期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
数据中心光模块技术及演进 被引量:5
1
作者 张平化 王会涛 付志明 《中兴通讯技术》 北大核心 2024年第1期89-98,共10页
算力需求提升带动网络带宽成倍增加,数据中心能耗呈指数型增长。针对低功耗、高带宽的技术需求,硅光、共封装光学(CPO)等技术有望成为长期解决方案。硅光芯片采用光互联,叠加CPO技术,将光引擎与交换芯片共同封装,在速率提高的同时大大... 算力需求提升带动网络带宽成倍增加,数据中心能耗呈指数型增长。针对低功耗、高带宽的技术需求,硅光、共封装光学(CPO)等技术有望成为长期解决方案。硅光芯片采用光互联,叠加CPO技术,将光引擎与交换芯片共同封装,在速率提高的同时大大缩减功耗。液冷技术、线性驱动可插拨光模块(LPO)、相干技术及薄膜铌酸锂等技术成为光模块优化主要新趋势。LPO在高线性度跨阻放大器(TIA)/驱动芯片厂商大力推动下或可快速落地。相干精简版解决方案在数据中心2km以内传输距离方面有竞争优势。 展开更多
关键词 硅光 CPO LPO 薄膜铌酸锂
在线阅读 下载PDF
Micro-transfer printing of O-band InAs/GaAs quantum-dot SOAs on silicon photonic integrated circuits 被引量:1
2
作者 YANG LIU JING ZHANG +11 位作者 LAURENS BOGAERT EMADREZA SOLTANIAN EVANGELIA DELLI KONSTANTIN MOROZOV SERGEY MIKHRIN JOHANNA RIMBÖCK GUY LEPAGE PETER VERHEYEN JORIS VAN CAMPENHOUT PETER OSSIEUR GEERT MORTHIER GUNTHER ROELKENS 《Photonics Research》 2025年第5期1341-1352,共12页
Silicon photonics(SiPh)technology has become a key platform for developing photonic integrated circuits due to its CMOS compatibility and scalable manufacturing.However,integrating efficient on-chip optical sources an... Silicon photonics(SiPh)technology has become a key platform for developing photonic integrated circuits due to its CMOS compatibility and scalable manufacturing.However,integrating efficient on-chip optical sources and in-line amplifiers remains challenging due to silicon’s indirect bandgap.In this study,we developed prefabricated standardized InAs/GaAs quantum-dot(QD)active devices optimized for micro-transfer printing and successfully integrated them on SiPh integrated circuits.By transfer-printing standardized QD devices onto specific regions of the SiPh chip,we realized O-band semiconductor optical amplifiers(SOAs),distributed feedback(DFB)lasers,and widely tunable lasers(TLs).The SOAs reached an on-chip gain of 7.5 dB at 1299 nm and maintained stable performance across a wide input power range.The integrated DFB lasers achieved waveguide(WG)-coupled output powers of up to 19.7 mW,with a side-mode suppression ratio(SMSR)of 33.3 dB,and demonstrated notable robustness against optical feedback,supporting error-free data rates of 30 Gbps without additional isolators.Meanwhile,the TLs demonstrated a wavelength tuning range exceeding 35 nm,and a WG-coupled output power greater than 3 m W.The micro-transfer printing approach effectively decouples the fabrication of non-native devices from the SiPh process,allowing back-end integration of the Ⅲ–Ⅴ devices.Our approach offers a viable path toward fully integrated Ⅲ–Ⅴ/ SiPh platforms capable of supporting high-speed,high-capacity communication. 展开更多
关键词 integrated optical sources photonic integrated circuits SOAs o band silicon photonics siph technology InAs GaAs quantum dot integrated circuitsby micro transfer printing
原文传递
上一页 1 下一页 到第
使用帮助 返回顶部