Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt format...Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.展开更多
Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systema...Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systematic quantification of performance boundaries for air-coupled(A-CGPR)and ground-coupled(G-CGPR)systems within the complex electromagnetic environment of multilayer reinforced HSR tunnels remains limited.This study establishes physics-based quantitative performance limits for A-CGPR and G-CGPR through rigorously validated GPRMax finite-difference time-domain(FDTD)simulations and comprehensive field validation over a 300 m operational HSR tunnel section.Key performance metrics were quantified as functions of:(a)detection distance(A-CGPR:2.0–4.5 m;G-CGPR:≤0.1 m),(b)antenna frequency(A-CGPR:300 MHz;G-CGPR:400/900 MHz),(c)reinforcement configuration(unreinforced,single-layer,multilayer rebar),and(d)void geometry(axial length:0.1–1.0 m;radial depth:0.1–0.5 m).Key findings demonstrate:a.A-CGPR(300 MHz):Reliably detects axial voids≥0.3 m at distances≤3 m in minimally reinforced(single-layer rebar)linings(field R2=0.89).Performance degrades significantly at distances>3 m(>60%signal attenuation at 4.5 m)or under multilayer rebar interference,causing 25%–40%accuracy loss for voids<0.3 m.Optimal distance:2.0–2.5 m.b.G-CGPR(900 MHz):Achieves<5%size measurement error for axial voids≥0.1 m and radial voids≥0.2 m in unreinforced linings.Resolution degrades under multilayer reinforcement due to severe signal attenuation,increasing axial void detection error to 10%–20%for voids≥0.3 m and constraining radial size measurement.c.Synergistic Framework:A hybrid inspection protocol is proposed,integrating A-CGPR(20 km/h)for rapid large-area screening and targeted G-CGPR(3 km/h)for high-resolution verification of identified anomalies.This framework enhances NDT efficiency while reducing estimated lifecycle inspection costs by 34%compared to G-CGPR alone.This research provides the first physics-derived quantitative detection thresholds for A-CGPR and G-CGPR in multi-rebar HSR tunnels,validated through field-correlated simulations.Future work will focus on multi-frequency antenna arrays and deep learning algorithms to mitigate reinforcement interference.The established performance boundaries and hybrid framework offer critical guidance for optimizing tunnel lining inspection strategies in extensive HSR networks.展开更多
Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,an...Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.展开更多
Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulatin...Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.展开更多
Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are...Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.展开更多
Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applicat...Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
With the ever-increasing energy density requirements for sulfide-based all-solid-state batteries,lithium metal is regarded as an ideal candidate for anode materials.However,the dynamic degradation of solidsolid contac...With the ever-increasing energy density requirements for sulfide-based all-solid-state batteries,lithium metal is regarded as an ideal candidate for anode materials.However,the dynamic degradation of solidsolid contact between lithium anode and solid electrolyte remains a major challenge for the application of all-solid-state lithium metal batteries(ASSLMBs).The poor solid-solid contact problem is caused by the continuous accumulation of lithium voids,which results from the limited diffusion rate of lithium in the bulk phase.In this study,we design a three-dimensional(3D)lithiophilic graphitized carbon nanotubebased(LNT)interlayer to address interfacial issues.The interlayers effectively regulate lithium stripping and suppress the growth of lithium voids via improved lithium diffusion,leading to a conformal interface during continuous cycling.The lithium metal anode with the interlayer delivers an areal capacity of 12.96 mA h cm^(-2),and when paired with a LiNi_(0.9)Co_(0.05)Mn_(0.05)O_(2)(NCM9)cathode,the battery retains over 91%capacity retention after 100 cycles at room temperature.This work provides an effective strategy for interface stabilization in high-capacity and long-life ASSLMBs.展开更多
Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement...Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.展开更多
针对复合材料电池包下箱体的树脂传递模塑(Resin Transfer Molding,RTM)成型进行了方案设计,基于PAM-RTM软件对其充模过程进行仿真分析及孔隙缺陷预测。首先,对比了两种方案在三种出胶口状态下充模时间,分析了注胶压力及树脂黏度对RTM...针对复合材料电池包下箱体的树脂传递模塑(Resin Transfer Molding,RTM)成型进行了方案设计,基于PAM-RTM软件对其充模过程进行仿真分析及孔隙缺陷预测。首先,对比了两种方案在三种出胶口状态下充模时间,分析了注胶压力及树脂黏度对RTM成型时间的影响规律;其次,分析了充模过程中注胶口附近位置的压力变化情况;最后,预测了宏观/微观两种尺度孔隙缺陷在构件中分布及注胶压力对孔隙含量的影响规律,并结合流速优化理论控制树脂前沿流速以降低孔隙含量。结果表明,模腔内注胶与出胶口压力差越大,成型用时越少,且受到注胶位置影响。注胶压力与充模时间呈线性关系,压力越低,充模时间缩短效果越明显,且黏度越大,充模时间越长。孔隙含量与前沿流速有关,注胶压力越大导致流速越快,宏观孔隙随之减少,微观孔隙相应增多;且流速优化方式注胶能够显著降低总体孔隙率水平,但会延长成型周期。展开更多
基金financial support from the National Key Research and Development Program of China(No.2024YFB4007100)the Basic ForwardLooking Project of the Sinopec Science and Technology Department,“Research on the Long-Term Sealing Mechanism of Multi-layer Salt Cavern Hydrogen Storage”(No.P24197-4)。
文摘Renewable energy storage technologies are critical for transitioning to sustainable energy systems,with salt caverns playing a significant role in large-scale solutions.In water-soluble mining of low-grade salt formations,insoluble impurities and interlayers detach during salt dissolution and accumulate as sediment at the cavern base,thereby reducing the storage capacity and economic viability of salt cavern gas storage(SCGS).This study investigates sediment formation mechanisms,void distribution,and voidage in the Huai'an low-grade salt mine,introducing a novel self-developed physical simulation device for two butted-well horizontal(TWH)caverns that replicates compressed air injection and brine discharge.Experiments comparing“one injection and one discharge”and“two injections and one discharge”modes revealed that(1)compressed air effectively displaces brine from sediment voids,(2)a 0.5 MPa injection pressure corresponds to a 10.3 MPa operational lower limit in practice,aligning with field data,and(3)sediment voidage is approximately 46%,validated via air-brine interface theory.The“two injections and one discharge”mode outperformed in both discharge volume and rate.Additionally,a mathematical model for brine displacement via compressed air was established.These results provide foundational insights for optimizing compressed air energy storage(CAES)in low-grade salt mines,advancing their role in renewable energy integration.
基金funded by the Key Project of Science&Technology Research ofChina Academy of Railway Sciences,grant number 2023YJ022.
文摘Detecting internal defects,particularly voids behind linings,is critical for ensuring the structural integrity of aging high-speed rail(HSR)tunnel networks.While ground-penetrating radar(GPR)is widely employed,systematic quantification of performance boundaries for air-coupled(A-CGPR)and ground-coupled(G-CGPR)systems within the complex electromagnetic environment of multilayer reinforced HSR tunnels remains limited.This study establishes physics-based quantitative performance limits for A-CGPR and G-CGPR through rigorously validated GPRMax finite-difference time-domain(FDTD)simulations and comprehensive field validation over a 300 m operational HSR tunnel section.Key performance metrics were quantified as functions of:(a)detection distance(A-CGPR:2.0–4.5 m;G-CGPR:≤0.1 m),(b)antenna frequency(A-CGPR:300 MHz;G-CGPR:400/900 MHz),(c)reinforcement configuration(unreinforced,single-layer,multilayer rebar),and(d)void geometry(axial length:0.1–1.0 m;radial depth:0.1–0.5 m).Key findings demonstrate:a.A-CGPR(300 MHz):Reliably detects axial voids≥0.3 m at distances≤3 m in minimally reinforced(single-layer rebar)linings(field R2=0.89).Performance degrades significantly at distances>3 m(>60%signal attenuation at 4.5 m)or under multilayer rebar interference,causing 25%–40%accuracy loss for voids<0.3 m.Optimal distance:2.0–2.5 m.b.G-CGPR(900 MHz):Achieves<5%size measurement error for axial voids≥0.1 m and radial voids≥0.2 m in unreinforced linings.Resolution degrades under multilayer reinforcement due to severe signal attenuation,increasing axial void detection error to 10%–20%for voids≥0.3 m and constraining radial size measurement.c.Synergistic Framework:A hybrid inspection protocol is proposed,integrating A-CGPR(20 km/h)for rapid large-area screening and targeted G-CGPR(3 km/h)for high-resolution verification of identified anomalies.This framework enhances NDT efficiency while reducing estimated lifecycle inspection costs by 34%compared to G-CGPR alone.This research provides the first physics-derived quantitative detection thresholds for A-CGPR and G-CGPR in multi-rebar HSR tunnels,validated through field-correlated simulations.Future work will focus on multi-frequency antenna arrays and deep learning algorithms to mitigate reinforcement interference.The established performance boundaries and hybrid framework offer critical guidance for optimizing tunnel lining inspection strategies in extensive HSR networks.
基金financially supported by National Natural Science Foundation of China(No.U2241223)Pre-Research Foundation of China(No.909010203-202).
文摘Nano-twinned copper(nt-Cu),with a preferred orientation,is highly promising as interconnect materials in high-density advanced packaging due to its considerable mechanical strength,excellent electrical conductivity,and resistance to thermal migration.However,its application is impeded by sulfur-containing byproducts from the electroplating process,exacerbating the formation of Kirkendall voids within solder joints during thermal aging.Herein,through the incorporation of Zinc(Zn)into the nt-Cu layer,we develop a nt-Cu/Zn composite structure.Our findings provide the first definitive confirmation of the mechanism by which sulfur atoms migrate to the Cu_(3)Sn/nt-Cu interface through interstitial diffusion,thereby reducing the activation energy for vacancy formation.We further demonstrate that Zn effectively an-choring sulfur atoms,forming ZnS within the nt-Cu layer during heat treatment,which increases the vacancy formation energy and inhibits the development of Kirkendall voids.Remarkably,no Kirkendall voids are observed in the modified interconnects even after prolonged aging at 150℃ for 1000 h.The nt-Cu/Zn composite metallization layers significantly decrease the growth rate of interfacial intermetallic compounds by 33.6% and enhance the shear strength of solder interconnections to 228.9%.This research underscores the potential of nt-Cu in advanced electronic packaging,offering new pathways for improving the power density and reliability of electronic devices.
文摘Flip-chip technology is widely used in integrated circuit(IC)packaging.Molded underfill transfer molding is the most common process for these products,as the chip and solder bumps must be protected by the encapsulating material to ensure good reliability.Flow-front merging usually occurs during the molding process,and air is then trapped under the chip,which can form voids in the molded product.The void under the chip may cause stability and reliability problems.However,the flow process is unobservable during the transfer molding process.The engineer can only check for voids in the molded product after the process is complete.Previous studies have used fluid visualization experiments and developed computational fluid dynamics simulation tools to investigate this issue.However,a critical gap remains in establishing a comprehensive three-dimensional model that integrates two-phase flow,accurate venting settings,and fluid surface tension for molded underfill void evaluation—validated by experimental fluid visualization.This study aims to address this gap in the existing literature.In this study,a fluid visualization experiment was designed to simulate the transfer molding process,allowing for the observation of flow-front merging and void formation behaviors.For comparison,a three-dimensional mold flow analysis was also performed.It was found that the numerical simulation of the trapped air compression process under the chip was more accurate when considering the capillary force.The effect of design factors is evaluated in this paper.The results show that the most important factors for void size are fluid viscosity,the gap height under the chip,transfer time,contact angle between the fluid and the contact surfaces,and transfer pressure.Specifically,a smaller gap height beneath the chip aggravates void formation,while lower viscosity,extended transfer time,reduced contact angle,and increased transfer pressure are effective in minimizing void size.The overall results of this study will be useful for product and process design in selecting appropriate solutions for IC packaging,particularly in the development of void-free molded-underfill flip-chip packages.These findings support the optimization of industrial packaging processes in semiconductor manufacturing by guiding material selection and process parameters,ultimately enhancing package reliability and yield.
基金supported by the National Natural Science Foundation of China(Grant Nos.12022210 and 12032001)。
文摘Voids play an important role in the fatigue behaviour of polycrystal materials.In this paper,the effects of three factors affecting the stress concentration factors(SCFs)near voids,i.e.,size,depth,and applied load,are investigated by employing crystal plasticity constitutive models in polycrystal bulks.The results indicate that SCF is dominated by the void size,while void depth and stress level play secondary roles.The SCF fluctuates by the orientation differences among grains and increases with increasing the size of the void.Finally,based on sensitivity examination of orientations and configurations of grains sur-rounding the void,an empirical multivariable-coupled formula is proposed to assess SCF near voids considering anisotropy,and the presented model is in good agreement with the simulation results.
基金supported by the National Natural Science Foundation of China(Grant Nos.12232005 and 12072101).
文摘Large-grain REBa_(2)Cu_(3)O_(7-δ)(REBCO,RE=rare earth)bulk superconductors offer promising magnetic field trapping capabilities due to their high critical current density,making them ideal for many important applications such as trapped field magnets.However,for such large-grain superconductor bulks,there are lots of voids and cracks forming during the process of melting preparation,and some of them can be up to hundreds of microns or even millimeters in size.Consequently,these larger size voids/cracks pose a great threat to the strength of the bulks due to the inherent brittleness of superconductor REBCO materials.In order to ensure the operational safety of related superconducting devices with bulk superconductors,it is firstly important to accurately detect these voids/cracks in them.In this paper,we proposed a method for quantitatively evaluating multiple voids/cracks in bulk superconductors through the magnetic field and displacement response signals at superconductor bulk surface.The proposed method utilizes a damage index constructed from the magnetic field signals and displacement responses to identify the number and preliminary location of multiple defects.By dividing the detection area into subdomains and combining the magnetic field signals with displacement responses within each subdomain,a particle swarm algorithm was employed to evaluate the location and size parameters of the defects.In contrast to other evaluation methods using only magnetic field or displacement response signals,the combined evaluation method using both signals can identify the number of cracks effectively.Numerical studies demonstrate that the morphology of voids and cracks reconstructed using the proposed algorithm ideally matches real defects and is applicable to cases where voids and cracks coexist.This study provides a theoretical basis for the quantitative detection of voids/cracks in bulk superconductors.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金the Shanxi Province Science Foundation(20210302123150)the National Key Research and Development Program(2021YFB2500300)+3 种基金the National Natural Science Foundation of China(223B1012,22409114)the Beijing Natural Science Foundation(L243019)the Anhui Science and Technology Innovation Tackling Key Problems Plan Project(202423h08050005)the China Postdoctoral Science Foundation(2023M731920)。
文摘With the ever-increasing energy density requirements for sulfide-based all-solid-state batteries,lithium metal is regarded as an ideal candidate for anode materials.However,the dynamic degradation of solidsolid contact between lithium anode and solid electrolyte remains a major challenge for the application of all-solid-state lithium metal batteries(ASSLMBs).The poor solid-solid contact problem is caused by the continuous accumulation of lithium voids,which results from the limited diffusion rate of lithium in the bulk phase.In this study,we design a three-dimensional(3D)lithiophilic graphitized carbon nanotubebased(LNT)interlayer to address interfacial issues.The interlayers effectively regulate lithium stripping and suppress the growth of lithium voids via improved lithium diffusion,leading to a conformal interface during continuous cycling.The lithium metal anode with the interlayer delivers an areal capacity of 12.96 mA h cm^(-2),and when paired with a LiNi_(0.9)Co_(0.05)Mn_(0.05)O_(2)(NCM9)cathode,the battery retains over 91%capacity retention after 100 cycles at room temperature.This work provides an effective strategy for interface stabilization in high-capacity and long-life ASSLMBs.
基金supported by the Ministry of Industry and Information Technology of China(grant number TC220A04W-7,203)CNNC Youth Elite Scientific Research Project,the National Key R&D Plan of China(grant number 2020YFB1901600)the National Science Technology Major Project of China(grant numbers 2017ZX06902012 and 2017ZX06901024).
文摘Nickel-based alloys are the primary structural materials in steam generators of high-temperature gas reactors.To understand the irradiation effect of nickel-based alloys,it is necessary to examine dislocation movement and its interaction with irradiation defects at the microscale.Hardening due to voids and Ni_(3)Al precipitates may significantly impact irradiation damage in nickel-based alloys.This paper employs the molecular dynamics method to analyze the interaction between edge dislocations and irradiation defects(void and Ni_(3)Al precipitates)in face-centered cubic nickel.The effects of temperature and defect size on the interaction are also explored.The results show that the interaction process of the edge dislocation and irradiation defects can be divided into four stages:dislocation free slip,dislocation attracted,dislocation pinned,and dislocation unpinned.Interaction modes include the formation of stair-rod dislocations and the climbing of extended dislocation bundles for voids,as well as the generation of stair-rod dislocation and dislocation shear for precipitates.Besides,the interactions of edge dislocations with voids and Ni_(3)Al precipitates are strongly influenced by temperature and defect size.
文摘针对复合材料电池包下箱体的树脂传递模塑(Resin Transfer Molding,RTM)成型进行了方案设计,基于PAM-RTM软件对其充模过程进行仿真分析及孔隙缺陷预测。首先,对比了两种方案在三种出胶口状态下充模时间,分析了注胶压力及树脂黏度对RTM成型时间的影响规律;其次,分析了充模过程中注胶口附近位置的压力变化情况;最后,预测了宏观/微观两种尺度孔隙缺陷在构件中分布及注胶压力对孔隙含量的影响规律,并结合流速优化理论控制树脂前沿流速以降低孔隙含量。结果表明,模腔内注胶与出胶口压力差越大,成型用时越少,且受到注胶位置影响。注胶压力与充模时间呈线性关系,压力越低,充模时间缩短效果越明显,且黏度越大,充模时间越长。孔隙含量与前沿流速有关,注胶压力越大导致流速越快,宏观孔隙随之减少,微观孔隙相应增多;且流速优化方式注胶能够显著降低总体孔隙率水平,但会延长成型周期。
