Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulatin...Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.展开更多
Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are...Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.展开更多
Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt format...Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.展开更多
Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applicat...Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement...Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.展开更多
Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the fo...Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.展开更多
Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible ...Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.展开更多
To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of ...To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of strength reduction due to the increases in void ratio were the same for binders with different strengths. To study the influence of aggregate size, 3 single size aggregates with nominal sizes of 5.0, 13.0 and 20.0 mm （Nos. 7, 6 and 5 according to JIS A 5001） were used to make porous concrete. The strengths of porous concrete are found to be dependent on aggregate size. The rate of strength reduction of porous concrete with small aggregate size is found to be higher than that with larger aggregate size. At the same void ratio, the strength of porous concrete with large aggregate is larger than that with small aggregate. The general equations for porous concrete are related to compressive strength and void ratio for different binder strengths and aggregate sizes.展开更多
This paper aims at investigating the effect of voids on the tensile properties of [（±45）4/（0,90）/（±45）2] S and [（±45）/0 4/（±45）（0,90）] S composites.Specimens with void contents in the r...This paper aims at investigating the effect of voids on the tensile properties of [（±45）4/（0,90）/（±45）2] S and [（±45）/0 4/（±45）（0,90）] S composites.Specimens with void contents in the range of 0.4% to 9.0% were fabricated from carbon/epoxy fabric.The void content was determined by ultrasonic attenuation and optical image analysis,and microscopic inspection was also used to analyze the shape and size of the voids.The influence of voids on the tensile strength and modulus of both stacking sequence is compared in terms of the size and the shape of the voids.The effect of voids on the initiation and propagation of tensile failure of both stacking sequence composite was investigated.展开更多
In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed ...In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force. In the developed model, both the electric field and capillary force on the void's surface are solved analytically. Based on the mass conversation principle, the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under electric current. It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or collapse to a finger shape, depending on the relative magnitude of the electric current and surface capillary force. However, the elliptical-shaped void will elongate along the electric current direction and finally collapse to the finger shape. On the other hand, the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.展开更多
In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifte...In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifted mortar were measured by image analysis method. The relationship between the air void size distribution and strength of mortar was studied by methods of grey connection analysis and multiple linear regression analysis. The multiple linear regression equation was established with a correlation coefficient of 0.966. The weight of the affection of hierarchical porosity on the compressive strength ratio was also obtained. In addition, the effect of air voids on the paste-aggregate interfacial transition zone (ITZ) was analyzed by microhardness. The results show that the correlation between different pore size range and the compressive strength is negative. The effect of air void size distribution on 28 days compressive strength is different: under the condition of similar total porosity, with the increase of the porosity of the air void size, ranging from 10 to 200 mu m, and the decrease of the porosity, ranging from 200 to 1 600 mu m, the average air void diameter and mean free spacing are decreased; as well as the width of ITZ. On the contrary, the microhardness of the ITZ is increased while the compressive strength loss is decreased.展开更多
Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, bu...Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.展开更多
A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell inc...A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell including one sphere void or two sphere voids. The results of three different orientations for single crystal and bicrystals are compared. It is found that crystallographic orientation has noticeable influences on the void growth directionvoid shape, and void coalescence of single crystal. The void growth rate of bicrystals depends on the crystallographic orientations and grain boundary direction.展开更多
文摘Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.
基金supported by the National Natural Science Foundation of China(Grant Nos.12022210 and 12032001)。
文摘Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.
基金financial support from the National Key Research and Development Program of China(No.2024YFB4007100)the Basic ForwardLooking Project of the Sinopec Science and Technology Department,“Research on the Long-Term Sealing Mechanism of Multi-layer Salt Cavern Hydrogen Storage”(No.P24197-4)。
文摘Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.
基金supported by the National Natural Science Foundation of China(Grant Nos.12232005 and 12072101).
文摘Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金supported by the Ministry of Industry and Information Technology of China(grant number TC220A04W-7,203)CNNC Youth Elite Scientific Research Project,the National Key R&D Plan of China(grant number 2020YFB1901600)the National Science Technology Major Project of China(grant numbers 2017ZX06902012 and 2017ZX06901024).
文摘Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.
文摘Aim To develop a hydrodynamic model on the void fraction in liquid slugs for gas liquid slug flow in vertical tubes. Methods Developing the model by considering the gas exchange between the Taylor bubble and the following liquid slug. Results Some experimental data are obtained to check the model. In comparison with previous published results, the predictions from this model are better and in good agreement with the experimental data. The error is within ±20%. Conclusion The proposed model can correctly predict the void fraction in liquid slugs for gas liquid two phase slug flow in vertical tubes.
基金National Science and Technology Major Project of the Ministry of Science And Technology of China(No.2013YQ240803)Shanxi Programs for Science and Technology Development(Nos.20140321010-02,201603D121040-1)Scientific and Technological Innovation Programs of Higher Education Institutions of Shanxi Province(No.2013063)
文摘Voids are one of the major defects in ball grid array （BGA） solder joints due to a large amount of outgassing flux that gets entrapped during reflow. X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-ray images for detection However, it has always been difficult to analyze this problem automatically because of some challenges such as noise, inconsistent lighting and void-like artifacts. This study realized accurate extraction and automatic a-nalysis of void defects in solder joints by adopting a technical proposal, in which Otsu algorithm was used to segment solder balls and void defects were extracted through opening and closing operations and top-hat transformation in mathematical mor-phology. Experimental results show that the technical proposal mentioned here has good robustness and can be applied in the detection of voids in BGA solder joints.
文摘To test the influence of binder strength, porous concretes with 4 binder strengths between 30.0-135.0 MPa and 5 void ratios between 15%-35% were tested. The results indicated that for the same aggregate, the rates of strength reduction due to the increases in void ratio were the same for binders with different strengths. To study the influence of aggregate size, 3 single size aggregates with nominal sizes of 5.0, 13.0 and 20.0 mm （Nos. 7, 6 and 5 according to JIS A 5001） were used to make porous concrete. The strengths of porous concrete are found to be dependent on aggregate size. The rate of strength reduction of porous concrete with small aggregate size is found to be higher than that with larger aggregate size. At the same void ratio, the strength of porous concrete with large aggregate is larger than that with small aggregate. The general equations for porous concrete are related to compressive strength and void ratio for different binder strengths and aggregate sizes.
文摘This paper aims at investigating the effect of voids on the tensile properties of [（±45）4/（0,90）/（±45）2] S and [（±45）/0 4/（±45）（0,90）] S composites.Specimens with void contents in the range of 0.4% to 9.0% were fabricated from carbon/epoxy fabric.The void content was determined by ultrasonic attenuation and optical image analysis,and microscopic inspection was also used to analyze the shape and size of the voids.The influence of voids on the tensile strength and modulus of both stacking sequence is compared in terms of the size and the shape of the voids.The effect of voids on the initiation and propagation of tensile failure of both stacking sequence composite was investigated.
基金supported by the National Natural Science Foundation of China (Grant 11572249)the Aerospace Technology Foundation (Grant N2014KC0068)the Aeronautical Science Foundation of China (Grant N2014KC0073)
文摘In this work, analysis of electromigration-induced void morphological evolution in solder interconnects is performed based on mass diffusion theory. The analysis is conducted for three typical experimentally observed void shapes: circular, ellipse, and cardioid. Void morphological evolution is governed by the competition between the electric field and surface capillary force. In the developed model, both the electric field and capillary force on the void's surface are solved analytically. Based on the mass conversation principle, the normal velocity on the void surface during diffusion is obtained. The void morphological evolution behavior is investigated, and a physical model is developed to predict void collapse to a crack or to split into sub-voids under electric current. It is noted that when the electric current is being applied from the horizontal direction, a circular void may either move stably along the electric current direction or collapse to a finger shape, depending on the relative magnitude of the electric current and surface capillary force. However, the elliptical-shaped void will elongate along the electric current direction and finally collapse to the finger shape. On the other hand, the cardioid-shaped void could bifurcate into two sub-voids when the electric current reaches a critical value. The theoretical predictions agree well with the experimental observations.
基金Funded by the Major State Basic Research Development Program of China(973 Program)(No.2009CB623100)the National Natural Science Foundation of China(No.51378391)
文摘In order to facilitate the development and application of air entraining agents (AEA) in the high performance concrete, entrained air void structure parameters (air void size range from 10 to 1 600 mu m) of 28 d sifted mortar were measured by image analysis method. The relationship between the air void size distribution and strength of mortar was studied by methods of grey connection analysis and multiple linear regression analysis. The multiple linear regression equation was established with a correlation coefficient of 0.966. The weight of the affection of hierarchical porosity on the compressive strength ratio was also obtained. In addition, the effect of air voids on the paste-aggregate interfacial transition zone (ITZ) was analyzed by microhardness. The results show that the correlation between different pore size range and the compressive strength is negative. The effect of air void size distribution on 28 days compressive strength is different: under the condition of similar total porosity, with the increase of the porosity of the air void size, ranging from 10 to 200 mu m, and the decrease of the porosity, ranging from 200 to 1 600 mu m, the average air void diameter and mean free spacing are decreased; as well as the width of ITZ. On the contrary, the microhardness of the ITZ is increased while the compressive strength loss is decreased.
基金financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416)the Fundamental Research funds for the Central Universities (No.3102017GX06003)
文摘Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface charac- teristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.
基金supported by National Natural Science Foundation of China(No.50575143)the Research Fund for the Doctoral Program of Higher Educa-tion (No.20040248005)
文摘A three dimensional rate-dependent crystal plasticity model is applied to study the influence of crystal orientation and grain boundary on the void growth and coalescence. The 3D computational model is a unit cell including one sphere void or two sphere voids. The results of three different orientations for single crystal and bicrystals are compared. It is found that crystallographic orientation has noticeable influences on the void growth directionvoid shape, and void coalescence of single crystal. The void growth rate of bicrystals depends on the crystallographic orientations and grain boundary direction.
