Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of h...Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air,severely limiting their widespread adoption in power electronics packaging.This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands.By employing a simple solvent-cleaning process,effective control of the density of oleylamine ligands on particle surfaces was achieved,resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility.Moreover,through our research,the solvent-cleaning mechanism was clarified,a model for the oleylamine ligand decomposition was developed,the air-sintering behavior of Cu nanoparticles was analyzed,and the impacts of both the sintered bodies and interfaces on the sintering performance were explained.Additionally,Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280℃and 5 MPa in air were confirmed to be able to produce the highest shear strength(49.2±3.51 MPa)and lowest resistivity(6.15±0.32μΩ·cm).Based on these results,flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure-capacitance response over the temperature range of 25-250℃.These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles.Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current-density,high-heat-flow-density,high-temperature,and high-stress environments.展开更多
In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test stra...In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test strategy with 50 Hz unipolar DC and AC combined voltage for partial discharge(PD)at boiling interface of AlN ceramic is proposed.The insulation threshold of an AlN ceramic surface is acquired in several dielectric environments,such as air,FC-72 liquid(FC-72,a Fluorinert^(TM) from 3^(TM)),FC-72 vapor,and boiling state of FC72.This reveals the deterioration of boiling on the insulation of the surface immersed in the dielectric refrigerant.To investigate the mechanism of the PD feature at the boiling interface,the PD patterns of the unrestricted bubble and the accumulated bubble are acquired and contrastively analyzed.Combined with the feature of the back discharge and the bubble behavior,the charged vapor-ceramic interface is relatively stable due to the accumulated vapor layer.This stability of the charged vaporceramic interface is broken if the bubble is unrestricted.Besides,it is discovered that the vapor-liquid interface inside the bubble may be another charged interface,which can also trigger a back discharge.展开更多
基金supported by the Natural Science Foundation of Fujian Province(No.2022J01044)the Digital Twin and Intelligent Transportation Maintenance Engineering Research Centre of Genting Applied Technology R&D Platform at Xiamen City University.
文摘Cu nanoparticles exhibit excellent properties as high-temperature-resistant,conductive,heat-dissipating,and connecting materials.However,their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air,severely limiting their widespread adoption in power electronics packaging.This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands.By employing a simple solvent-cleaning process,effective control of the density of oleylamine ligands on particle surfaces was achieved,resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility.Moreover,through our research,the solvent-cleaning mechanism was clarified,a model for the oleylamine ligand decomposition was developed,the air-sintering behavior of Cu nanoparticles was analyzed,and the impacts of both the sintered bodies and interfaces on the sintering performance were explained.Additionally,Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280℃and 5 MPa in air were confirmed to be able to produce the highest shear strength(49.2±3.51 MPa)and lowest resistivity(6.15±0.32μΩ·cm).Based on these results,flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure-capacitance response over the temperature range of 25-250℃.These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles.Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current-density,high-heat-flow-density,high-temperature,and high-stress environments.
基金supported by the National Natural Science Foundation of China-State Grid Corporation Joint Fund for Smart Grid(No.U1766219)。
文摘In order to evaluate the insulation of two-phase immersion cooling in the HV power electronic package,the insulation degradation of the dielectric interface induced by bubbles is investigated.In this paper,a test strategy with 50 Hz unipolar DC and AC combined voltage for partial discharge(PD)at boiling interface of AlN ceramic is proposed.The insulation threshold of an AlN ceramic surface is acquired in several dielectric environments,such as air,FC-72 liquid(FC-72,a Fluorinert^(TM) from 3^(TM)),FC-72 vapor,and boiling state of FC72.This reveals the deterioration of boiling on the insulation of the surface immersed in the dielectric refrigerant.To investigate the mechanism of the PD feature at the boiling interface,the PD patterns of the unrestricted bubble and the accumulated bubble are acquired and contrastively analyzed.Combined with the feature of the back discharge and the bubble behavior,the charged vapor-ceramic interface is relatively stable due to the accumulated vapor layer.This stability of the charged vaporceramic interface is broken if the bubble is unrestricted.Besides,it is discovered that the vapor-liquid interface inside the bubble may be another charged interface,which can also trigger a back discharge.
