Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits,flexible wearables,and individual automobile requirements.However,traditional 3D printing technology still struggles...Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits,flexible wearables,and individual automobile requirements.However,traditional 3D printing technology still struggles to meet the demands of high precision and high efficiency in the process of fabricating a curved surface circuit,particularly achieving precise silver circuit molding on irregular substrates.Here,a high-precision and muti-scaled conformal manufacturing method for silver circuits is presented through the digital light processing(DLP)of ultraviolet-curable silver paste(UV-SP)with adjustable photocuring properties,enabling the successful preparation of micro-scaled conductive structure on the sharply skewed hook face.The minimum modeling depth and width of the cured silver paste can be well controlled to 10 and 88µm,respectively.Compared with traditional printing technology,the printing efficiency of complex patterns has increased by over 70%.The printed silver circuit demonstrates an exceptionally high electrical conductivity,reaching as high as 1.16×10^(7) S/m.Additionally,the UV-SP exhibits significant manufacturing efficiency and superior molding resolution compared to conventional direct ink writing and inkjet printing techniques,thereby contributing to the attainment of high precision and efficiency of conformal and micro-molding manufacturing in sensors,communication antennas,and other electronic devices based on curved substrates.展开更多
The traditional hermetic packaging methods,which require high temperatures and high voltages,would have adverse effects on electronics devices.Based on current-assisted sintering technology,we proposed a new hermetic ...The traditional hermetic packaging methods,which require high temperatures and high voltages,would have adverse effects on electronics devices.Based on current-assisted sintering technology,we proposed a new hermetic packaging method using silver paste.Comparing the microstructure of the joints sintered with different currents,we found that with the increasing sintering current from 4.7 kA to 5.3 kA,the density of the joint increases,which improves the hermeticity and bonding strength of the joints.The results of thermal cycling tests showed that the sealing joints sintered at 4.7 kA with larger porosity are more prone to fail because pores tend to be sources of defects under thermal cycling.After 250 ℃ high thermal storage,there is the coarsening of the pores and the delamination near the Ag/Au interface,degrading the sealing performance of the sintered joint.Besides,the sealing joints sintered at 5.3 kA exhibit superior reliability when exposed to high temperatures.展开更多
The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low...The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.展开更多
In order to prove that the Te-based glass frit could be applied to Ag pastes to fabricate Ag electrode and elucidate the reactions among Ag,the frit,and the Si wafer,the Te-based glass and Ag pastes with different con...In order to prove that the Te-based glass frit could be applied to Ag pastes to fabricate Ag electrode and elucidate the reactions among Ag,the frit,and the Si wafer,the Te-based glass and Ag pastes with different contents of glass frit(0 wt%,1 wt%,3 wt%,5 wt%,and 7 wt%)were prepared.The microstructures of Ag electrodes and the phase analysis of interface between Ag electrodes and the Si wafer were investigated using scanning electron microscopy(SEM)coupled with energy-dispersive X-ray spectroscopy(EDX)and X-ray diffraction(XRD).When the content of glass frit is 3 wt%,the Ag electrode has good adhesion with Si wafer.What’s more,Ag crystallites and metallic Te could be found on the Si wafer.These results suggest that the TeO_(2) in the glass frit could react with SiNx anti-reflecting coating(ARC)and Si to serve as a medium for forming Ag crystallites.展开更多
（90-x）TeO2-xZnO-lOBi203 （x = 15, 17.5, 20 and 22.5, in mol%） and 70TeOz-2OZnO-（10-y）Bi2O3-y Na2O （y = 1, 3, 5, 7, and 10, in mol%） glasses, and the corresponding Ag paste were prepared in order to prove that t...（90-x）TeO2-xZnO-lOBi203 （x = 15, 17.5, 20 and 22.5, in mol%） and 70TeOz-2OZnO-（10-y）Bi2O3-y Na2O （y = 1, 3, 5, 7, and 10, in mol%） glasses, and the corresponding Ag paste were prepared in order to prove that the Te-based glass frit could be applied to Ag pastes to fabricate Ag electrode. The relationship between structure and properties of the glasses was analyzed. The effects of glass frit on the microstructure, adhesion force, and resistivity of the Ag electrode were studied. The microstructure of Ag electrodes and the phase analysis of interface between Ag electrodes and the Si wafer were investigated using SEM and XRD. Finally, the 70TeO2-20ZnO-5Bi2O3-5Na2O glass showed better performance in the paste. What is more, Ag crystallites could be found on the Si wafer. These results suggested that the Te-based glass frit could react with SiNx anti-reflecting coating and Si to serve as a medium for forming Ag crystallites.展开更多
Wearable gas sensors can improve early warning provision for workers in special worksites and can also be used as flexible electronic platforms.Here,the flexible multifunctional gas sensor was prepared by grafting gra...Wearable gas sensors can improve early warning provision for workers in special worksites and can also be used as flexible electronic platforms.Here,the flexible multifunctional gas sensor was prepared by grafting graphene oxide(GO)-Ag onto cotton fabric after swelling.The maximum bacterial inhibition rate of GO-150/cotton fabric was 95.6%for E.coli and 87.6%for S.aureus,while retaining the original high moisture permeability of cotton fabric.So GO/cotton fabric can resist the multiplication of bacteria.At the same time,GO can greatly improve the UV protection performance of cotton fabric used in garments.With increase of the GO concentration,the UV protection ability of composite fabric is enhanced.Finally,GO-Ag/cotton fabric sensors had stable NH3 gassensitive properties and good washing stability.In conclusion,these cotton fabric sensors with antibacterial properties,UV resistance and highly sensitive gas-sensitive properties have potential applications in wearable early warning devices and textile products.展开更多
基金supported by the National Natural Science Foundation of China(Nos.51972079 and 52302062)the National Key Research and Development Program of China(Nos.2022YFB370630202 and 2022YFB3706305).
文摘Electronic 3D printing possesses a remarkable molding ability and convenience in integrated circuits,flexible wearables,and individual automobile requirements.However,traditional 3D printing technology still struggles to meet the demands of high precision and high efficiency in the process of fabricating a curved surface circuit,particularly achieving precise silver circuit molding on irregular substrates.Here,a high-precision and muti-scaled conformal manufacturing method for silver circuits is presented through the digital light processing(DLP)of ultraviolet-curable silver paste(UV-SP)with adjustable photocuring properties,enabling the successful preparation of micro-scaled conductive structure on the sharply skewed hook face.The minimum modeling depth and width of the cured silver paste can be well controlled to 10 and 88µm,respectively.Compared with traditional printing technology,the printing efficiency of complex patterns has increased by over 70%.The printed silver circuit demonstrates an exceptionally high electrical conductivity,reaching as high as 1.16×10^(7) S/m.Additionally,the UV-SP exhibits significant manufacturing efficiency and superior molding resolution compared to conventional direct ink writing and inkjet printing techniques,thereby contributing to the attainment of high precision and efficiency of conformal and micro-molding manufacturing in sensors,communication antennas,and other electronic devices based on curved substrates.
基金supported by the National High Technology Research and Development Program of China (No.2016YFB0100602)。
文摘The traditional hermetic packaging methods,which require high temperatures and high voltages,would have adverse effects on electronics devices.Based on current-assisted sintering technology,we proposed a new hermetic packaging method using silver paste.Comparing the microstructure of the joints sintered with different currents,we found that with the increasing sintering current from 4.7 kA to 5.3 kA,the density of the joint increases,which improves the hermeticity and bonding strength of the joints.The results of thermal cycling tests showed that the sealing joints sintered at 4.7 kA with larger porosity are more prone to fail because pores tend to be sources of defects under thermal cycling.After 250 ℃ high thermal storage,there is the coarsening of the pores and the delamination near the Ag/Au interface,degrading the sealing performance of the sintered joint.Besides,the sealing joints sintered at 5.3 kA exhibit superior reliability when exposed to high temperatures.
基金fund for this work was provided by the“Research on Key Technologies of Photosensitive Conductive Silver Paste Based on Domestic Circuit Protection Micro Chip Components”(Project No.BE2020008 and Supporting Author:Chen P).
文摘The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.
基金financially supported by the Guangdong Province University-Industry Cooperation Projects(No.2011B090400238)the Priority Academic Program Development of Jiangsu Higher Education Institutions(PAPD)。
文摘In order to prove that the Te-based glass frit could be applied to Ag pastes to fabricate Ag electrode and elucidate the reactions among Ag,the frit,and the Si wafer,the Te-based glass and Ag pastes with different contents of glass frit(0 wt%,1 wt%,3 wt%,5 wt%,and 7 wt%)were prepared.The microstructures of Ag electrodes and the phase analysis of interface between Ag electrodes and the Si wafer were investigated using scanning electron microscopy(SEM)coupled with energy-dispersive X-ray spectroscopy(EDX)and X-ray diffraction(XRD).When the content of glass frit is 3 wt%,the Ag electrode has good adhesion with Si wafer.What’s more,Ag crystallites and metallic Te could be found on the Si wafer.These results suggest that the TeO_(2) in the glass frit could react with SiNx anti-reflecting coating(ARC)and Si to serve as a medium for forming Ag crystallites.
基金financially supported by the Guangdong province university–industry cooperation projects (No. 2011B090400238)Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD)
文摘（90-x）TeO2-xZnO-lOBi203 （x = 15, 17.5, 20 and 22.5, in mol%） and 70TeOz-2OZnO-（10-y）Bi2O3-y Na2O （y = 1, 3, 5, 7, and 10, in mol%） glasses, and the corresponding Ag paste were prepared in order to prove that the Te-based glass frit could be applied to Ag pastes to fabricate Ag electrode. The relationship between structure and properties of the glasses was analyzed. The effects of glass frit on the microstructure, adhesion force, and resistivity of the Ag electrode were studied. The microstructure of Ag electrodes and the phase analysis of interface between Ag electrodes and the Si wafer were investigated using SEM and XRD. Finally, the 70TeO2-20ZnO-5Bi2O3-5Na2O glass showed better performance in the paste. What is more, Ag crystallites could be found on the Si wafer. These results suggested that the Te-based glass frit could react with SiNx anti-reflecting coating and Si to serve as a medium for forming Ag crystallites.
基金We thank the Scientific Research Foundation of Zhejiang Sci-Tech University(ZSTU)under Grant Nos.19082472-Y and 19012099-Y.
文摘Wearable gas sensors can improve early warning provision for workers in special worksites and can also be used as flexible electronic platforms.Here,the flexible multifunctional gas sensor was prepared by grafting graphene oxide(GO)-Ag onto cotton fabric after swelling.The maximum bacterial inhibition rate of GO-150/cotton fabric was 95.6%for E.coli and 87.6%for S.aureus,while retaining the original high moisture permeability of cotton fabric.So GO/cotton fabric can resist the multiplication of bacteria.At the same time,GO can greatly improve the UV protection performance of cotton fabric used in garments.With increase of the GO concentration,the UV protection ability of composite fabric is enhanced.Finally,GO-Ag/cotton fabric sensors had stable NH3 gassensitive properties and good washing stability.In conclusion,these cotton fabric sensors with antibacterial properties,UV resistance and highly sensitive gas-sensitive properties have potential applications in wearable early warning devices and textile products.
