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Mechanism of Reverse Snapback on I-V Characteristics of Power SITHs with Buried Gate Structure 被引量:1
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作者 王永顺 李海蓉 +1 位作者 吴蓉 李思渊 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第3期461-466,共6页
The reverse snapback phenomena (RSP) on I-V characteristics of static induction thyristors (SITH) are physically researched. The I-V curves of the power SITH exhibit reverse snapback phenomena, and even turn to th... The reverse snapback phenomena (RSP) on I-V characteristics of static induction thyristors (SITH) are physically researched. The I-V curves of the power SITH exhibit reverse snapback phenomena, and even turn to the conducting-state,when the anode voltage in the forward blocking-state is increased to a critical value. The RSP I-V characteristics of the power SITH are analyzed in terms of operating mechanism, double carrier injection effect, space charge effect, electron-hole plasma in the channel, and the variation in carrier lifetime. The reverse snapback mechanism is theoretically pro- posed and the mathematical expressions to calculate the voltage and current values at the snapback point are presented. The computing results are compared with the experiment values. 展开更多
关键词 power static induction thyristor reverse snapback electron-hole plasma LIFETIME injection level
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Effect of Snapback Stress on Gate Oxide Integrity of nMOSFET in 90nm Technology
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作者 朱志炜 郝跃 马晓华 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第3期349-354,共6页
By measurement,we investigate the characteristics and location of gate oxide damage induced by snapback stress. The damage incurred during stress causes device degradation that follows an approximate power law with st... By measurement,we investigate the characteristics and location of gate oxide damage induced by snapback stress. The damage incurred during stress causes device degradation that follows an approximate power law with stress time. Oxide traps generated by stress will cause the increase of stress-induced leakage current and the decrease of Qbd (charge to breakdown),and it may also cause the degradation of off-state drain leakage current. Stress-induced gate oxide damage is located not only in the drain side but also in the source side. The tertiary electrons generated by hot holes move toward Si-SiO2 interface under the electrical field toward the substrate,which explains the source side gate oxide damage. 展开更多
关键词 snapback breakdown tertiary electron SILC charge to breakdown oxide trap
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A snapback suppressed reverse-conducting IGBT with uniform temperature distribution 被引量:2
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作者 刘念 罗小光 章毛连 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第1期513-518,共6页
A novel reverse-conducting insulated-gate bipolar transistor (RC-IGBT) featuring a floating P-plug is proposed. The P-plug is embedded in the n-buffer layer to obstruct the electron current from flowing directly to ... A novel reverse-conducting insulated-gate bipolar transistor (RC-IGBT) featuring a floating P-plug is proposed. The P-plug is embedded in the n-buffer layer to obstruct the electron current from flowing directly to the n-collector, which achieves the hole emission from the p-collector at a small collector size and suppresses the snapback effectively. More- over, the current is uniformly distributed in the whole wafer at both IGBT mode and diode mode, which ensures the high temperature reliability of the RC-IGBT. Additionally, the P-plug acts as the base of the N-buffer/P-float/N-buffer transistor, which can be activated to extract the excessive carriers at the turn-off process. As the the simulation results show, for the proposed RC-IGBT, it achieves almost snapback-free output characteristics with a uniform current density and a uniform temperature distribution, which can greatly increase the reliability of the device. 展开更多
关键词 reverse-conducting insulated-gate BIPOLAR transistor snapback temperature reliability
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NMOS管Snapback特性ESD仿真模型研究
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作者 高国平 蒋婷 +1 位作者 韩兆芳 孙云华 《电子与封装》 2012年第3期36-40,共5页
随着集成电路特征尺寸的不断缩小,ESD的问题始终困扰着芯片设计师们。文章提出了一种宏模型用于ESD的snapback仿真,它包含一个MOS管、一个NPN晶体管和一个衬底电阻,没有外部的电流源。简化的宏模型没有必要使用行为级的语言,如Verilog-A... 随着集成电路特征尺寸的不断缩小,ESD的问题始终困扰着芯片设计师们。文章提出了一种宏模型用于ESD的snapback仿真,它包含一个MOS管、一个NPN晶体管和一个衬底电阻,没有外部的电流源。简化的宏模型没有必要使用行为级的语言,如Verilog-A、VHDL-A。这使得仿真速度和收敛性得到提高。同时比较了三种先进的BJT模型:VBIC、Mextram、HICUM。模型参数可以通过模型参数提取软件(BSIMProPlus、ICCAP等)提取。 展开更多
关键词 NMOS snapback ESD 模型 HICUM Mextram VBIC
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A snapback-free TOL-RC-LIGBT with vertical P-collector and N-buffer design
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作者 Weizhong Chen Yao Huang +2 位作者 Lijun He Zhengsheng Han Yi Huang 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第8期627-632,共6页
A reverse-conducting lateral insulated-gate bipolar transistor (NI.2-LltJlS|) with a trench oxide layer (IUL), teaturlng a vertical N-buffer and P-collector is proposed. Firstly, the TOL enhances both of the surf... A reverse-conducting lateral insulated-gate bipolar transistor (NI.2-LltJlS|) with a trench oxide layer (IUL), teaturlng a vertical N-buffer and P-collector is proposed. Firstly, the TOL enhances both of the surface and bulk electric fields of the N-drift region, thus the breakdown voltage (BV) is improved. Secondly, the vertical N-buffer layer increases the voltage drop VpN of the P-collector/N-buffer junction, thus the snapback is suppressed. Thirdly, the P-body and the vertical N-buffer act as the anode and the cathode, respectively, to conduct the reverse current, thus the inner diode is integrated. As shown by the simulation results, the proposed RC-LIGBT exhibits trapezoidal electric field distribution with BV of 342.4 V, which is increased by nearly 340% compared to the conventional RC-LIGBT with triangular electric fields of 100.2 V. Moreover, the snapback is eliminated by the vertical N-buffer layer design, thus the reliability of the device is improved. 展开更多
关键词 reverse-conducting lateral insulated-gate bipolar transistor (RC-LIGBT) breakdown voltage snapback phenomenon
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Snapback-free shorted anode LIGBT with controlled anode barrier and resistance
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作者 Shun Li Jin-Sha Zhang +3 位作者 Wei-Zhong Chen Yao Huang Li-Jun He Yi Huang 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第2期557-562,共6页
A novel shorted anode lateral-insulated gate bipolar transistor(SA LIGBT)with snapback-free characteristic is proposed and investigated.The device features a controlled barrier V_(barrier)and resistance R_(SA)in anode... A novel shorted anode lateral-insulated gate bipolar transistor(SA LIGBT)with snapback-free characteristic is proposed and investigated.The device features a controlled barrier V_(barrier)and resistance R_(SA)in anode,named CBR LIGBT.The electron barrier is formed by the P-float/N-buffer junction,while the anode resistance includes the polysilicon layer and N-float.At forward conduction stage,the V_(barrier)and R_(SA)can be increased by adjusting the doping of the P-float and polysilicon layer,respectively,which can suppress the unipolar mode to eliminate the snapback.At turn-off stage,the low-resistance extraction path(N-buffer/P-float/polysilicon layer/N-float)can quickly extract the electrons in the N-drift,which can effectively accelerate the turn-off speed of the device.The simulation results show that at the same V_(on) of 1.3 V,the E_(off)of the CBR LIGBT is reduced by 85%,73%,and 59.6%compared with the SSA LIGBT,conventional LIGBT,and TSA LIGBT,respectively.Additionally,at the same Eoffof 1.5 m J/cm^(2),the CBR LIGBT achieves the lowest V_(on) of 1.1 V compared with the other LIGBTs. 展开更多
关键词 shorted anode lateral-insulated gate bipolar transistor snapback BARRIER trade-off
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Application of Snapback Chronometry Method in Calculation of Regulation
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作者 Ivan Marovie Elvis Zic Nikga Jajac 《Journal of Civil Engineering and Architecture》 2011年第3期273-277,共5页
Work study is an area of construction production rationalization in which with scientific, logical, holistic and system analysis methods of the process we gain optimum in way of work and time of work. Chronometry meth... Work study is an area of construction production rationalization in which with scientific, logical, holistic and system analysis methods of the process we gain optimum in way of work and time of work. Chronometry method is one of the work study methods which is appropriate for recording shorter cyclic processes and is based on statistical sampling theory. Determination of cyclic times and work performances of standard cyclic construction machines (SCCM) is one of key assumptions of dynamic planning of machine work on every construction site. Calculation methods of SCCM work performances arc one of basic research objects in the field of construction organization and technology. Study shows applied chronometry method in work of standard cyclic construction machine. Goal of this study is to accomplish regulation through measured time cycle and compare measured effects with effects obtained with standard methodology of calculating hydraulic excavator practical achievement for gaining regulation in order to determine main reasons which effect work performance on site. 展开更多
关键词 Work study work performance snapback chronometry method standard cyclic construction machine (SCCM) regulation.
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半超结抑制RC-TIGBT Snapback效应机理与仿真
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作者 陆素先 向超 +1 位作者 王森 钟传杰 《微电子学》 CAS 北大核心 2019年第4期563-567,共5页
首次对半超结RC-TIGBT与传统RC-TIGBT的正向导通机理进行了比较研究。通过Silvaco TCAD软件仿真,模拟研究了Ydrift值、P-集电区宽度与N+短路区宽度等关键参数对Snapback效应的影响。结果表明,回退电压点随着Ydrift的减小而减小,且与Ydr... 首次对半超结RC-TIGBT与传统RC-TIGBT的正向导通机理进行了比较研究。通过Silvaco TCAD软件仿真,模拟研究了Ydrift值、P-集电区宽度与N+短路区宽度等关键参数对Snapback效应的影响。结果表明,回退电压点随着Ydrift的减小而减小,且与Ydrift呈线性关系。对于底部集电极尺寸而言,回退电压点与P-集电区宽度有关,与N+短路区宽度基本无关。基于仿真结果,给出半超结RC-TIGBT的等效电路,并详细分析了半超结技术能抑制Snapback效应的原因。最后,对半超结RC-TIGBT的结构参数进行设计,提出一种能减小Snapback效应的有效方法。 展开更多
关键词 逆导IGBT 超结 负阻效应 集电极尺寸
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Snapback应力引起的90nm NMOSFET’s栅氧化层损伤研究 被引量:4
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作者 朱志炜 郝跃 +2 位作者 马晓华 曹艳荣 刘红侠 《物理学报》 SCIE EI CAS CSCD 北大核心 2007年第2期1075-1081,共7页
实验结果发现突发击穿(snapback),偏置下雪崩热空穴注入NMOSFET栅氧化层,产生界面态,同时空穴会陷落在氧化层中.由于栅氧化层很薄,陷落的空穴会与隧穿入氧化层中的电子复合形成大量中性电子陷阱,使得栅隧穿电流不断增大.这些氧化层电子... 实验结果发现突发击穿(snapback),偏置下雪崩热空穴注入NMOSFET栅氧化层,产生界面态,同时空穴会陷落在氧化层中.由于栅氧化层很薄,陷落的空穴会与隧穿入氧化层中的电子复合形成大量中性电子陷阱,使得栅隧穿电流不断增大.这些氧化层电子陷阱俘获电子后带负电,引起阈值电压增大、亚阈值电流减小.关态漏泄漏电流的退化分两个阶段:第一阶段亚阈值电流是主要成分,第二阶段栅电流是主要成分.在预加热电子(HE)应力后,HE产生的界面陷阱在snapback应力期间可以屏蔽雪崩热空穴注入栅氧化层,使器件snapback开态和关态特性退化变小. 展开更多
关键词 突发击穿 软击穿 应力引起的泄漏电流 热电子应力
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Influence of layout parameters on snapback characteristic for a gate-grounded NMOS device in 0.13-μm silicide CMOS technology 被引量:4
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作者 姜玉稀 李娇 +2 位作者 冉峰 曹家麟 杨殿雄 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第8期82-89,共8页
Gate-grounded NMOS (GGNMOS) devices with different device dimensions and layout floorplans have been designed and fabricated in 0.13-μm silicide CMOS technology. The snapback characteristics of these GGN-MOS device... Gate-grounded NMOS (GGNMOS) devices with different device dimensions and layout floorplans have been designed and fabricated in 0.13-μm silicide CMOS technology. The snapback characteristics of these GGN-MOS devices are measured using the transmission line pulsing (TLP) measurement technique. The relationships between snapback parameters and layout parameters are shown and analyzed. A TCAD device simulator is used to explain these relationships. From these results, the circuit designer can predict the behavior of the GGNMOS devices under high ESD current stress, and design area-efficient ESD protection circuits to sustain the required ESD level. Optimized layout rules for ESD protection in 0.13-μm silicide CMOS technology are also presented. 展开更多
关键词 electrostatic discharge gate-grounded NMOS snapback characteristic layout parameters
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ESD robustness studies on the double snapback characteristics of an LDMOS with an embedded SCR 被引量:3
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作者 蒋苓利 张波 +2 位作者 樊航 乔明 李肇基 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第9期34-37,共4页
Criterion for the second snapback of an LDMOS with an embedded SCR is given based on parasitic parameter analysis.According to this criterion,three typical structures are compared by numerical simulation and structura... Criterion for the second snapback of an LDMOS with an embedded SCR is given based on parasitic parameter analysis.According to this criterion,three typical structures are compared by numerical simulation and structural parameters which influence the second snapback are also analyzed to optimize the ESD characteristics. Experimental data showed that,as the second snapback voltage decreased from 25.4 to 8.1 V,the discharge ability of the optimized structure increased from 0.57 to 3.1 A. 展开更多
关键词 ESD LDMOS SCR double snapback
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Theoretical calculation of the p-emitter length for snapback-free reverse-conducting IGBT 被引量:2
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作者 朱利恒 陈星弼 《Journal of Semiconductors》 EI CAS CSCD 2014年第6期62-66,共5页
A physically based equation for predicting required p-emitter length of a snapback-free reverse- conducting insulated gate bipolar transistor (RC-IGBT) with field-stop structure is proposed. The n-buffer resis- tanc... A physically based equation for predicting required p-emitter length of a snapback-free reverse- conducting insulated gate bipolar transistor (RC-IGBT) with field-stop structure is proposed. The n-buffer resis- tances above the p-emitter region with anode geometries of linear strip, circular and annular type are calculated, and based on this, the minimum p-emitter lengths of those three geometries are given and verified by simulation. It is found that good agreement was achieved between the numerical calculation and simulation results. Moreover, the calculation results show that the annular case needs the shortest p-emitter length for RC-IGBT to be snapback-free. 展开更多
关键词 reverse conducting insulated gate bipolar transistor voltage snapback
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具有埋层结构的1200 V复合场板VLD型终端设计
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作者 邱志勇 冯全源 刘琪琪 《微电子学》 北大核心 2025年第3期481-487,共7页
对于大功率IGBT器件而言,结终端的设计是至关重要的,它影响着器件的击穿电压和可靠性。为了提高IGBT器件的整体耐压及稳定性,设计了一种基于埋层(BL)和复合场板(muti-FP)的新型横向变掺杂(VLD)终端结构。通过优化VLD区注入剂量、埋层JT... 对于大功率IGBT器件而言,结终端的设计是至关重要的,它影响着器件的击穿电压和可靠性。为了提高IGBT器件的整体耐压及稳定性,设计了一种基于埋层(BL)和复合场板(muti-FP)的新型横向变掺杂(VLD)终端结构。通过优化VLD区注入剂量、埋层JTE注入剂量、金属场板长度等结构参数,分析了击穿电压的变化关系。改善了终端结构的体内电场分布,提高了器件的耐压及雪崩鲁棒性。最终在340μm的终端长度上实现了1650 V的击穿电压,表面最大电场为1.64×10^(5)V/cm,小于工业界判断器件击穿的最大表面电场值(2.5×10^(5)V/cm)。此外,设计的终端结构在过电压状态下未出现snapback现象,并在后雪崩状态下,先呈现正微分电阻(PDR)状态,具有良好的雪崩鲁棒性。 展开更多
关键词 IGBT VLD 复合场板 雪崩鲁棒性 snapback 正微分电阻
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LDD-CMOS中ESD及其相关机理 被引量:11
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作者 马巍 郝跃 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第8期892-896,共5页
LDD工艺是CMOS集成电路进入亚微米后应用最广泛的技术 ,该技术很好地改善了沟道电场分布 ,避免了在器件漏端的强场效应 ,在可靠性方面明显地提高器件及电路的热载流子寿命 .然而 ,LDD结构的抗ESD的能力却大大降低了 .文中通过实验和分... LDD工艺是CMOS集成电路进入亚微米后应用最广泛的技术 ,该技术很好地改善了沟道电场分布 ,避免了在器件漏端的强场效应 ,在可靠性方面明显地提高器件及电路的热载流子寿命 .然而 ,LDD结构的抗ESD的能力却大大降低了 .文中通过实验和分析 ,研究了在ESD过程中 ,LDDgg nMOS器件的Snapback对器件潜在损伤的影响 。 展开更多
关键词 LDD—CMOS ESD潜在损伤 snapback
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具有高K背栅的无电压回跳RC-IGBT静态特性研究
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作者 王楠 徐勇根 胡夏融 《现代电子技术》 北大核心 2025年第4期34-39,共6页
针对传统RC-IGBT导通压降大、击穿电压低等问题,提出一种具有高介电常数(高K)背栅的RC-IGBT器件结构,其特点是位于底部集电极的背栅介质采用高介电常数材料。高K介质增大了正向导通时背栅周围的空穴浓度,不仅消除了电压回跳,还降低了导... 针对传统RC-IGBT导通压降大、击穿电压低等问题,提出一种具有高介电常数(高K)背栅的RC-IGBT器件结构,其特点是位于底部集电极的背栅介质采用高介电常数材料。高K介质增大了正向导通时背栅周围的空穴浓度,不仅消除了电压回跳,还降低了导通压降。仿真结果表明:在高正向导通电流密度下(I_(CE)=925 A/cm^(2)),高K背栅RC-IGBT的导通压降为1.71 V,相比传统RC-IGBT降低了19.34%,相比氧化层背栅RC-IGBT降低了13.20%;另一方面,在阻断状态下,高K介质增强了背栅周围的电子积累,增大了击穿电压。高K背栅RC-IGBT的击穿电压为1 312 V,相较于氧化层背栅RC-IGBT提高了44.18%。此外,高K背栅RC-IGBT的反向导通压降相比传统RC-IGBT降低了43.43%,相比氧化层背栅RC-IGBT降低了13.85%。将所提出的高K背栅的RC-IGBT应用于高压、大功率的电子电力系统,可提高系统的可靠性并降低损耗。 展开更多
关键词 RC-IGBT 电压回跳 高介电常数 背栅 导通压降 阻断特性
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基于多电压域芯片的静电防护架构及其电路设计
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作者 周剑飞 关忠旭 +2 位作者 包呼日查 李林男 赵毅 《汽车实用技术》 2025年第15期80-84,共5页
在高压域和低压域功能模块共存的产品中,静电放电防护架构需要得到更加全面的考虑,做好各种可能路径的静电泄放尤为重要。该文章基于绝缘体上硅(SOI)工艺下的一款芯片的实际设计方案,对多电压域共存情况的静电防护做出了设计架构的阐述... 在高压域和低压域功能模块共存的产品中,静电放电防护架构需要得到更加全面的考虑,做好各种可能路径的静电泄放尤为重要。该文章基于绝缘体上硅(SOI)工艺下的一款芯片的实际设计方案,对多电压域共存情况的静电防护做出了设计架构的阐述,详细介绍各模块防护电路泄放路径及传输线脉冲(TLP)发生器参数配置,实际样品通过了需求的静电测试标准。这对类似开发需求背景下的新产品研发具有重要的参考意义。 展开更多
关键词 低压域 高压域 静电放电防护 GGNMOS GDPMOS 滞回特性电路
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基于高分辨率熔解分析的基因分型新技术 被引量:3
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作者 李菲菲 尤崇革 《现代检验医学杂志》 CAS 2011年第6期159-161,共3页
目的 综述基于高分辨熔解分析(HRM)的基因分型新技术.方法 介绍无标记探针、弹回引物、隐蔽探针、温度开关PCR、等位基因特异延伸PCR和低变性温度下共扩增PCR等技术的基本原理并评价其适用性.结果 这些新技术不仅避免了产物污染,提高... 目的 综述基于高分辨熔解分析(HRM)的基因分型新技术.方法 介绍无标记探针、弹回引物、隐蔽探针、温度开关PCR、等位基因特异延伸PCR和低变性温度下共扩增PCR等技术的基本原理并评价其适用性.结果 这些新技术不仅避免了产物污染,提高了HRM基因分型的准确性和敏感度,而且拓展了HRM的应用范围.结论 基于HRM的基因分型新技术有望成为临床分子诊断的新方法. 展开更多
关键词 高分辨熔解 无标记探针 弹回引物 隐蔽探针 温度开关PCR
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氧化槽隔离型RC-IGBT的设计与仿真 被引量:1
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作者 马丽 李伟 +3 位作者 李佳豪 谢加强 康源 王馨梅 《固体电子学研究与进展》 CSCD 北大核心 2017年第3期195-200,共6页
提出了一种新型的RC-IGBT器件,相比于常规RC-IGBT,新型的RC-IGBT在集电极侧引入了一个类似于栅极的多晶硅沟槽结构,不同之处是沟槽底部结构没有氧化层将多晶硅与硅体区相隔离,于是可将此重掺杂的多晶硅区作为新型的RC-IGBT的集电极的N+... 提出了一种新型的RC-IGBT器件,相比于常规RC-IGBT,新型的RC-IGBT在集电极侧引入了一个类似于栅极的多晶硅沟槽结构,不同之处是沟槽底部结构没有氧化层将多晶硅与硅体区相隔离,于是可将此重掺杂的多晶硅区作为新型的RC-IGBT的集电极的N+短路区,故称为TO-RC-IGBT(Trench oxide reverse conducting IGBT)。由于集电极P+阳极层与N+短路区之间的氧化层隔离,TO-RC-IGBT并未出现常规RC-IGBT导通时的回跳现象。为了避免产生回跳现象,常规RC-IGBT的元胞宽度通常达数百微米,而TO-RC-IGBT元胞宽度只有20μm,因而TO-RC-IGBT不会出现常规RC-IGBT的反向电流分布不均匀的问题。 展开更多
关键词 逆导型绝缘栅双极场效应晶体管 回跳现象 器件仿真
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完备度量空间中离散动力系统的混沌(英文)
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作者 翟红利 林亚静 孙波 《湖南文理学院学报(自然科学版)》 CAS 2012年第1期1-4,共4页
考虑度量空间中离散动力系统的混沌,改进了两条现有判据,证明了当一个系统有正则退化snap backrepeller时拓扑共轭于符号动力系统.
关键词 度量空间 离散动力系统 混沌 snapback REPELLER
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A 4H-SiC merged P–I–N Schottky with floating back-to-back diode 被引量:2
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作者 Wei-Zhong Chen Hai-Feng Qin +3 位作者 Feng Xu Li-Xiang Wang Yi Huang Zheng-Sheng Han 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第2期660-664,共5页
A novel 4 H-Si C merged P–I–N Schottky(MPS)with floating back-to-back diode(FBD),named FBD-MPS,is proposed and investigated by the Sentaurus technology computer-aided design(TCAD)and analytical model.The FBD feature... A novel 4 H-Si C merged P–I–N Schottky(MPS)with floating back-to-back diode(FBD),named FBD-MPS,is proposed and investigated by the Sentaurus technology computer-aided design(TCAD)and analytical model.The FBD features a trench oxide and floating P-shield,which is inserted between the P+/N-(PN)junction and Schottky junction to eliminate the shorted anode effect.The FBD is formed by the N-drift/P-shield/N-drift and it separates the PN and Schottky active region independently.The FBD reduces not only the Vturn to suppress the snapback effect but also the Von at bipolar operation.The results show that the snapback can be completely eliminated,and the maximum electric field(Emax)is shifted from the Schottky junction to the FBD in the breakdown state. 展开更多
关键词 4H-SIC merged P-I-N Schottky(MPS) snapback effect turnover voltage floating back-to-back diode(FBD)
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