To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.展开更多
The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffr...The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.展开更多
Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepar...Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.展开更多
Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technolo...Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.展开更多
Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This r...Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.展开更多
Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermet...Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.展开更多
The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures fr...The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.展开更多
Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development ...Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.展开更多
The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation wer...The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.展开更多
Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the differenc...Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.展开更多
Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of sold...Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.展开更多
Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated ...Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.展开更多
Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The u...Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.展开更多
The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading t...The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.展开更多
To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were iden...To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.展开更多
The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently i...The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.展开更多
The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic co...The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.展开更多
The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal agin...The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.展开更多
The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders, 0-...The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders, 0-0.5 wt.% of rare earth Er was added to the base alloys, and the microstructures were studied. Results showed that the addition of rare earth Er could enhance the wettability of SnZn solders, with 0.08%Er addition, the spreading area gavc an 19.1% increase. And based on the mechanical testing, it was found that the tensile force and shear force of SnZn-xEr solder joints could be improved significantly. Moreover, the oxidation resistance of SnZn0.08Er solder was better than that of SnZn solder, in addition, it was found that trace amounts of rare earth Er could refine the microstructures of SnZn solders, espe- cially for Zn-rich phases, and excessive amount of rare earth Er led to a coarse microstructure.展开更多
Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as ou...Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.展开更多
基金financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216)Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).
文摘To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si particle reinforcement was obtained.The oxide film of Al−60Si alloy at the interface was identified by transmission electron microscopy(TEM)analysis as amorphous Al_(2)O_(3).The oxide of Si particles in the base metal was also alumina.The oxide film of Al−60Si alloy was observed to be removed by ultrasonic vibration instead of holding treatment.Si particle-reinforced joints(35.7 vol.%)were obtained by increasing the ultrasonication time.The maximum shear strength peaked at 99.5 MPa for soldering at 330℃with an ultrasonic vibration time of 50 s.A model of forming of Si particles reinforced joint under the ultrasound was proposed,and ultrasonic vibration was considered to promote the dissolution of Al and migration of Si particles.
基金Project(20115003)supported by the Program for the Development of Science and Technology of Jilin Province,China
文摘The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.
基金ational Natural Science Foundation of China(U1604132)Central Plains Talents Program-Fund of Central Plains Leading Talents(ZYYCYU002130)+1 种基金Key Technology Research and Development Program of Henan Province(222102230114)Major Scientific Research Foundation of Higher Education of Henan Province(23B430003)。
文摘Dopamine polymerization reaction and hydrothermal method were used to prepare nickel coated Al_(2)O_(3)reinforcement phase(Ni/Al_(2)O_(3)).Ni/Al_(2)O_(3)reinforced Sn_(1.0)Ag_(0.5)Cu(SAC105)composite solder was prepared using traditional casting method.The result shows that the nickel coating layer is continuous with uneven thickness.The interface between nickel and aluminum oxide exhibits a metallurgical bonding with coherent interface relationship.The strength,toughness and wettability of the SAC105 solder on the substrate are improved,while the conductivity is not decreased significantly.The fracture mode of composites transitions from a mixed toughness-brittleness mode to a purely toughness-dominated mode,characterized by many dimples.The prepared composite brazing material was made into solder paste for copper plate lap joint experiments.The maximum shear strength is achieved when the doping amount was 0.3wt%.The growth index of intermetallic compound at the brazing interface of Ni/Al_(2)O_(3)reinforced SAC105 composite solder is linearly fitted to n=0.39,demonstrating that the growth of intermetallic compound at the interface is a combined effect of grain boundary diffusion and bulk diffusion.
基金Henan Province Central Guiding Local Science and Technology Development Fund Project(Z20231811002)。
文摘Flux-coated brazing and soldering material is a type of material-saving and emission-reducing composite material in recent years,which is the representative product of the development of brazing and soldering technology,which is highly concerned by welding researchers worldwide.This work mainly reviewed the research reports on the design,preparation technology,and application of flux-coated brazing and soldering materials,put forward the shortcomings of current research,and proposed the future research directions mainly focusing on the standards,the synergistic reaction mechanism between flux and metals,the alloying,and the morphology of flux-coated brazing and soldering materials in order to provide reference information and theoretical guidance for related research and technological development in the field of welding.
基金National Key Research and Development Program(2021YFB3401101)。
文摘Short process forming techniques for brazing and soldering materials can shorten the process,improve product quality,and increase production efficiency,which has received much attention from welding researchers.This review mainly summarized the research reports on short process forming techniques for brazing and soldering materials.Firstly,the traditional process and its shortcomings were presented.Secondly,the latest research of short process forming technologies,such as continuous casting technique,atomization powder technique,solder ball forming technique,and rapid solidification technique,was summarized,and the traditional forming performance of several brazing and soldering materials was introduced.Finally,the current restrictions and research trends of short process forming technique for brazing and solder materials were put forward,providing theoretical guidance and reference for related research and technique development in brazing and soldering field.
基金Project(51074112)supported by the National Natural Science Foundation of China
文摘Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.
基金financially supported by the Fundamental Research Project of Yunnan Province,China(Nos.202301AW070020,202201AT070229,202105AC160091,202202AB080018).
文摘The vacuum volatilization kinetics of Pb in In-Pb solder was investigated.The results indicate a significant increase in the vacuum volatilization rates of Pb,25In-75Pb,40In-60Pb,and In with increasing temperatures from 923 to 1123 K,system pressure of 3 Pa and holding time of 30 min.The mass transfer coefficients and apparent activation energies of Pb and its alloys were determined at various temperatures.Additionally,a kinetics model was developed to describe Pb vacuum volatilization in high-temperature melts.It is obtained that the vapor mass transfer is the factor limiting the vacuum volatilization rates of Pb and In-Pb alloys under the above specified conditions.
基金financially supported by the State Key Laboratory for Mechanical Behavior of Materials,China(No.202325012)the National Natural Science Foundation of China(No.U21A20128).
文摘Sn-based solder is a widely used interconnection material in the field of electronic packaging;however,the performance requirements for these solders are becoming increasingly demanding owing to the rapid development in this area.In recent years,the addition of micro/nanoreinforcement phases to Sn-based solders has provided a solution to improve the intrinsic properties of the solders.This paper reviews the progress in Sn-based micro/nanoreinforced composite solders over the past decade.The types of reinforcement particles,preparation methods of the composite solders,and strengthening effects on the microstructure,wettability,melting point,mechanical properties,and corrosion resistance under different particle-addition levels are discussed and summarized.The mechanisms of performance enhancement are summarized based on material-strengthening effects such as grain refinement and second-phase dispersion strengthening.In addition,we discuss the current shortcomings of such composite solders and possible future improvements,thereby establishing a theoretical foundation for the future development of Sn-based solders.
基金National Natural Science Foundation of China (No. 52206180)Fundamental Research Funds for the Central Universities,China (No. WK2320000050)。
文摘The corrosion behavior and life of Sn−3.0Ag−0.5Cu solder joints were investigated through fire smoke exposure experiments within the temperature range of 45−80℃.The nonlinear Wiener process and Arrhenius equation were used to establish the probability distribution function and prediction model of the solder joint’s average life and individual remaining useful life.The results indicate that solder joint resistance shows a nonlinear growth trend with time increasing.After 24 h,the solder joint transforms from spherical to rose-like shapes.Higher temperatures accelerate solder joint failure,and the relationship between failure time and temperature conforms to the Arrhenius equation.The predicted life of the model is in good agreement with experimental results,demonstrating the effectiveness and accuracy of the model.
基金financially supported by the National Natural Science Foundation of China(Nos.62274172 and 62304143)High-level Talent Innovation and Entrepreneurship Plan of Shenzhen Key Technology Research and Development Team Funding Application(No.JSGGKQTD20221101115650008)+2 种基金Shenzhen-Hong Kong-Macao Science and Technology Plan Project(Category C)(No.SGDX20220530111004028)Macao Science and Technology Development Fund(FDCT)for funding(No.0013/2024/RIB1)the Multi-Year Research Grant(MYRG)from University of Macao(Nos.MYRG-GRG2023-00140-IAPME-UMDF and MYRG-GRG2024-00206-IAPME)
文摘Kirkendall voids(KVs)at the Cu/Sn interface are a typical failure in integrated circuits,leading to solder joint cracking and electrical disconnection.Although the formation of KVs has been attributed to the difference in atomic diffusion rates at the Cu/Sn interface,the role of Cu intrinsic"quality"parameters(crystal defects)in this process remains unclear.This work systematically investigated the effects of Cu crystal defects on KVs:Cu substrates with different lattice defects and grain boundaries were prepared using proprietary electrodeposition additives,and the number of defects was quantitatively characterized by micro-strain,geometric dislocation density,and geometric phase analysis.The thermal aging experiments further showed that the formation of intermetallic compounds and KVs was related to crystal defect energy.When the grain boundary energy was higher than the lattice energy,the additional driving force resulted in short-circuit diffusion,causing local Cu depletion and voids.The lowcrystal-defect samples maintained the local Cu/Sn interdiffusion equilibrium,resulting in fewer voids after 1000 h.This study emphasizes that regulating the crystal defects can reduce KVs and provides a new insight for improving the integrated solder joint's reliability.
基金financially supported by the National Natural Science Foundation of China(No.52075072)the Provincial Applied Basic Research Program of Liaoning Provincial Department of Science and Technology(No.2023JH2/101300181)the Key R&D Program of Shandong Province,China(No.2022CXGC020408)。
文摘Technological advancements and the emphasis on reducing the use of hazardous materials,such as Pb,have led to the widely use of Sn-based Pb-free solder in advanced packaging technology.With the miniaturization of solder joints,Sn-based micro solder joints often contain single or limitedβ-Sn grains.The strong anisotropy ofβ-Sn,which is significantly correlated with the reliability of the micro solder joints during service,requires the development of methods for controlling the orientations of theseβ-Sn grains.In this review,we focus on the anisotropy of theβ-Sn grains in micro solder joints and the interactions betweenβ-Sn grain orientation and reliability issues concerning electromigration(EM),thermomigration(TM),EM+TM,corrosion process,tensile and shear creep behavior,thermal cycling(TC)and cryogenic temperature.Furthermore,we summarize the strategies for controlling theβ-Sn orientation in micro solder joints.The methods include changing the solder joint size and composition,adding additives,nucleating on specific substrates and interfacial intermetallic compounds,with the aid of external loads during solidification process and introducing heredity effect of theβ-Sn texture during multi-reflow.Finally,the{101}and{301}twinning models with∼60°rotations about a common〈100〉are adopted to explain the mechanism ofβ-Sn grain nucleation and morphology.The shortcomings of the existing methods and the further potential for the development in the field are discussed to promote the application of Pb-free solders in advanced packaging.
基金support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216).
文摘Combining Mg and Al dissimilar metals further reduces structural weight,but the formation of intermetallic compounds(IMCs)affectsAl/Mg joint properties.To prevent IMCs,a Ni-Al_(2)O_(3)composite coating was pre-plated on the Mg alloy substrate,and then Sn_(3.0)Ag_(0.5)Cu(SAC 305)solder was utilized to facilitate the joining of AZ31 Mg/6061 Al through ultrasonic-assisted soldering.We investigated the impactof Al_(2)O_(3)nano sol content in the coating on microstructure evolution,IMCs formation,and mechanical properties.Results indicated that theNi-Al_(2)O_(3)composite coating effectively suppressed the Mg-Sn reaction,thereby preventing the formation of Mg_(2)Sn IMC and significantlyenhancing joint strength.In joints with a Ni-Al_(2)O_(3)composite coating containing 50 mL/L Al_(2)O_(3)nano sol,no Mg_(2)Sn IMC was detectedafter 50 min of holding at 260℃,achieving a maximum shear strength of approximately 67.2 MPa.Increasing the Al_(2)O_(3)concentrationfurther expanded the soldering process window.For the joint with Ni-Al_(2)O_(3)(100 mL/L Al_(2)O_(3)nano sol)composite coating held at 260℃for 70 min,the coating was dissolved to a thickness of about 5.8μm,but no Mg_(2)Sn IMC was observed.The Ni-based solid solution formednear the coating/solder interface was strengthened,leading to fractures occurring within the SAC solder,and the maximum shear strengthfurther increased to 73.9 MPa.The strengthening mechanism of the joints facilitated by using the Ni-Al_(2)O_(3)composite coating was revealedby comparing with pure Ni-assisted joints.Therefore,employing a Ni-Al_(2)O_(3)composite coating as a barrier layer represents a promisingstrategy for inhibiting IMC formation during the joining of dissimilar metals.
基金Projects(51075104,50975054) supported by the National Natural Science Foundation of ChinaProject(2010RFQXG020) supported by the Harbin Excellence Talents Program,China
文摘Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.
基金Project(51004039)supported by the National Natural Science Foundation of ChinaProject(2012713)supported by the Cooperation Promoting Foundation in Science and Technology of Shaoxing City,China
文摘The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.
基金Projects(51475072,51171036)supported by the National Natural Science Foundation of China
文摘To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.
基金the Natural Science Foundation of Jiangsu Province(BK2006723)the China Postdoc-toral Science Foundation(20060400282)~~
文摘The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.
基金Project (CDJRC10130011) supported by the Fundamental Research Funds for the Central Universities, China
文摘The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.
基金Project(50675234)supported by the National Natural Science Foundation of China
文摘The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.
基金Project supported by Provincial Key Lab of Advanced Welding Technology Foundation(JSAWS-11-03)the Xuzhou Normal University Foundation(11XLR16)Natural Science Foundation of Jiangsu Province(BK2012144)
文摘The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders, 0-0.5 wt.% of rare earth Er was added to the base alloys, and the microstructures were studied. Results showed that the addition of rare earth Er could enhance the wettability of SnZn solders, with 0.08%Er addition, the spreading area gavc an 19.1% increase. And based on the mechanical testing, it was found that the tensile force and shear force of SnZn-xEr solder joints could be improved significantly. Moreover, the oxidation resistance of SnZn0.08Er solder was better than that of SnZn solder, in addition, it was found that trace amounts of rare earth Er could refine the microstructures of SnZn solders, espe- cially for Zn-rich phases, and excessive amount of rare earth Er led to a coarse microstructure.
文摘Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.
