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Nano-monolayer NiPS_(3) crystal inducing reinforced polymeric π- orbital coherent stack for 20.83% efficiency organic photovoltaics
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作者 Zhenye Li Jiefeng Xie Hanjian Lai 《Nano Research》 2025年第12期589-598,共10页
In organic photovoltaics(OPVs),theπ-orbital D18-Cl coherent stack ofπ-conjugated polymers in the active layer exerts a profound influence on exciton dissociation and charge transport.Nevertheless,the structural flex... In organic photovoltaics(OPVs),theπ-orbital D18-Cl coherent stack ofπ-conjugated polymers in the active layer exerts a profound influence on exciton dissociation and charge transport.Nevertheless,the structural flexibility intrinsic ofπ-conjugated polymers fundamentally restricts orderedπ-orbital coherent stack,thereby establishing persistent performance limitations in OPVs.Here,we demonstrate a universal crystalinduced polymericπ-orbital coherent stack reinforcement strategy by incorporating nano-monolayer nickel phosphorus trisulfide(NiPS_(3))crystal as a multifunctional additive,to modulates tighterπ–πstacking and extended crystallite coherence length.These structural improvements synergistically extend exciton lifetime,suppress carrier recombination,and optimize charge transport.Consequently,OPVs based on D18-Cl:L8-BO system achieves an impressive power conversion efficiency(PCE)of 20.83%with concurrent improvements in short-circuit current density and fill factor.The universality of this approach is further confirmed in PM6:L8-BO(PCE boosts from 17.41%±0.21%to 18.08%±0.11%)and D18:L8-BO(PCE improves from 19.20%±0.27%to 20.19%±0.20%)systems,where nano-monolayer NiPS_(3) crystal universally mediates the formation of tightlyπ-orbital coherent stack ofπ-conjugated polymers with enhanced crystallite coherence length.This work establishes nano-monolayer NiPS_(3) crystal as powerful tools for modulatesπ-orbital coherent stack of conjugated polymers,offering a materials-agnostic pathway toward high-efficiency OPVs. 展开更多
关键词 organic photovoltaics nano-monolayer NiPS_(3)crystal π-orbital coherent stack crystallite coherence length
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Saturation thickness of stacked SiO_(2)in atomic-layer-deposited Al_(2)O_(3)gate on 4H-SiC
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作者 邵泽伟 徐弘毅 +2 位作者 王珩宇 任娜 盛况 《Chinese Physics B》 SCIE EI CAS CSCD 2023年第8期397-403,共7页
High-k materials as an alternative dielectric layer for SiC power devices have the potential to reduce interfacial state defects and improve MOS channel conduction capability.Besides,under identical conditions of gate... High-k materials as an alternative dielectric layer for SiC power devices have the potential to reduce interfacial state defects and improve MOS channel conduction capability.Besides,under identical conditions of gate oxide thickness and gate voltage,the high-k dielectric enables a greater charge accumulation in the channel region,resulting in a larger number of free electrons available for conduction.However,the lower energy band gap of high-k materials leads to significant leakage currents at the interface with Si C,which greatly affects device reliability.By inserting a layer of SiO_(2)between the high-k material and Si C,the interfacial barrier can be effectively widened and hence the leakage current will be reduced.In this study,the optimal thickness of the intercalated SiO_(2)was determined by investigating and analyzing the gate dielectric breakdown voltage and interfacial defects of a dielectric stack composed of atomic-layer-deposited Al_(2)O_(3)layer and thermally nitride SiO_(2).Current-voltage and high-frequency capacitance-voltage measurements were performed on metal-oxide-semiconductor test structures with 35 nm thick Al_(2)O_(3)stacked on 1 nm,2 nm,3 nm,6 nm,or 9 nm thick nitride SiO_(2).Measurement results indicated that the current conducted through the oxides was affected by the thickness of the nitride oxide and the applied electric field.Finally,a saturation thickness of stacked SiO_(2)that contributed to dielectric breakdown and interfacial band offsets was identified.The findings in this paper provide a guideline for the SiC gate dielectric stack design with the breakdown strength and the interfacial state defects considered. 展开更多
关键词 4H-SIC SiO_(2)/Al_(2)O_(3)stacks saturation thickness dielectric breakdown
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基于MCM-D工艺的3D-MCM工艺技术研究 被引量:2
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作者 刘欣 谢廷明 +2 位作者 罗驰 刘建华 唐哲 《微电子学》 CAS CSCD 北大核心 2010年第2期291-294,299,共5页
基于MCM-D薄膜工艺,开展了3D-MCM相关的无源元件内埋置、芯片减薄、芯片叠层组装、低弧度金丝键合、芯片凸点,以及板级叠层互连装配等工艺技术研究。通过埋置型基板、叠层芯片组装、板级叠层互连,实现了3D-MCM结构,制作出薄膜3D-MCM样品... 基于MCM-D薄膜工艺,开展了3D-MCM相关的无源元件内埋置、芯片减薄、芯片叠层组装、低弧度金丝键合、芯片凸点,以及板级叠层互连装配等工艺技术研究。通过埋置型基板、叠层芯片组装、板级叠层互连,实现了3D-MCM结构,制作出薄膜3D-MCM样品;探索出主要的工艺流程及关键工序控制方法,实现了薄膜3D-MCM封装。 展开更多
关键词 3d-mcm 内埋置基板 叠层型结构 三维叠层互连
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First-principles study of stacking fault energies in Ni_3Al intermetallic alloys 被引量:5
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作者 温玉锋 孙坚 黄健 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2012年第3期661-664,共4页
The first-principles method based on the projector augmented wave method within the generalized gradient approximation was employed to calculate the superlattice intrinsic stacking fault(SISF) and complex stacking f... The first-principles method based on the projector augmented wave method within the generalized gradient approximation was employed to calculate the superlattice intrinsic stacking fault(SISF) and complex stacking fault(CSF) energies of the binary Ni3Al alloys with different Al contents and the ternary Ni3Al intermetallic alloys with addition of alloying elements,such as Pd,Pt,Ti,Mo,Ta,W and Re.The results show that the energies of SISF and CSF increase significantly with increase of Al contents in Ni3Al.Addition of Pd and Pt occupying the Ni sublattices does not change the SISF and CSF energies of Ni3Al markedly in comparison with the Ni-23.75Al alloy.While addition of alloying elements,such as Ti,Mo,Ta,W and Re,occupying the Al sublattices dramatically increases the SISF and CSF energies of Ni3Al.The results suggest that the energies of SISF and CSF are dependent both on the Al contents and on the site occupancy of the ternary alloying element in Ni3Al intermetallic alloys. 展开更多
关键词 NI3AL superlattice intrinsic stacking fault complex stacking fault alloying element FIRST-PRINCIPLES
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基于埋置式基板的3D-MCM封装结构的研制 被引量:5
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作者 徐高卫 吴燕红 +1 位作者 周健 罗乐 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第9期1837-1842,共6页
研制一种用于无线传感网的多芯片组件(3D-MCM).采用层压、开槽等工艺获得埋置式高密度多层有机(FR-4)基板,通过板上芯片(COB)、板上倒装芯片(FCOB)、球栅阵列(BGA)等技术,并通过引线键合、倒装焊等多种互连方式将不同类型的半导体芯片... 研制一种用于无线传感网的多芯片组件(3D-MCM).采用层压、开槽等工艺获得埋置式高密度多层有机(FR-4)基板,通过板上芯片(COB)、板上倒装芯片(FCOB)、球栅阵列(BGA)等技术,并通过引线键合、倒装焊等多种互连方式将不同类型的半导体芯片三维封装于一种由叠层模块所形成的立体封装结构中;通过封装表层的植球工艺形成与表面组装技术(SMT)兼容的BGA器件输出端子;利用不同熔点焊球实现了工艺兼容的封装体内各级BGA的垂直互连,形成了融合多种互连方式3D-MCM封装结构.埋置式基板的应用解决了BGA与引线键合芯片同面组装情况下芯片封装面高出焊球高度的关键问题.对封装结构的散热特性进行了数值模拟和测试,结果表明组件具有高的热机械可靠性.电学测试结果表明组件实现了电功能,从而满足了无线传感网小型化、高可靠性和低成本的设计要求. 展开更多
关键词 3d-mcm 嵌入式基板 多种互连融合 焊球熔融兼容性 热机械可靠性
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无线传感网3D-MCM封装结构的设计与实现 被引量:1
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作者 吴燕红 徐高卫 +2 位作者 朱明华 周健 罗乐 《功能材料与器件学报》 CAS CSCD 北大核心 2008年第3期580-584,共5页
设计和实现了一种新型的三维多芯片组件(3D-MCM)。采用融合了FCOB(flip-chip onboard)、COB(chip on board)、BGA(ball grid array)等技术的三维封装(3D packaging)形式,通过倒装焊和引线键合等互连技术在高密度多层有机基板上实现了塑... 设计和实现了一种新型的三维多芯片组件(3D-MCM)。采用融合了FCOB(flip-chip onboard)、COB(chip on board)、BGA(ball grid array)等技术的三维封装(3D packaging)形式,通过倒装焊和引线键合等互连技术在高密度多层有机基板上实现了塑封BGA器件和裸芯片的混载集成。对器件结构的散热特性进行了数值模拟,并对热可靠性进行了评估。实现了电功能和热机械可靠性,达到设计要求并付诸应用。 展开更多
关键词 3d-mcm 热设计 高密度基板 倒装焊 引线键合
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CVD金刚石改善3D-MCM散热性能分析
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作者 谢扩军 蒋长顺 徐建华 《金刚石与磨料磨具工程》 CAS 北大核心 2005年第6期27-30,共4页
在3D-MCM(多芯片组件)封装设计中,大功率和高热流密度导致系统的散热成为关键技术之一。本文采用高导热率的金刚石封装材料建立了一种叠层多芯片组件结构,应用ANSYS软件和计算流体动力学方法(CFD),对CVD(化学气相沉积)金刚石基板的三维... 在3D-MCM(多芯片组件)封装设计中,大功率和高热流密度导致系统的散热成为关键技术之一。本文采用高导热率的金刚石封装材料建立了一种叠层多芯片组件结构,应用ANSYS软件和计算流体动力学方法(CFD),对CVD(化学气相沉积)金刚石基板的三维多芯片结构进行了热性能分析,模拟了器件在强制空气冷却条件下的热传递过程和温度分布,探讨了各种设计参数和物性参数对3D-MCM器件温度场的影响。结果显示金刚石基板应用在多芯片组件中能显著地改善3D-MCM封装的散热性能,明显优于氮化铝基板;在强制空冷时散热功率可达到120W。 展开更多
关键词 CVD金刚石 热沉 3d-mcm 封装 热性能
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3D-MCM高集成微波模块的热设计研究和应用 被引量:6
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作者 胡永芳 孙毅鹏 《电子机械工程》 2019年第2期25-29,共5页
文中针对3D-MCM高集成模块的散热问题,研究了3D-MCM组件在高能量密度、高集成度下的热设计,并以3D-MCM信号处理组件为例,根据信号处理组件电性能设计和封装布局设计要求,建立了参数化的有限元仿真模型。经过布局迭代、散热方式优化和组... 文中针对3D-MCM高集成模块的散热问题,研究了3D-MCM组件在高能量密度、高集成度下的热设计,并以3D-MCM信号处理组件为例,根据信号处理组件电性能设计和封装布局设计要求,建立了参数化的有限元仿真模型。经过布局迭代、散热方式优化和组件材料优化,组件的等效热导率高达76 W/(m·K),封装基板局部的热导率可达183 W/(m·K)。基于氮化铝基板和纳米银等高导热材料,实现了高集成信号处理组件的高效散热设计。 展开更多
关键词 3d-mcm封装组件 有限元仿真 热设计 氮化铝基板 纳米银
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3D-MCM的X射线检测分析
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作者 李建辉 董兆文 《电子与封装》 2005年第9期20-23,28,共5页
X射线检测技术是一种能对不可视部位进行检测的技术。本文利用X射线对3D—MCM中的BGA焊点、基板和隔板之间的焊料凸点、叠层基板间的垂直互连和陶瓷-金属封装等进行检测;对存在于焊点和凸点中的气孔、垂直互连中的开路和封装中的孔洞等... X射线检测技术是一种能对不可视部位进行检测的技术。本文利用X射线对3D—MCM中的BGA焊点、基板和隔板之间的焊料凸点、叠层基板间的垂直互连和陶瓷-金属封装等进行检测;对存在于焊点和凸点中的气孔、垂直互连中的开路和封装中的孔洞等进行了分析。 展开更多
关键词 X射线检测 3d-mcm BGA 焊接 焊料凸点
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毫米波3D-MCM中垂直互联的设计 被引量:3
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作者 罗鑫 黄建 赵青 《电子元件与材料》 CAS CSCD 北大核心 2020年第11期73-78,共6页
3D-MCM是新一代有源相控阵共形天线的核心部件,设计小型化、低插入损耗和高可靠的垂直互联结构是实现3D-MCM关键技术之一。以小型化、连接可靠性、易集成、易加工为目的,提出一种应用于毫米波频段,基于左手传输线的同轴型非接触式垂直... 3D-MCM是新一代有源相控阵共形天线的核心部件,设计小型化、低插入损耗和高可靠的垂直互联结构是实现3D-MCM关键技术之一。以小型化、连接可靠性、易集成、易加工为目的,提出一种应用于毫米波频段,基于左手传输线的同轴型非接触式垂直互联结构,使得不同功能模块之间通过电磁耦合的方式实现了信号的垂直传输。利用低温共烧陶瓷(LTCC)制造工艺,制作了背靠背同轴型非接触式垂直互联实物,单个垂直互联接口面积约3.14 mm^2,经测试在35~43 GHz频段内单个垂直互联插入损耗小于0.7 dB,带内平坦度优于±0.75 dB,回波损耗优于-12 dB。 展开更多
关键词 3d-mcm 左手传输线 垂直互联 非接触式 毫米波 低插入损耗
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阻塞Stack-3随机多用户接入算法及其性能研究 被引量:3
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作者 王健成 姚庆栋 戴文琪 《通信学报》 EI CSCD 北大核心 1999年第11期66-71,共6页
本文为阻塞Stack-3 算法建立了一个马尔可夫模型,详细分析了算法的数据包时延性能,得到了比较简单的时延解析表达式。仿真结果证明了我们分析方法的正确性。
关键词 随机多用户接入 stack-3算法 数据包 无线电通信
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An optimal stacking order for mid-bond testing cost reduction of 3D IC 被引量:2
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作者 Ni Tianming Liang Huaguo +4 位作者 Nie Mu Bian Jingchang Huang Zhengfeng Xu Xiumin Fang Xiangsheng 《Journal of Southeast University(English Edition)》 EI CAS 2018年第2期166-172,共7页
In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is bu... In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors.An algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints.To prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared.Based on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid type.Furthermore,with the increase of the stack size,the test costs of the optimized stack order can be decreased. 展开更多
关键词 three-dimensional integrated circuit(3D IC) mid-bond test cost stacking order sequential stacking failed bonding
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Stacking fault energy,yield stress anomaly, and twinnability of Ni_3Al:A first principles study 被引量:1
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作者 刘利利 吴小志 +2 位作者 王锐 李卫国 刘庆 《Chinese Physics B》 SCIE EI CAS CSCD 2015年第7期407-414,共8页
Using first principles calculations combined with the quasiharmonic approach, we study the effects of temperature on the elastic constants, generalized stacking fault energies, and generalized planar fault energies of... Using first principles calculations combined with the quasiharmonic approach, we study the effects of temperature on the elastic constants, generalized stacking fault energies, and generalized planar fault energies of Ni3Al. The antiphase boundary energies, complex stacking fault energies, superlattice intrinsic stacking fault energies, and twinning energies decrease slightly with temperature. Temperature dependent anomalous yield stress of Ni3Al is predicted by the energybased criterion based on elastic anisotropy and antiphase boundary energies. It is found that p increases with temperature and this can give a more accurate description of the anomalous yield stress in Ni3Al. Furthermore, the predicted twinnablity of Ni3Al is also decreasing with temperature. 展开更多
关键词 NI3AL stacking fault energy anomalous yield stress twinnability
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超薄Si_3N_4/SiO_2(N/O)stack栅介质及器件
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作者 林钢 徐秋霞 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第1期115-119,共5页
成功制备了EOT(equivalentoxidethickness)为 2 1nm的Si3 N4/SiO2 (N/O)stack栅介质 ,并对其性质进行了研究 .结果表明 ,同样EOT的Si3 N4/SiO2 stack栅介质和纯SiO2 栅介质比较 ,前者在栅隧穿漏电流、抗SILC性能、栅介质寿命等方面都... 成功制备了EOT(equivalentoxidethickness)为 2 1nm的Si3 N4/SiO2 (N/O)stack栅介质 ,并对其性质进行了研究 .结果表明 ,同样EOT的Si3 N4/SiO2 stack栅介质和纯SiO2 栅介质比较 ,前者在栅隧穿漏电流、抗SILC性能、栅介质寿命等方面都远优于后者 .在此基础上 ,采用Si3 N4/SiO2 stack栅介质制备出性能优良的栅长为 0 12 μm的CMOS器件 ,器件很好地抑制了短沟道效应 .在Vds=Vgs=± 1 5V下 ,nMOSFET和pMOSFET对应的饱和电流Ion分别为5 84 3μA/ μm和 - 2 81 3μA/ μm ,对应Ioff分别是 8 3nA/ μm和 - 1 3nA/ μm . 展开更多
关键词 超薄Si3N4/SiO2(N/O)stack栅介质 栅隧穿漏电流 SILC特性 栅介质寿命 CMOS器件
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Unusual F_(3)stacking fault in magnesium
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作者 Y.Yue S.L.Yang +1 位作者 C.C.Wu J.F.Nie 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2023年第7期2404-2428,共25页
An unusual F_(3)basal stacking fault resulting from twin-dislocation interaction in magnesium is observed in molecular dynamics simulation.The F_(3)fault is produced in the twin lattice from the interaction between a ... An unusual F_(3)basal stacking fault resulting from twin-dislocation interaction in magnesium is observed in molecular dynamics simulation.The F_(3)fault is produced in the twin lattice from the interaction between a migrating(1012)twin boundary and a partial dislocation of either a prismatic<c>edge,or a prismatic<c+a>mixed dislocation in the matrix.The condition is that the partial dislocation needs to have a negative sign and lie on a plane intersecting a compression site of the twin boundary.The F_(3)fault can also be generated when a positive basal<a>mixed dislocation in the twin lattice,with slip plane intersecting a compression site of the twin boundary,interacts with a basal-prismatic twinning disconnection.The F_(3)fault comprises two I_(1) faults that have the same character but are separated by two basal layers.It has one end connected to the twin boundary,and the other end bounded by a lattice defect with a Burgers vector identical to that of a 30°Shockley partial dislocation.The formation frequency of the F_(3)fault is higher at a lower shear stress(below∼400 MPa)and/or a lower temperature(100 K and 200 K).The F_(3)fault can decompose into a glissile 30°Shockley and a T_(2) fault at a temperature above∼400 K.The relationships between the F_(3)fault and other types of basal stacking faults such as I_(2),T_(2) or paired I_(1) faults that are separated by multiple basal layers are discussed. 展开更多
关键词 MAGNESIUM Basal stacking fault F3 fault Twin-dislocation interactions
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Stacking driven Raman spectra change of carbon based 2D semiconductor C_(3)N
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作者 Yucheng Yang Wenya Wei +5 位作者 Peng He Siwei Yang Qinghong Yuan Guqiao Ding Zhi Liu Xiaoming Xie 《Chinese Chemical Letters》 SCIE CAS CSCD 2022年第5期2600-2604,共5页
As a two-dimensional carbon based semiconductor,C_(3)N acts as a promising material in many application areas.However,the basic physical properties such as Raman spectrum properties of C_(3)N is still not clear.In thi... As a two-dimensional carbon based semiconductor,C_(3)N acts as a promising material in many application areas.However,the basic physical properties such as Raman spectrum properties of C_(3)N is still not clear.In this paper,we clarify the Raman spectrum properties of multilayer C_(3)N.Moreover,the stacking driven Raman spectra change of multilayer C_(3)N is also discussed. 展开更多
关键词 C_(3)N Raman spectrum Carbon based semiconductor 2D materials stacking structure
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Oxygen Scavenging Effect of LaLuO_3/TiN Gate Stack in High-Mobility Si/SiGe/SOI Quantum-Well Transistors
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作者 冯锦锋 刘畅 +1 位作者 俞文杰 彭颖红 《Chinese Physics Letters》 SCIE CAS CSCD 2016年第5期108-110,共3页
Higher-s dielectric LaLuO3, deposited by molecular beam deposition, with TiN as gate stack is integrated into high-mobility Si/SiGe/SOI quantum-well p-type metal-oxide-semiconduetor field effect transistors. Threshold... Higher-s dielectric LaLuO3, deposited by molecular beam deposition, with TiN as gate stack is integrated into high-mobility Si/SiGe/SOI quantum-well p-type metal-oxide-semiconduetor field effect transistors. Threshold voltage shift and capacitance equivalent thickness shrink are observed, resulting from oxygen scavenging effect in LaLuO3 with ti-rich TiN after high temperature annealing. The mechanism of oxygen scavenging and its potential for resistive memory applications are analyzed and discussed. 展开更多
关键词 SOI SiGe TIN Oxygen Scavenging Effect of LaLuO3/TiN Gate stack in High-Mobility Si/SiGe/SOI Quantum-Well Transistors of in Gate
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Enhancing CO_(2) methanation via doping CeO_(2) to Ni/Al_(2)O_(3) and stacking catalyst beds
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作者 Yutong Pan Pengju Gao +10 位作者 Shixiong Tang Xiaoyu Han Ziwen Hao Jiyi Chen Zhenmei Zhang Heng Zhang Xiaohui Zi Maoshuai Li Shiwei Wang Yue Wang Xinbin Ma 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2024年第11期170-180,共11页
This work synthesized a series of Ni/CeO_(2)/Al_(2)O_(3) catalysts with varying CeO_(2) doping amounts to enhance low-temperature CO_(2) methanation.The introduction of CeO_(2) weakens the interaction between Ni and A... This work synthesized a series of Ni/CeO_(2)/Al_(2)O_(3) catalysts with varying CeO_(2) doping amounts to enhance low-temperature CO_(2) methanation.The introduction of CeO_(2) weakens the interaction between Ni and Al_(2)O_(3),leading to the formation of Ni-CeO_(2) active sites.This results in a high dispersion of Ni and CeO_(2),improved catalyst reducibility,increased number of active sites,and enhanced the CO_(2) methanation.This work further investigated the impact of WHSV and catalyst stacking configuration to enhance the reaction.When the catalyst is stacked into three segments with a temperature gradient of 330℃,300℃,and 250℃under WHSV=9000 ml·h^(-1)·g^(-1),the CO_(2) conversion significantly increases to 95%,which is remarkably close to the thermodynamic equilibrium(96%). 展开更多
关键词 Ni/CeO_(2)/Al_(2)O_(3) CeO_(2) doping Metal-support interaction stacking catalyst beds Bed temperature
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SPR:Malicious traffic detection model for CTCS-3 in railways
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作者 Siyang Zhou Wenjiang Ji +4 位作者 Xinhong Hei Zhongwei Chang Yuan Qiu Lei Zhu Xin Wang 《High-Speed Railway》 2025年第2期105-115,共11页
The increasingly complex and interconnected train control information network is vulnerable to a variety of malicious traffic attacks,and the existing malicious traffic detection methods mainly rely on machine learnin... The increasingly complex and interconnected train control information network is vulnerable to a variety of malicious traffic attacks,and the existing malicious traffic detection methods mainly rely on machine learning,such as poor robustness,weak generalization,and a lack of ability to learn common features.Therefore,this paper proposes a malicious traffic identification method based on stacked sparse denoising autoencoders combined with a regularized extreme learning machine through particle swarm optimization.Firstly,the simulation environment of the Chinese train control system-3,was constructed for data acquisition.Then Pearson coefficient and other methods are used for pre-processing,then a stacked sparse denoising autoencoder is used to achieve nonlinear dimensionality reduction of features,and finally regularization extreme learning machine optimized by particle swarm optimization is used to achieve classification.Experimental data show that the proposed method has good training performance,with an average accuracy of 97.57%and a false negative rate of 2.43%,which is better than other alternative methods.In addition,ablation experiments were performed to evaluate the contribution of each component,and the results showed that the combination of methods was superior to individual methods.To further evaluate the generalization ability of the model in different scenarios,publicly available data sets of industrial control system networks were used.The results show that the model has robust detection capability in various types of network attacks. 展开更多
关键词 CTCS-3 Malicious traffic detection Generalized features stacked sparse denoising autoencoder Regularized extreme learning machine
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Er偏析对γ-Al/γ′-Al_(3)Sc相界影响的第一性原理计算研究
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作者 杨涛 俞伟元 +1 位作者 薛红涛 汤富领 《热加工工艺》 北大核心 2025年第21期96-101,共6页
采用第一性原理计算方法研究了γ-Al/γ'-Al_(3)Sc(Er)相界的Griffith断裂功和广义层错能,以及γ-Al/γ'-Al_(3)Sc在不同Er偏析量下Griffith断裂功和广义层错能的变化情况。结果表明,γ-Al/γ'-Al_(3)Sc相界的抗剪切能力优... 采用第一性原理计算方法研究了γ-Al/γ'-Al_(3)Sc(Er)相界的Griffith断裂功和广义层错能,以及γ-Al/γ'-Al_(3)Sc在不同Er偏析量下Griffith断裂功和广义层错能的变化情况。结果表明,γ-Al/γ'-Al_(3)Sc相界的抗剪切能力优于γ-Al/γ'-Al_(3)Er相界,而γ-Al/γ'-Al_(3)Er相界的抗拉性能优于γ-Al/γ'-Al_(3)Sc相界。随着γ-Al/γ'-Al_(3)Sc相界结构中Er偏析量的增加,该相界的Griffith断裂功与广义层错能均大幅提升。进一步计算Griffith断裂功与广义层错能比值(G/B)得到,Er的偏析使γ-Al/γ'-Al_(3)Sc相界的断裂功和抗剪切强度均升高,不同取向的γ-Al/γ'-Al_(3)Sc相界均呈本征脆性特征,Er的偏析不改变相界的韧脆特性。本研究可为Al-Sc合金的相界性能调控以及高性能低成本稀土铝合金的成分结构设计提供参考。 展开更多
关键词 第一性原理计算 层错能 稀土铝合金 γ-Al/γ'-Al_(3)Sc相界面
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