Mechanical reliability plays a critical role in determining the durability of flexible electronic devices because of the significant mechanical stresses they experience during manufacturing and operation.Many such dev...Mechanical reliability plays a critical role in determining the durability of flexible electronic devices because of the significant mechanical stresses they experience during manufacturing and operation.Many such devices are built on sheets comprising stiff transparent-conducting oxide(TCO)electrode films on compliant polymer substrates,and it is generally assumed that the high-toughness polymer substrates do not crack.Contrary to this assumption,here we show extensive cracking in the polymer substrates during bending of a variety of TCO/polymer sheets,and a device example—flexible perovskite solar cells.Such substrate cracking,which compromises the overall mechanical integrity of the entire device,is driven by the amplified stress-intensity factor caused by the elastic mismatch at the film/substrate interface.To mitigate this substrate cracking,an interlayer-engineering approach is designed and experimentally demonstrated.This approach is potentially applicable to myriad flexible electronic devices,with stiff films on compliant substrates,for improving their durability and reliability.展开更多
基金supported by the U.S.Department of Energy(DOE)Office of Energy Efficiency and Renewable Energy(EERE)under the Solar Energy Technology Office(SETO)(Award No.DE-EE0009511)DOE Basic Energy Sciences(BES)(Award No.DE-SC0025180)+8 种基金the U.S.National Science Foundation(NSF)(Award No.DMR-2102210)the article do not necessarily represent the views of the DOE or the U.S.Governmentsupport of the U.S.Office of Naval Research(ONR)(Award Nos.N00014-21-1-2851,N00014-24-1-2200,and N00014-21-1-2054)support from ONR(Award Nos.N00014-21-1-2815 and N00014-23-1-2688)is gratefully acknowledgedsupport she received through the James R.Rice Graduate Fellowship in Solid Mechanics and the Miss Abbott’s School Alumnae Fellowship.S.S.acknowledges the support from Brown University as part of his Professor-at-Large appointmentsupported by NSF(Award No.CBET-2315077)and NSF-GRFP(Award No.DGE-2139841)supported by the JUMP INTO SPACE project,funded from the European Innovation Council(EIC)under grant agreement No 101162377the author’s views and the European Union is not liable for any use that may be made of the information contained therein.E.Msupport of MASE(Ministero dell’Ambiente e della Sicurezza Energetica)in the framework of the Operating Agreement with ENEA for Research on the Electric System(RdS)2025-2027.
文摘Mechanical reliability plays a critical role in determining the durability of flexible electronic devices because of the significant mechanical stresses they experience during manufacturing and operation.Many such devices are built on sheets comprising stiff transparent-conducting oxide(TCO)electrode films on compliant polymer substrates,and it is generally assumed that the high-toughness polymer substrates do not crack.Contrary to this assumption,here we show extensive cracking in the polymer substrates during bending of a variety of TCO/polymer sheets,and a device example—flexible perovskite solar cells.Such substrate cracking,which compromises the overall mechanical integrity of the entire device,is driven by the amplified stress-intensity factor caused by the elastic mismatch at the film/substrate interface.To mitigate this substrate cracking,an interlayer-engineering approach is designed and experimentally demonstrated.This approach is potentially applicable to myriad flexible electronic devices,with stiff films on compliant substrates,for improving their durability and reliability.
