is proposed. Firstly, the reduction in the partial P pillar charges ensures the charge... A novel super-junction lateral double-diffused metal-oxide semiconductor (SJ-LDMOS) with a partial lightly doped P pillar (PD) is proposed. Firstly, the reduction in the partial P pillar charges ensures the charge balance and suppresses the substrate-assisted depletion effect. Secondly, the new electric field peak produced by the P/P junction modulates the surface electric field distribution. Both of these result in a high breakdown voltage (BV). In addition, due to the same conduction paths, the specific on-resistance (Ron,sp) of the PD SJ-LDMOS is approximately identical to the conventional SJ-LDMOS. Simulation results indicate that the average value of the surface lateral electric field of the PD SJ-LDMOS reaches 20 V/μm at a 15 μm drift length, resulting in a BV of 300 V. 展开更多
关键词 super-junction lateral double-diffused metal-oxide semiconductor partial lightly doped pillar electric field modulation breakdown voltage
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Improved 4H-SiC UMOSFET with super-junction shield region 被引量:2
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作者 Pei Shen Ying Wang +3 位作者 Xing-Ji Li Jian-Qun Yang Cheng-Hao Yu Fei Cao 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第5期694-700,共7页
This article investigates an improved 4H-SiC trench gate metal–oxide–semiconductor field-effect transistor(MOSFET)(UMOSFET)fitted with a super-junction(SJ)shielded region.The modified structure is composed of two n-... This article investigates an improved 4H-SiC trench gate metal–oxide–semiconductor field-effect transistor(MOSFET)(UMOSFET)fitted with a super-junction(SJ)shielded region.The modified structure is composed of two n-type conductive pillars,three p-type conductive pillars,an oxide trench under the gate,and a light n-type current spreading layer(NCSL)under the p-body.The n-type conductive pillars and the light n-type current spreading layer provide two paths to and promote the diffusion of a transverse current in the epitaxial layer,thus improving the specific on-resistance(R_(on,sp)).There are three p-type pillars in the modified structure,with the p-type pillars on both sides playing the same role.The p-type conductive pillars relieve the electric field(E-field)in the corner of the trench bottom.Two-dimensional simulation(silvaco TCAD)indicates that Ron,sp of the modified structure,and breakdown voltage(V_(BR))are improved by 22.2%and 21.1%respectively,while the maximum figure of merit(FOM=V_(BR)^(2)/R_(on,sp)) is improved by 79.0%.Furthermore,the improved structure achieves a light smaller low gate-to-drain charge(Q_(gd))and when compared with the conventional UMOSFET(conventional-UMOS),it displays great advantages for reducing the switching energy loss.These advantages are due to the fact that the p-type conductive pillars and n-type conductive pillars configured under the gate provide a substantial charge balance,which also enables the charge carriers to be extracted quickly.In the end,under the condition of the same total charge quantity,the simulation comparison of gate charge and OFF-state characteristics between Gaussdoped structure and uniform-doped structure shows that Gauss-doped structure increases the V_(BR)of the device without degradation of dynamic performance. 展开更多
关键词 breakdown voltage specific on-resistance silicon carbide switching energy loss super-junction(SJ) trench gate MOSFET
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A deep trench super-junction LDMOS with double charge compensation layer 被引量:2
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作者 Lijuan Wu Shaolian Su +2 位作者 Xing Chen Jinsheng Zeng Haifeng Wu 《Journal of Semiconductors》 EI CAS CSCD 2022年第10期103-108,共6页
A deep trench super-junction LDMOS with double charge compensation layer(DC DT SJ LDMOS)is proposed in this paper.Due to the capacitance effect of the deep trench which is known as silicon-insulator-silicon(SIS)capaci... A deep trench super-junction LDMOS with double charge compensation layer(DC DT SJ LDMOS)is proposed in this paper.Due to the capacitance effect of the deep trench which is known as silicon-insulator-silicon(SIS)capacitance,the charge balance in the super-junction region of the conventional deep trench SJ LDMOS(Con.DT SJ LDMOS)device will be broken,resulting in breakdown voltage(BV)of the device drops.DC DT SJ LDMOS solves the SIS capacitance effect by adding a vertical variable doped charge compensation layer and a triangular charge compensation layer inside the Con.DT SJ LDMOS device.Therefore,the drift region reaches an ideal charge balance state again.The electric field is optimized by double charge compensation and gate field plate so that the breakdown voltage of the proposed device is improved sharply,meanwhile the enlarged on-current region reduces its specific on-resistance.The simulation results show that compared with the Con.DT SJ LD-MOS,the BV of the DC DT SJ LDMOS has been increased from 549.5 to 705.5 V,and the R_(on,sp) decreased to 23.7 mΩ·cm^(2). 展开更多
关键词 double charge compensation layer super-junction deep trench SIS capacitance
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New CMOS compatible super-junction LDMOST with n-type buried layer 被引量:1
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作者 段宝兴 张波 李肇基 《Chinese Physics B》 SCIE EI CAS CSCD 2007年第12期3754-3759,共6页
A new super-junction lateral double diffused MOSFET (LDMOST) structure is designed with n-type charge compensation layer embedded in the p^--substrate near the drain to suppress substrate-assisted depletion effect t... A new super-junction lateral double diffused MOSFET (LDMOST) structure is designed with n-type charge compensation layer embedded in the p^--substrate near the drain to suppress substrate-assisted depletion effect that results from the compensating charges imbalance between the pillars in the n-type buried layer. A high electric field peak is introduced in the surface by the pn junction between the p^--substrate and n-type buried layer, which given rise to a more uniform surface electric field distribution by modulation effect. The effect of reduced bulk field (REBULF) is introduced to improve the vertical breakdown voltage by reducing the high bulk electric field around the drain, The new structure features high breakdown voltage, low on-resistance and charges balance in the drift region due to n-type buried layer. 展开更多
关键词 super-junction LDMOST n-type buried layer REBULF breakdown voltage
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Improvement on short-circuit ability of SiC super-junction MOSFET with partially widened pillar structure 被引量:1
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作者 Xinxin Zuo Jiang Lu +6 位作者 Xiaoli Tian Yun Bai Guodong Cheng Hong Chen Yidan Tang Chengyue Yang Xinyu Liu 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第9期611-618,共8页
A novel 1200 V SiC super-junction(SJ)MOSFET with a partially widened pillar structure is proposed and investi-gated by using the two-dimensional numerical simulation tool.Based on the SiC SJ MOSFET structure,a partial... A novel 1200 V SiC super-junction(SJ)MOSFET with a partially widened pillar structure is proposed and investi-gated by using the two-dimensional numerical simulation tool.Based on the SiC SJ MOSFET structure,a partially widened P-region is added at the SJ pillar region to improve the short-circuit(SC)ability.After investigating the position and doping concentration of the widened P-region,an optimal structure is determined.From the simulation results,the SC withstand times(SCWTs)of the conventional trench MOSFET(CT-MOSFET),the SJ MOSFET,and the proposed structure at 800 V DC bus voltage are 15μs,17μs,and 24μs,respectively.The SCWTs of the proposed structure are increased by 60%and 41.2%in comparison with that of the other two structures.The main reason for the proposed structure with an enhanced SC capability is related to the effective suppression of saturation current at the high DC bias conditions by using a modu-lated P-pillar region.Meanwhile,a good Baliga's FOM(BV^(2)/R_(on))also can be achieved in the proposed structure due to the advantage of the SJ structure.In addition,the fabrication technology of the proposed structure is compatible with the standard epitaxy growth method used in the SJ MOSFET.As a result,the SJ structure with this feasible optimization skill presents an effect on improving the SC reliability of the SiC SJ MOSFET without the degeneration of the Baliga's FOM. 展开更多
关键词 silicon carbide(SiC) short-circuit(SC) super-junction(SJ) trench MOSFET
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A Novel Super-junction LDMOST Concept with Split p Columns
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作者 陈林 张波 郑欣 《Journal of Electronic Science and Technology of China》 2006年第2期169-172,共4页
In this paper, we propose a novel low on-resistance Super Junction (S J) Lateral Double-diffusion MOSFET (LDMOST) which has split p column structures with rated voltage of 60-100V. The key feature of this new stru... In this paper, we propose a novel low on-resistance Super Junction (S J) Lateral Double-diffusion MOSFET (LDMOST) which has split p column structures with rated voltage of 60-100V. The key feature of this new structure is that the split p column super junction primarily provides the low on-resistance path and it just locates at the surface of the drift region rather than the entire drift region. The manufacturing process of the device is relatively simple and is compatible with the Bi-CMOS process. Three dimension device simulations indicate that this structure can achieve a low specific on-resistance of 11.5 mΩ·cm^2 at a gate voltage of 5 V compared with 27.7 mΩ·cm^2 for the conventional LDMOST at the breakdown voltage of 80V. 展开更多
关键词 LDMOST low on-resistance path Super Junction (SJ) sprit p column
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A high voltage Bi-CMOS compatible buffer super-junction LDMOS with an N-type buried layer 被引量:1
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作者 伍伟 张波 +2 位作者 方健 罗小蓉 李肇基 《Journal of Semiconductors》 EI CAS CSCD 2014年第1期65-69,共5页
A novel buffer super-junction (S J) lateral double-diffused MOSFET (LDMOS) with an N-type buried layer (NB) is proposed. An N- buffer layer is implemented under the SJ region and an N-type layer is buried in the... A novel buffer super-junction (S J) lateral double-diffused MOSFET (LDMOS) with an N-type buried layer (NB) is proposed. An N- buffer layer is implemented under the SJ region and an N-type layer is buried in the P substrate. Firstly, the new electric field peak introduced by the p-n junction of the P substrate and the N-type buried layer modulates the surface electric field distribution. Secondly, the N-buffer layer suppresses the substrate assisted depletion effect. Both of them improve the breakdown voltage (BV). Finally, because of the shallow depth of the SJ region, the NB buffer SJ-LDMOS is compatible with Bi-CMOS technology. Simulation results indicate that the average value of the surface lateral electric field strength of the NB buffer SJ-LDMOS reaches 23 V/μm at 15/μm drift length which results in a BV of 350 V and a specific on-resistance of 21 mΩ·cm2. 展开更多
关键词 N-type buried layer breakdown voltage electric field modulation lateral double-diffusion MOSFET super-junction
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An improved trench gate super-junction IGBT with double emitter
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作者 戴伟楠 祝靖 +2 位作者 孙伟锋 杜益成 黄克琴 《Journal of Semiconductors》 EI CAS CSCD 2015年第1期95-100,共6页
An improved trench gate super-junction insulated-gate bipolar transistor is presented. The improved structure contains two emitter regions. The first emitter region of the device works as the conventional structure,wh... An improved trench gate super-junction insulated-gate bipolar transistor is presented. The improved structure contains two emitter regions. The first emitter region of the device works as the conventional structure,which can absorb both the electron current and hole current. The second emitter on the top of the p-pillar acts as the hole current diverter, leading to an improved latch-up capability without sacrificing the off-state breakdown voltage(BV) and turn-off loss. The simulation shows that the latch-up limit of the SJ-IGBT increases from 15000 to 28300 A/cm^2 at VGE D10 V, the BV is 810 V, and the turn off loss is 6.5 m J/cm^2 at Von D1.2 V. 展开更多
关键词 trench gate super-junction(SJ) insulated-gate bipolar transistor(IGBT) latch-up
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Theoretical and experimental study on the vertical-variabledoping superjunction MOSFET with optimized process window
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作者 Min Ren Meng Pi +6 位作者 Rongyao Ma Xin Zhang Ziyi Zhou Qingying Lei Lvqiang Li Zehong Li Bo Zhang 《Journal of Semiconductors》 2025年第6期97-104,共8页
As a type of charge-balanced power device,the performance of super-junction MOSFETs(SJ-MOS)is significantly influ-enced by fluctuations in the fabrication process.To overcome the relatively narrow process window of co... As a type of charge-balanced power device,the performance of super-junction MOSFETs(SJ-MOS)is significantly influ-enced by fluctuations in the fabrication process.To overcome the relatively narrow process window of conventional SJ-MOS,an optimized structure"vertical variable doping super-junction MOSFET(VVD-SJ)"is proposed.Based on the analysis using the charge superposition principle,it is observed that the VVD-SJ,in which the impurity concentration of the P-pillar gradually decreases while that of the N-pillar increases from top to bottom,improves the electric field distribution and mitigates charge imbalance(CIB).Experimental results demonstrate that the optimized 600 V VVD-SJ achieves a 35.90%expansion of the pro-cess window. 展开更多
关键词 super-junction charge imbalance process window breakdown voltage(BV) unclamped inductive switching(UIS)
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提升反向恢复性能的超结4H-SiC沟槽MOSFET结构
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作者 徐彬艺 梁伟 沈重 《海南大学学报(自然科学版中英文)》 2025年第5期576-586,共11页
针对4H-SiC沟槽MOSFET在高压、高频应用中因传统沟槽MOSFET结构(CT-UMOS)pn结面积增大而影响反向恢复性能的问题,提出了一种新型超结4H-SiC沟槽MOSFET结构(NSJ-UMOS)。该结构在源极下方引入NSJ超结,通过高浓度n+、低浓度n1+及p1+区组成... 针对4H-SiC沟槽MOSFET在高压、高频应用中因传统沟槽MOSFET结构(CT-UMOS)pn结面积增大而影响反向恢复性能的问题,提出了一种新型超结4H-SiC沟槽MOSFET结构(NSJ-UMOS)。该结构在源极下方引入NSJ超结,通过高浓度n+、低浓度n1+及p1+区组成的SSJ结构优化体内和栅氧化层间的电场分布。通过TCAD仿真测试,验证了NSJ-UMOS在性能上的显著提升。仿真结果表明,NSJ-UMOS的反向恢复时间从1.01μs缩短至0.02μs,击穿电压提升至4030 V,栅漏电容从33.6 pF减少至0.402 pF,比导通电阻从54.49 mΩ·cm^(2)降至8.26 mΩ·cm^(2),开关功耗降低幅度高达39.51%。以上改进大幅提升了器件的正向导通性能、反向恢复性能及第三象限表现,使其在高压、高可靠性和高频应用中更具优势。 展开更多
关键词 4H-SiC沟槽MOSFET 超结 反向恢复特性
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嵌入半超结的增强型GaN/AlGaN异质结垂直HFET
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作者 杨晨飞 韦文生 +3 位作者 汪子盛 丁靖扬 陈超逸 杨锦天 《电子器件》 2025年第5期979-988,共10页
元胞面积相同的GaN/AlGaN异质结垂直场效应管(HFETs)比横向HFET的击穿电压(V_(B))更高,值得进一步研发。本文利用Silvaco TCAD软件仿真,构建了一种包含GaN/AlGaN异质结源极、p型GaN埋层与n型GaN漂移区组成半超结的增强型垂直HFET,模拟... 元胞面积相同的GaN/AlGaN异质结垂直场效应管(HFETs)比横向HFET的击穿电压(V_(B))更高,值得进一步研发。本文利用Silvaco TCAD软件仿真,构建了一种包含GaN/AlGaN异质结源极、p型GaN埋层与n型GaN漂移区组成半超结的增强型垂直HFET,模拟了器件性能对异质结源极的Al组分、电流阻挡层掺杂浓度、GaN埋层宽度及掺杂浓度的依赖性;分析了Al组分突变、缓变异质结源极对器件性能的影响。结果反映,包含Al组分突变异质结源极器件的比导通电阻(R_(on,sp))更低,半超结对R_(on,sp)影响微弱,却能优化漂移区电场分布。与没有半超结的参照器件对比,本器件的V_(B)提升114.71%,寄生电容更小,关断延迟时间(t_(off))减少33.04%,导通延迟时间(t_(on))缩短25.28%。本文可为设计高性能HFET提供新的方案。 展开更多
关键词 增强型垂直HFET Al组份突变、缓变的GaN/AlGaN异质结 半超结
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PSJ高压器件的优化设计 被引量:3
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作者 陈万军 张波 +1 位作者 李肇基 邓小川 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第6期1089-1093,共5页
基于Semi SJ(superjunction)结构,提出了SJ的比例可以从0~1渐变的PSJ(partialsuperjunction)高压器件的概念.通过对PSJ比导通电阻的分析,得到了PSJ高压器件比导通电阻优化设计的理论公式.计算了不同击穿电压的比导通电阻,并与二维器件... 基于Semi SJ(superjunction)结构,提出了SJ的比例可以从0~1渐变的PSJ(partialsuperjunction)高压器件的概念.通过对PSJ比导通电阻的分析,得到了PSJ高压器件比导通电阻优化设计的理论公式.计算了不同击穿电压的比导通电阻,并与二维器件模拟结果和实验结果相比较.讨论了BAL(bottomassistlayer)部分穿通因素η、p型区深度归一化参数r、p型区深宽比A以及PSJ漂移区掺杂浓度是否统一对PSJ高压器件比导通电阻的影响.其理论结果和器件模拟结果相吻合,为设计与优化PSJ高压器件提供了理论依据.PSJ结构特别适于制造工艺水平不高、很难实现大的p型区深宽比的情况,为现有工艺实现高压低导通电阻器件提供了一种新的思路. 展开更多
关键词 PARTIAL super JUNCTION RESURF 击穿电压 比导通电阻
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高压超结VDMOS结构设计 被引量:2
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作者 杨法明 杨发顺 +2 位作者 丁召 傅兴华 邓朝勇 《固体电子学研究与进展》 CAS CSCD 北大核心 2012年第3期298-303,共6页
为改善高压功率VDMOS击穿电压和导通电阻之间的平方率关系,采用超结理论及其分析方法,结合电荷平衡理论,计算了超结VDMOS的理想结构参数,并利用仿真软件SILVACO对超结VDMOS的各个工艺参数(外延厚度,P柱掺杂剂量,阈值电压)进行了优化设计... 为改善高压功率VDMOS击穿电压和导通电阻之间的平方率关系,采用超结理论及其分析方法,结合电荷平衡理论,计算了超结VDMOS的理想结构参数,并利用仿真软件SILVACO对超结VDMOS的各个工艺参数(外延厚度,P柱掺杂剂量,阈值电压)进行了优化设计,对器件的正向导通特性和反向击穿特性进行了仿真分析。最终设计了一个击穿电压为815V,比导通电阻为23mΩ.cm2的超结VDMOS。 展开更多
关键词 纵向双扩散金属氧化物半导体 超结 电荷平衡 正向导通 反向击穿
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一种新颖的600V浮空埋层结构 被引量:1
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作者 刘嵘侃 谭开洲 +2 位作者 唐昭焕 刘勇 冉明 《微电子学》 CAS CSCD 北大核心 2014年第3期377-379,共3页
提出了一种新颖的低导通电阻600V器件结构。该结构采用了掺杂深槽和分裂浮空埋层结构,可以克服普通分裂浮空埋层结构划片道边缘漏电大的问题,同时仍然保持了普通分裂浮空埋层结构具有的较低导通电阻的优势。数值仿真表明,采用这种结构的... 提出了一种新颖的低导通电阻600V器件结构。该结构采用了掺杂深槽和分裂浮空埋层结构,可以克服普通分裂浮空埋层结构划片道边缘漏电大的问题,同时仍然保持了普通分裂浮空埋层结构具有的较低导通电阻的优势。数值仿真表明,采用这种结构的600V器件外延层比导通电阻在相同耐压下比理想平行平面结结构小43%,从73.3mΩ·cm2降低到41.7mΩ·cm2。 展开更多
关键词 比导通电阻 分裂浮空埋层 耐压 超结
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4H-SiC SJ结构反向击穿电压的解析模型 被引量:1
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作者 张金平 张波 +2 位作者 李肇基 周春华 罗小蓉 《固体电子学研究与进展》 CAS CSCD 北大核心 2007年第2期176-180,共5页
提出了4H-SiC超级结结构反向击穿电压的二维解析模型。通过求解Poisson方程,获得了反向击穿电压的解析表达式,该表达式描述了反向击穿电压与器件参数如掺杂浓度、长度、宽度和温度等的关系。通过对导通电阻的优化,获得了导通电阻与击穿... 提出了4H-SiC超级结结构反向击穿电压的二维解析模型。通过求解Poisson方程,获得了反向击穿电压的解析表达式,该表达式描述了反向击穿电压与器件参数如掺杂浓度、长度、宽度和温度等的关系。通过对导通电阻的优化,获得了导通电阻与击穿电压的关系为Ron∝VB1.4。并对模型结果进行了讨论,结果与二维数值仿真吻合得很好。 展开更多
关键词 4H-碳化硅 超级结 反向击穿电压 导通电阻
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超结器件 被引量:22
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作者 陈星弼 《电力电子技术》 CSCD 北大核心 2008年第12期2-7,共6页
简要地介绍了突破传统"硅极限"的超结器件发明的背景,以及产生的来由。描述了既用作漂移区又用作耐压区的各种超结结构的导通电阻与击穿电压的关系,及超结MOST瞬态特性中导通过程的器件物理。最后简要地介绍了超结器件的进展。
关键词 半导体功率器件 超结 复合缓冲层 比导通电阻 硅极限
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具有半绝缘多晶硅完全三维超结横向功率器件 被引量:1
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作者 曹震 段宝兴 +1 位作者 袁小宁 杨银堂 《物理学报》 SCIE EI CAS CSCD 北大核心 2015年第18期425-431,共7页
为了突破传统LDMOS(lateral double-diffused MOSFET)器件击穿电压与比导通电阻的硅极限的2.5次方关系,降低LDMOS器件的功率损耗,提高功率集成电路的功率驱动能力,提出了一种具有半绝缘多晶硅SIPOS(semi-insulating poly silicon)覆盖... 为了突破传统LDMOS(lateral double-diffused MOSFET)器件击穿电压与比导通电阻的硅极限的2.5次方关系,降低LDMOS器件的功率损耗,提高功率集成电路的功率驱动能力,提出了一种具有半绝缘多晶硅SIPOS(semi-insulating poly silicon)覆盖的完全3 D-RESURF(three-dimensional reduced surface field)新型super junction-LDMOS结构(SIPOS SJ-LDMOS).这种结构利用SIPOS的电场调制作用使SJ-LDMOS的表面电场分布均匀,将器件单位长度的耐压量提高到19.4 V/μm;覆盖于漂移区表面的SIPOS使SJ-LDMOS沿三维方向均受到电场调制,实现了LDMOS的完全3 D-RESURF效应,使更高浓度的漂移区完全耗尽而达到高的击穿电压;当器件开态工作时,覆盖于薄场氧化层表面的SIPOS的电场作用使SJ-LDMOS的漂移区表面形成多数载流子积累,器件比导通电阻降低.利用器件仿真软件ISE分析获得,当SIPOS SJ-LDMOS的击穿电压为388 V时,比导通电阻为20.87 mΩ.cm^2,相同结构参数条件下,N-buffer SJ-LDMOS的击穿电压为287 V,比导通电阻为31.14 mΩ.cm^2;一般SJ-LDMOS的击穿电压仅为180 V,比导通电阻为71.82 mΩ.cm^2. 展开更多
关键词 super JUNCTION 半绝缘多晶硅 击穿电压 比导通电阻
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超结硅锗功率二极管电学特性的研究 被引量:1
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作者 马丽 高勇 +1 位作者 王冬芳 张如亮 《固体电子学研究与进展》 CAS CSCD 北大核心 2010年第3期333-337,共5页
超结SiGe功率开关二极管可以克服常规Si功率二极管存在的一些缺陷,如阻断电压增大的同时,正向导通压降也将增大,反向恢复时间也变长。该新型功率二极管有两个重要特点:一是由轻掺杂的p型柱和n型柱相互交替形成超结结构,代替传统功率二... 超结SiGe功率开关二极管可以克服常规Si功率二极管存在的一些缺陷,如阻断电压增大的同时,正向导通压降也将增大,反向恢复时间也变长。该新型功率二极管有两个重要特点:一是由轻掺杂的p型柱和n型柱相互交替形成超结结构,代替传统功率二极管的n-基区;二是p+区采用很薄的应变SiGe材料。该器件可以同时实现高阻断电压、低正向压降和快速恢复的电学特性。与相同器件厚度的常规Si功率二极管相比较,反向阻断电压提高了42%,反向恢复时间缩短了40%,正向压降减小了约0.1V(正向电流密度为100A/cm2时)。应变SiGe层中Ge含量和器件的基区厚度是影响超结SiGe二极管电学特性的重要参数,详细分析了该材料参数和结构参数对正向导通特性、反向阻断特性和反向恢复特性的影响,为器件结构设计提供了实用的参考价值。 展开更多
关键词 硅锗二极管 超结 电学特性 基区厚度 锗含量
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冷发射电子束掺杂磷 被引量:2
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作者 李秀琼 王培大 +1 位作者 马祥彬 王纯 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1990年第12期942-945,共4页
一种新的冷发射电子束掺杂方法已研究成功。这种方法可实现高浓度(C_(max)=2.8×10^(20)/cm^3),超浅结[(x_j)_(min)≤0.1μm],而且损伤比离子注入的小得多。用这种方法制备的太阳能电池控制器件性能很好。
关键词 冷发射电子束 掺杂 集成电路
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A 4H-SiC trench MOSFET structure with wrap N-type pillar for low oxide field and enhanced switching performance 被引量:4
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作者 Pei Shen Ying Wang Fei Cao 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第7期629-636,共8页
An optimized silicon carbide(SiC)trench metal-oxide-semiconductor field-effect transistor(MOSFET)structure with side-wall p-type pillar(p-pillar)and wrap n-type pillar(n-pillar)in the n-drain was investigated by utili... An optimized silicon carbide(SiC)trench metal-oxide-semiconductor field-effect transistor(MOSFET)structure with side-wall p-type pillar(p-pillar)and wrap n-type pillar(n-pillar)in the n-drain was investigated by utilizing Silvaco TCAD simulations.The optimized structure mainly includes a p+buried region,a light n-type current spreading layer(CSL),a p-type pillar region,and a wrapping n-type pillar region at the right and bottom of the p-pillar.The improved structure is named as SNPPT-MOS.The side-wall p-pillar region could better relieve the high electric field around the p+shielding region and the gate oxide in the off-state mode.The wrapping n-pillar region and CSL can also effectively reduce the specific on-resistance(Ron,sp).As a result,the SNPPT-MOS structure exhibits that the figure of merit(Fo M)related to the breakdown voltage(V_(BR))and Ron,sp(V_(BR)^2R_(on,sp))of the SNPPT-MOS is improved by 44.5%,in comparison to that of the conventional trench gate SJ MOSFET(full-SJ-MOS).In addition,the SNPPT-MOS structure achieves a much fasterwitching speed than the full-SJ-MOS,and the result indicates an appreciable reduction in the switching energy loss. 展开更多
关键词 4H-silicon carbide(4H-SiC)trench gate MOSFET breakdown voltage(V_(BR)) specific onresistance(R_(on sp)) switching energy loss super-junction
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