Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe...Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.展开更多
Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effe...Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effects of atmosphere, temperature, substrate, and Ce addition on the solderability of Sn-Cu-Ni-xCe solder were studied, respectively, and Auger electron spectroscopy （ AES） analysis in the depth direction of the alloy was carried out to discuss the effect of Ce addition on the solderability. The results indicate that the greatest improvement on the solderability of Sn-Cu-Ni-xCe is obtai^d with around O. 05wt. % -0. 07wt. % Ce addition, for Ce element keeps high content in a specific area in the depth direction from the surface of Sn-Cu-Ni alloy, which decreases the surface tension of molten solder. It is also found that the solderability of Sn-Cu-Ni-xCe solder on Au/Ni/ Cu substrate is better than that on Cu substrate. In N2 atmosphere, the wetting times of Sn- Ca-Ni-xCe alloys are reduced by 10% - 35% , below 1 s at 260 ℃ on Ca substrate, and about 1s at 250 ℃ on Au/Ni/Ca substrate.展开更多
To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSb...To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.展开更多
Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength...Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength were investigated. The interfacial microstructure was investigated and the mechanical properties of the joint were evaluated by shear testing. The bonding strength of the clad materials was generally enhanced by increasing the total reduction or preheating temperature, which caused the metal interface to flatten. No obvious reaction or diffusion layer was observed at the interface between Al 1060 and pure iron. The bonding strength increased with decreasing the initial thickness of the Al 1060 sheets. The Al 1060/pure iron clad materials were soldered with Zn-Al alloy by using an ultrasonic-assisted method. Strong bonding of the Al 1060 layer and Al 7N01 was realized without obvious Al 1060 dissolution or effect on the initial interface of Al 1060/pure iron clad materials by soldering at relatively low temperature.展开更多
The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and int...The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds （IMCs） formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti- nosity and fluidity of Sn-9Zn-（0.5, 1）Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interracial intermetallics （CusZn8）. The peripheral AgZn3, nodular on the Cu5Zn8 IMCs layer, is likely to be generated by a peritectic reaction L ＋ γ-Ag5Zns→AgZn3 and the following crystallization of AgZn3.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.展开更多
Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepar...Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.展开更多
Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technolo...Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.展开更多
Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This r...Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.展开更多
The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures fr...The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.展开更多
Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development ...Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.展开更多
The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of el...The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.展开更多
The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation wer...The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.展开更多
Achieving reliable bonding is critical for low-temperature active soldering in Al alloys.In this study,a novel Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder was developed for active soldering of 5A06-Al alloy...Achieving reliable bonding is critical for low-temperature active soldering in Al alloys.In this study,a novel Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder was developed for active soldering of 5A06-Al alloy at 350℃.Effects of soldering time on the microstructure and mechanical properties of joints were investigated,and the interfacial bonding mechanism of joints was analyzed.Results showed that the(Cu,Ni)_(6)Sn_(5) phase was formed between alloy mesh and SAC305 solder in the active composite solder,while Ti atoms were uniformly released from the alloy mesh.Metallurgical products within joints mainly comprised(Cu,Ni)_(6)Sn_(5) and Al_(3)(Ni,Cu)_(2) phases,which developed with increasing soldering time.An amorphous Al_(2)O_(3) layer and a Mg-containing layer were formed at the Al substrate/SAC305 solder interface.Mg atoms could enhance the charge transfer between Ti atoms and oxide film,attracting the diffusion of Ti atoms to oxide film.The oxide film removal processes relied on the synergistic impacts of Ti and Mg.The highest shear strength of joints reached 53.21±0.91 MPa,exceeding previously reported properties for low-temperature active soldering by over 100%.This exploration may provide insights into developing low-temperature active soldering technologies for Al alloys.展开更多
Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated ...Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.展开更多
The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading t...The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.展开更多
To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were iden...To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.展开更多
The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently i...The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.展开更多
文摘Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.
文摘Abstract A small amount of rare earth Ce was added to Sn-Cu-Ni solder alloy, and the solderability of Sn-0. 5Cu-0. 05Ni- xCe solders on Cu and Au/Ni/Cu substrates was determined by the wetting balance method. The effects of atmosphere, temperature, substrate, and Ce addition on the solderability of Sn-Cu-Ni-xCe solder were studied, respectively, and Auger electron spectroscopy （ AES） analysis in the depth direction of the alloy was carried out to discuss the effect of Ce addition on the solderability. The results indicate that the greatest improvement on the solderability of Sn-Cu-Ni-xCe is obtai^d with around O. 05wt. % -0. 07wt. % Ce addition, for Ce element keeps high content in a specific area in the depth direction from the surface of Sn-Cu-Ni alloy, which decreases the surface tension of molten solder. It is also found that the solderability of Sn-Cu-Ni-xCe solder on Au/Ni/ Cu substrate is better than that on Cu substrate. In N2 atmosphere, the wetting times of Sn- Ca-Ni-xCe alloys are reduced by 10% - 35% , below 1 s at 260 ℃ on Ca substrate, and about 1s at 250 ℃ on Au/Ni/Ca substrate.
基金supported by the Program for Science & Technology Innovation Talents in Universities of Henan Province (No.2010HASTIT032)the City Key Technologies R & D Program of Luoyang (No.0801038A), China
文摘To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.
基金the project from the International S&T Cooperation (No.2011DFR 50630)Special Research Program for Innovation Talents from Harbin Municipality of Science and Technology (2012RFXXG071,2010RFQXG020)Harbin Science and Technology Innovation Youth Talents Fund (No.2010RFQXG003)
文摘Al 1060/pure iron clad materials were produced by vacuum roll bonding. The effects of preheating temperature, vacuum roll reduction and initial thickness of the A11060 sheet on the metal interface and bonding strength were investigated. The interfacial microstructure was investigated and the mechanical properties of the joint were evaluated by shear testing. The bonding strength of the clad materials was generally enhanced by increasing the total reduction or preheating temperature, which caused the metal interface to flatten. No obvious reaction or diffusion layer was observed at the interface between Al 1060 and pure iron. The bonding strength increased with decreasing the initial thickness of the Al 1060 sheets. The Al 1060/pure iron clad materials were soldered with Zn-Al alloy by using an ultrasonic-assisted method. Strong bonding of the Al 1060 layer and Al 7N01 was realized without obvious Al 1060 dissolution or effect on the initial interface of Al 1060/pure iron clad materials by soldering at relatively low temperature.
基金supported by the Jiangsu Six-kind Skilled Personnel Project,China (No.06-E-020)
文摘The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds （IMCs） formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the gluti- nosity and fluidity of Sn-9Zn-（0.5, 1）Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interracial intermetallics （CusZn8）. The peripheral AgZn3, nodular on the Cu5Zn8 IMCs layer, is likely to be generated by a peritectic reaction L ＋ γ-Ag5Zns→AgZn3 and the following crystallization of AgZn3.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216)Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
文摘To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
基金ational Natural Science Foundation of China(U1604132)Central Plains Talents Program-Fund of Central Plains Leading Talents(ZYYCYU002130)+1 种基金Key Technology Research and Development Program of Henan Province(222102230114)Major Scientific Research Foundation of Higher Education of Henan Province(23B430003)。
文摘Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.
基金Henan Province Central Guiding Local Science and Technology Development Fund Project(Z20231811002)。
文摘Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.
基金National Key Research and Development Program(2021YFB3401101)。
文摘Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.
基金financially supported by the Fundamental Research Project of Yunnan Province,China(Nos.202301AW070020,202201AT070229,202105AC160091,202202AB080018).
文摘The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.
基金financially supported by the State Key Laboratory for Mechanical Behavior of Materials,China(No.202325012)the National Natural Science Foundation of China(No.U21A20128).
文摘Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.
基金financially supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016)the Key Research&Development Program of Yunnan Province(No.202103AA080017)Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ2018-044)。
文摘The construction of intermetallic compounds(IMCs)connection layers with special compositions by adding small amounts of alloying elements has been proven to be an effective strategy for improving the reliability of electronic component interconnect.However,the synergistic effect mechanism of multi-component alloy compositions on the growth behavior of IMCs is not clear.Herein,we successfully prepared a new quaternary alloy solder with a composition of Sn-0.7Cu-0.175Pt-0.025Al(wt%)using the high-throughput screening(HTS)method.The results showed that it possesses excellent welding performance with an inhibition rate over 40%on the growth of IMCs layers.For Cu_(6)Sn_(5),the co-doping of Al and Pt not only greatly improves its thermodynamic stability,but also effectively suppresses the phase transition.Meanwhile,the co-doping of Al and Pt also significantly delays the generation time of Kirkendall defects.The substitution sites of Al and Pt in Cu_(6)Sn_(5)have been explored using atomic resolution imaging and advanced data informatics,indicating that Al and Pt preferentially substitute Sn and Cu atoms,respectively,to generate(Cu,Pt)_(6)(Sn,Al)_(5).A one-dimensional(1D)kinetic model of the IMCs layer growth at the Sn solder/Cu substrate interface was derived and validated,and the results showed that the error of the derived mathematical model is less than 5%.Finally,the synergistic mechanism of Al and Pt co-doping on the growth rate of Cu_(6)Sn_(5)was further elucidated.This work provides a feasible route for the design and development of multi-component alloy solders.
基金National Natural Science Foundation of China (No. 52206180)Fundamental Research Funds for the Central Universities,China (No. WK2320000050)。
文摘The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.
基金supported by the National Nature Sci-ence Foundation of China(Nos.52374398 and 52171045)the UK Engineering and Physical Sciences Research Council(No.EP/S032169/1).
文摘Achieving reliable bonding is critical for low-temperature active soldering in Al alloys.In this study,a novel Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder was developed for active soldering of 5A06-Al alloy at 350℃.Effects of soldering time on the microstructure and mechanical properties of joints were investigated,and the interfacial bonding mechanism of joints was analyzed.Results showed that the(Cu,Ni)_(6)Sn_(5) phase was formed between alloy mesh and SAC305 solder in the active composite solder,while Ti atoms were uniformly released from the alloy mesh.Metallurgical products within joints mainly comprised(Cu,Ni)_(6)Sn_(5) and Al_(3)(Ni,Cu)_(2) phases,which developed with increasing soldering time.An amorphous Al_(2)O_(3) layer and a Mg-containing layer were formed at the Al substrate/SAC305 solder interface.Mg atoms could enhance the charge transfer between Ti atoms and oxide film,attracting the diffusion of Ti atoms to oxide film.The oxide film removal processes relied on the synergistic impacts of Ti and Mg.The highest shear strength of joints reached 53.21±0.91 MPa,exceeding previously reported properties for low-temperature active soldering by over 100%.This exploration may provide insights into developing low-temperature active soldering technologies for Al alloys.
基金support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216).
文摘Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.
基金Project(51004039)supported by the National Natural Science Foundation of ChinaProject(2012713)supported by the Cooperation Promoting Foundation in Science and Technology of Shaoxing City,China
文摘The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.
基金Projects(51475072,51171036)supported by the National Natural Science Foundation of China
文摘To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.
基金the Natural Science Foundation of Jiangsu Province(BK2006723)the China Postdoc-toral Science Foundation(20060400282)~~
文摘The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.
